JPH03110846U - - Google Patents
Info
- Publication number
- JPH03110846U JPH03110846U JP2015990U JP2015990U JPH03110846U JP H03110846 U JPH03110846 U JP H03110846U JP 2015990 U JP2015990 U JP 2015990U JP 2015990 U JP2015990 U JP 2015990U JP H03110846 U JPH03110846 U JP H03110846U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- package
- resin molding
- flow path
- molding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図および第２図は本考案の一具体例を示す
樹脂モールド装置の縦断面図である。第３図乃至
第５図は従来の樹脂モールド装置の縦断面図、第
６図乃至第８図はクリーナの構造とその作動状態
の説明図である。
１……上金型、２……下金型、５……パツケー
ジ用キヤビテイ、１１ａ，１１ｂ，１２ａ，１２
ｂ……キヤビテイ用エジエクトピン、２４……エ
ア流路。
FIGS. 1 and 2 are longitudinal sectional views of a resin molding apparatus showing a specific example of the present invention. FIGS. 3 to 5 are vertical sectional views of a conventional resin molding device, and FIGS. 6 to 8 are explanatory diagrams of the structure of the cleaner and its operating state. 1... Upper mold, 2... Lower mold, 5... Cavity for package, 11a, 11b, 12a, 12
b...Eject pin for cavity, 24...Air flow path.
Claims (1)
を形成してなるものにおいて、 上記パツケージ用キヤビテイの上下に配設され
たエジエクトピンの周囲に、高圧エアをパツケー
ジ用キヤビテイ内に吹出させるためのエア流路を
形成したことを特徴とする樹脂モールド装置。[Scope of Claim for Utility Model Registration] In a product in which a cavity for a package is formed on the abutting surfaces of upper and lower molds, high pressure air is supplied to the cavity for the package around eject pins disposed above and below the cavity for the package. A resin molding device characterized by forming an air flow path for blowing air inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015990U JPH03110846U (en) | 1990-02-27 | 1990-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015990U JPH03110846U (en) | 1990-02-27 | 1990-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110846U true JPH03110846U (en) | 1991-11-13 |
Family
ID=31523255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015990U Pending JPH03110846U (en) | 1990-02-27 | 1990-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110846U (en) |
-
1990
- 1990-02-27 JP JP2015990U patent/JPH03110846U/ja active Pending