JPH03110767A - Water-feeding type grounding process - Google Patents
Water-feeding type grounding processInfo
- Publication number
- JPH03110767A JPH03110767A JP13753889A JP13753889A JPH03110767A JP H03110767 A JPH03110767 A JP H03110767A JP 13753889 A JP13753889 A JP 13753889A JP 13753889 A JP13753889 A JP 13753889A JP H03110767 A JPH03110767 A JP H03110767A
- Authority
- JP
- Japan
- Prior art keywords
- water
- ground plate
- grounding
- wire nets
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910000278 bentonite Inorganic materials 0.000 claims abstract description 7
- 239000000440 bentonite Substances 0.000 claims abstract description 7
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 4
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 abstract description 20
- 235000010265 sodium sulphite Nutrition 0.000 abstract description 10
- 229910001369 Brass Inorganic materials 0.000 abstract description 8
- 239000010951 brass Substances 0.000 abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 4
- 229920002554 vinyl polymer Polymers 0.000 abstract description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 239000002689 soil Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Revetment (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、配電線路の保安と事故防止のため欠くことの
できない接地工事に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to grounding work that is essential for the safety of power distribution lines and accident prevention.
接地工事で最も一般的な工法は、銅板を地中に平らに置
き、その周辺を接地抵抗低減剤で包囲する工法である。The most common method for grounding work is to place a copper plate flat in the ground and surround it with a grounding resistance reducing agent.
この工法では、接地抵抗低減剤中の有効成分の流亡によ
る接地抵抗の上昇或は、銅板の腐食による接地抵抗の増
大に伴う接地抵抗の上昇などのため、接地の補修工事が
さけられないという欠点がある。This method has the disadvantage that grounding repair work cannot be avoided due to an increase in grounding resistance due to the loss of the active ingredient in the grounding resistance reducing agent or an increase in grounding resistance due to an increase in grounding resistance due to corrosion of the copper plate. There is.
本発明は、その欠点をなくすために、銅板の周辺を還元
性と導電性を兼備する水溶液で包囲し、接地板（銅板）
の腐食を防ぐと同時に接地抵抗低減化を促進させ、接地
抵抗が上昇したときは、最初の接地抵抗に復元させるた
めに、いつでも還元性と導電性を兼備する水溶液を供給
できるように、接地板上に金網と吸水管を設備する給水
式接地工法である。In order to eliminate this drawback, the present invention surrounds the periphery of the copper plate with an aqueous solution that has both reducing and conductive properties, and the ground plate (copper plate)
At the same time as preventing corrosion of This is a water supply grounding method that installs a wire mesh and water intake pipe on top.
接地板の周辺を水溶液で包囲するためには、土壌の漏水
を抑制するため、接地板の下側に凹状のベントナイト壁
をつくる必要がある。In order to surround the ground plate with an aqueous solution, it is necessary to create a concave bentonite wall below the ground plate in order to suppress water leakage from the soil.
接地板上に水溶液を供給するためには、給水路の確保が
必須条件である。そのためには、吸水管の先端が土砂で
塞がれないように、更に接地板の表面が土砂で覆われな
いように工夫する必要がある。そのためには、接地板状
に真鍮製金網を荒目、中目、細目の順に重ねるか、カー
ボン或は銅やステンレスの切屑を使用し、粗粒、中粒、
微粒の順に重ねることにより、接地板上の水路閉塞を防
ぐ必要がある。In order to supply the aqueous solution onto the ground plate, it is essential to secure a water supply channel. To do this, it is necessary to take measures to prevent the tip of the water suction pipe from becoming clogged with sand and the surface of the ground plate from becoming covered with sand and sand. To do this, you can stack brass wire mesh in the order of coarse, medium, and fine as a ground plate, or use carbon, copper, or stainless steel chips to create coarse, medium, and
It is necessary to prevent water channel clogging on the ground plate by stacking the particles in the order of fine particles.
