JPH03110749A - Electrode for water cooling type electric discharge lamp - Google Patents
Electrode for water cooling type electric discharge lampInfo
- Publication number
- JPH03110749A JPH03110749A JP24643089A JP24643089A JPH03110749A JP H03110749 A JPH03110749 A JP H03110749A JP 24643089 A JP24643089 A JP 24643089A JP 24643089 A JP24643089 A JP 24643089A JP H03110749 A JPH03110749 A JP H03110749A
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- electrode
- tungsten
- copper
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract description 3
- 239000010953 base metal Substances 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 24
- 239000010937 tungsten Substances 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 abstract 3
- 238000005219 brazing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Discharge Lamp (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、キセノン等の放電ガスが封入された大出力の
放電灯に使用される水冷型の電極に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a water-cooled electrode used in a high-output discharge lamp filled with a discharge gas such as xenon.
[従来の技術]
宇宙開発用に使用されるソーラーシュミレータ(大気圏
外の真空状態における太陽光線の照射テストに利用され
る宇宙環境装置)や超高温材料の研究に利用されるアー
クイメージファーネス(放電灯の輻射熱を光学的に集光
して耐熱物質を溶解する装置)等には、水銀やキセノン
、アルゴン等の希ガスが封入されて、点灯時の圧力が1
0気圧以上になるショートアーク型高圧放電灯が利用さ
れているが、最近では装置の大型化に伴い、高出力のも
のが要求されており、50KW程度の大型のものも開発
されつつある。[Prior technology] Solar simulators (space environment equipment used for solar irradiation tests in a vacuum outside the atmosphere) used for space development and arc image furnaces (discharge lamps) used for research on ultra-high temperature materials. Devices that optically focus radiant heat to melt heat-resistant materials are filled with rare gases such as mercury, xenon, and argon, and the pressure at the time of lighting is 1.
Short-arc type high-pressure discharge lamps with a discharge voltage of 0 atmosphere or more have been used, but recently, with the increase in the size of equipment, high output lamps are required, and large lamps with a capacity of about 50 kW are being developed.
しかしながら、大型のものは高電圧、高電流(例えば3
0KWのキセノンショートアーク放電灯の場合、電極間
距離131.で45V 660Aである)となるため高
熱が発生するので、陽極は水冷するタイプのものが使用
され、材質としては熱伝導のよい銅が用いられている。However, large ones have high voltage and high current (e.g. 3
In the case of a 0KW xenon short arc discharge lamp, the distance between the electrodes is 131. (45V, 660A), which generates high heat, so a water-cooled type anode is used, and the material used is copper, which has good thermal conductivity.
そして、この銅の基体金属の厚みは、薄い程冷却効率が
上がるが、機械的強度等の条件を加味すると1.51以
下にはてきないのが実情である。The thinner the thickness of the copper base metal, the higher the cooling efficiency, but the reality is that it cannot be less than 1.51 when conditions such as mechanical strength are taken into consideration.
従来、この水冷型の陽極は、銅や銅の表面にロジウムを
メツキしたものが用いられてきたが、前述のように、6
00A以上の電流が流れる超大型のものについては、温
度上昇による銅の溶解を防ぐために、アークの当る部分
にろう材を用いてダンゲステンの薄板を接合するタイプ
のものも用いられている。Conventionally, this water-cooled anode has been made of copper or copper plated with rhodium, but as mentioned above,
For ultra-large products that carry a current of 00A or more, some are of the type that uses a brazing material to join a thin plate of Dungesten to the part that is hit by the arc, in order to prevent the copper from melting due to temperature rise.
第4図は従来の水冷型放電灯用電極の陽極部の概略構成
を示す側面図で、1は放電灯用電極の陽極を構成する銅
からなる中空の基体金属、2はこの基体金属lの冷却の
ための放熱フィン、3は陽極の先端に設けられたダンゲ
ステンよりなる薄板であり、基体金属lと薄板3はろう
材4て接合されている。FIG. 4 is a side view showing a schematic structure of the anode part of a conventional water-cooled discharge lamp electrode, in which 1 is a hollow base metal made of copper that constitutes the anode of the discharge lamp electrode, and 2 is the base metal l. A radiation fin 3 for cooling is a thin plate made of Dungesten provided at the tip of the anode, and the base metal 1 and the thin plate 3 are joined by a brazing material 4.
