JPH03110848U - - Google Patents

Info

Publication number
JPH03110848U
JPH03110848U JP2076790U JP2076790U JPH03110848U JP H03110848 U JPH03110848 U JP H03110848U JP 2076790 U JP2076790 U JP 2076790U JP 2076790 U JP2076790 U JP 2076790U JP H03110848 U JPH03110848 U JP H03110848U
Authority
JP
Japan
Prior art keywords
diameter
cavity
flow path
resin flow
opening diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2076790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2076790U priority Critical patent/JPH03110848U/ja
Publication of JPH03110848U publication Critical patent/JPH03110848U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2076790U 1990-02-28 1990-02-28 Pending JPH03110848U (US20030157376A1-20030821-M00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2076790U JPH03110848U (US20030157376A1-20030821-M00001.png) 1990-02-28 1990-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2076790U JPH03110848U (US20030157376A1-20030821-M00001.png) 1990-02-28 1990-02-28

Publications (1)

Publication Number Publication Date
JPH03110848U true JPH03110848U (US20030157376A1-20030821-M00001.png) 1991-11-13

Family

ID=31523853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2076790U Pending JPH03110848U (US20030157376A1-20030821-M00001.png) 1990-02-28 1990-02-28

Country Status (1)

Country Link
JP (1) JPH03110848U (US20030157376A1-20030821-M00001.png)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122136A (ja) * 1985-11-08 1987-06-03 Hitachi Ltd レジンモールド半導体の製造方法および装置
JPS6313723A (ja) * 1986-07-04 1988-01-21 Hitachi Ltd モ−ルド金型
JPS63162208A (ja) * 1986-12-26 1988-07-05 Hitachi Ltd 成形装置
JPS63199619A (ja) * 1987-02-16 1988-08-18 Hitachi Ltd 半導体装置のためのトランスファ成形方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122136A (ja) * 1985-11-08 1987-06-03 Hitachi Ltd レジンモールド半導体の製造方法および装置
JPS6313723A (ja) * 1986-07-04 1988-01-21 Hitachi Ltd モ−ルド金型
JPS63162208A (ja) * 1986-12-26 1988-07-05 Hitachi Ltd 成形装置
JPS63199619A (ja) * 1987-02-16 1988-08-18 Hitachi Ltd 半導体装置のためのトランスファ成形方法

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