本発明の実施例には、給水路の安全性を考慮して真鍮製
金網を使用する。真鍮製金網は９メッシュ、４８メッシ
ュ、および１００メッシュの３種類を使用する。In the embodiment of the present invention, a brass wire mesh is used in consideration of the safety of the water supply channel. Three types of brass wire mesh are used: 9 mesh, 48 mesh, and 100 mesh.
還元性と導電性を兼備する化合物としては亜硫酸ソーダ
を使用する、還元性化合物を使用する目的は、接地板周
辺の土壌中の酸素と化合させることにより、接地板周辺
の酸素を消滅させ、接地板の腐食を防止するためである
。亜硫酸ソーダは、酸素と化合して硫酸ソーダとなり、
依然として導電性に貢献する。Sodium sulfite is used as a compound that has both reducing and conductive properties.The purpose of using a reducing compound is to eliminate oxygen around the grounding plate by combining it with oxygen in the soil around the grounding plate. This is to prevent corrosion of the base plate. Sodium sulfite combines with oxygen to form sodium sulfate.
Still contributes to conductivity.
このように、亜硫酸ソーダは接地板の腐食防止と接地抵
抗低減化に貢献する一挙両得な化合物である。In this way, sodium sulfite is a compound that contributes to both prevention of corrosion of the grounding plate and reduction of grounding resistance.
本発明の給水式接地工法を図面で説明する。The water supply type grounding method of the present invention will be explained with reference to the drawings.
第１図、第２図の如く、接地板が平らに於ける大きさで
、深さ約８０ｃｍの穴を掘る。第３図は、本発明の施行
順序を説明するために、第１図Ａ−Ａ線の縦断側面図を
示す。As shown in Figures 1 and 2, dig a hole about 80 cm deep and large enough to allow the ground plate to lie flat. FIG. 3 shows a longitudinal sectional side view taken along line A--A in FIG. 1 in order to explain the order of implementation of the present invention.
先づ、穴１つの底にベントナイトと水の混合物２を凹状
に敷きつめ、その上にリード線３を溶接した接地板４を
平らに置き、リード線３の先端を地上に固定する。次に
接地板４の上に、接地板４より大きめの９メッシュの真
鍮製金網５を数枚重ね、金網５の中心部に吸水管６を立
てる。次に接地板４より少し大きめの４８メッシュの真
鍮製金網７の中心部に、吸水管６にはめこめるだけの穴
をあけたもの数枚をはめこむ。次に接地板４より少し大
きめの１００メッシュの真鍮製金網８の中心部に、吸水
管６にはめこめるだけの穴をあけたもの数枚をはめこむ
。次に吸水管６から、１００メッシュの金網８が水没す
るまで亜硫酸ソーダ水溶液を入れる。次に埋戻しを始め
るが、穴１の地下約３０ｃｍのところまで埋戻したとき
表面を■型にならし、その上に、中心部に穴をあけたビ
ニルシート９をかぶせて完全に埋戻す。ビニルシート９
をかぶせるのは、水分の蒸発散に伴い、亜硫酸ソーダが
雨水により地表から流失するのを防ぐためである。First, a mixture 2 of bentonite and water is laid in a concave shape at the bottom of one hole, and a ground plate 4 with a lead wire 3 welded thereon is placed flat, and the tip of the lead wire 3 is fixed to the ground. Next, several 9-mesh brass wire meshes 5 larger than the ground plate 4 are stacked on the ground plate 4, and a water absorption pipe 6 is erected in the center of the wire mesh 5. Next, several pieces of 48-mesh brass metal mesh 7, which are slightly larger than the ground plate 4, are fitted into the center with holes large enough to fit into the water suction pipes 6. Next, several pieces of 100-mesh brass wire mesh 8, which are slightly larger than the ground plate 4, are fitted into the center with holes large enough to fit into the water suction pipes 6. Next, a sodium sulfite aqueous solution is poured into the water absorption pipe 6 until the 100-mesh wire mesh 8 is submerged in water. Next, start backfilling. When the hole 1 has been backfilled to about 30 cm underground, the surface is smoothed into the shape of a . vinyl sheet 9
The purpose of covering the ground is to prevent sodium sulfite from being washed away from the ground by rainwater as water evaporates.
本発明をこのように施工すれば、供給した亜硫酸ソーダ
水溶液が、ベントナイト壁２とビニルシート９の間にあ
る土壌内に滞留するため、亜硫酸ソーダ水溶液の供給量
がかなり節約できる。When the present invention is implemented in this manner, the supplied aqueous sodium sulfite solution stays in the soil between the bentonite wall 2 and the vinyl sheet 9, so that the amount of the aqueous sodium sulfite solution supplied can be saved considerably.
その後、たとえ接地抵抗が上昇しても、亜硫酸ソーダ水
溶液を供給するだけで接地抵抗が復元するため、接地の
補修工事が省略できる経済的な供水式接地工法である。After that, even if the grounding resistance increases, simply supplying the sodium sulfite aqueous solution will restore the grounding resistance, so it is an economical water-supply grounding method that can omit grounding repair work.
第３図は、本発明の施行順序を説明するための穴の内部
の縦断側面図である。
１−−−−穴
２−−−−ベントナイト
３−−−−リード線
４−−−−接地板
５、７、８−−−−真鍮製金網
６−−−−吸水管
９−−−−ビニルシート
第１図は、接地用穴の平面図
第２図は、第１図の側面図FIG. 3 is a longitudinal sectional side view of the inside of the hole for explaining the order of implementation of the present invention. 1---- Hole 2---- Bentonite 3---- Lead wire 4---- Ground plate 5, 7, 8---- Brass wire mesh 6---- Water suction pipe 9---- Vinyl sheet Figure 1 is a plan view of the grounding hole Figure 2 is a side view of Figure 1
Claims (1)
め、接地板上に金網と吸水管を設備する給水式接地工法
。A water supply grounding method in which a mixture of bentonite and water is laid under the ground plate, and a wire mesh and water suction pipe are installed on the ground plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13753889A JPH03110767A (en) | 1989-06-01 | 1989-06-01 | Water-feeding type grounding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13753889A JPH03110767A (en) | 1989-06-01 | 1989-06-01 | Water-feeding type grounding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110767A true JPH03110767A (en) | 1991-05-10 |
Family
ID=15201030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13753889A Pending JPH03110767A (en) | 1989-06-01 | 1989-06-01 | Water-feeding type grounding process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110767A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0660955A (en) * | 1991-04-06 | 1994-03-04 | Yoshimasa Okano | Automatic water supply type grounding method |
| CN111326272A (en) * | 2020-03-27 | 2020-06-23 | 河南四达电力设备股份有限公司 | Slow-release graphite resistance-reducing paste and preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130483A (en) * | 1987-11-16 | 1989-05-23 | Nippon Telegr & Teleph Corp <Ntt> | Low resistance grounding |
| JPH01137571A (en) * | 1987-11-24 | 1989-05-30 | Yoshimasa Okano | Grounding process provided with water supply system |
-
1989
- 1989-06-01 JP JP13753889A patent/JPH03110767A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130483A (en) * | 1987-11-16 | 1989-05-23 | Nippon Telegr & Teleph Corp <Ntt> | Low resistance grounding |
| JPH01137571A (en) * | 1987-11-24 | 1989-05-30 | Yoshimasa Okano | Grounding process provided with water supply system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0660955A (en) * | 1991-04-06 | 1994-03-04 | Yoshimasa Okano | Automatic water supply type grounding method |
| CN111326272A (en) * | 2020-03-27 | 2020-06-23 | 河南四达电力设备股份有限公司 | Slow-release graphite resistance-reducing paste and preparation method and application thereof |
| CN111326272B (en) * | 2020-03-27 | 2021-04-13 | 河南四达电力设备股份有限公司 | Method for preparing slow-release graphite resistance-reducing paste |
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