第4図の電極において、動作中に銅からなる基体金属l
及びタングステンよりなる薄板3の温度上昇を防ぐため
に、これらの基体金属l及び薄板3からなる電極の中空
部に水を流して冷却して電極先端の溶解や蒸発を防止す
るようにしている。In the electrode of FIG. 4, during operation the base metal l made of copper is
In order to prevent the temperature of the thin plate 3 made of tungsten from rising, water is poured into the hollow part of the electrode made of the base metal l and the thin plate 3 to cool it and prevent the tip of the electrode from melting or evaporating.
[発明が解決しようとする課題]
上記のように、従来の水冷型放電灯用電極においては、
電極の基体金属である銅と、この銅の表面に取付けるタ
ングステンの薄板とをろう材を用いて接着していたが、
このろう材の厚みや均一性を一定にすることは難しく、
従って、ろう材の厚みや均一性が異なると電極のアーク
による熱が、均一かつ効率よく冷却水に伝わらないとい
う問題があった。[Problems to be Solved by the Invention] As mentioned above, in the conventional water-cooled discharge lamp electrode,
Copper, the base metal of the electrode, and a thin tungsten plate attached to the surface of the copper were bonded together using a brazing material.
It is difficult to keep the thickness and uniformity of this brazing filler metal constant;
Therefore, if the thickness or uniformity of the brazing filler metal differs, there is a problem in that the heat generated by the arc of the electrode is not uniformly and efficiently transferred to the cooling water.
また、ろう材自身の熱伝導率が低いので、冷却効率が下
がるのみならず、厚みを均一にすることが難しいので、
銅の表面(側面も含めて)全体、即ち、アークに接する
銅の表面全てをタングステンの薄板で覆うことは困難で
あるという問題があった。In addition, the brazing material itself has low thermal conductivity, which not only reduces cooling efficiency but also makes it difficult to make the thickness uniform.
There is a problem in that it is difficult to cover the entire surface of the copper (including the side surfaces), that is, the entire surface of the copper in contact with the arc, with a thin tungsten plate.
この発明はかかる従来の課題を解決するためになされた
もので、大電流の場合においても充分使用が可能な水冷
型放電灯用電極の特に陽極構造を提供することを目的と
する。The present invention has been made to solve the conventional problems, and an object thereof is to provide an electrode, particularly an anode structure, for a water-cooled discharge lamp that can be used satisfactorily even in the case of a large current.
[課題を解決するための手段]
上記の目的を達成するために、この発明の水冷型放電灯
用電極は、中空の銅よりなる基体金属の前面から側面に
かけてタングステンよりなる薄板で覆い、該薄板と前記
基体金属を溶融接合させた構成を有するものである。[Means for Solving the Problems] In order to achieve the above object, the electrode for a water-cooled discharge lamp of the present invention covers a hollow base metal made of copper with a thin plate made of tungsten from the front side to the side thereof, and It has a structure in which the base metal and the base metal are fused and bonded.
[作用] 上記の構成を有することにより、この発明は。[Effect] This invention has the above configuration.
■陽極の前面から側面にかけてタングステンの薄板で覆
われているので、アークに接する部分は銅が露出してい
ない。■Since the front and sides of the anode are covered with a thin tungsten plate, no copper is exposed in the area that comes into contact with the arc.
■タングステンの薄板と銅の基体金属は、溶融接合によ
り直接接続されているので、アークの熱が均一、かつ効
率よく冷却水に伝わる。■The thin tungsten plate and the copper base metal are directly connected by fusion bonding, so the arc heat is evenly and efficiently transmitted to the cooling water.
[実施例]
第1図はこの発明の一実施例を示す陽極部の断面図であ
る。第1図において、中空の銅よりなる基体金属1は、
前面の平坦部11とテーバ部12と側面部13とを有し
、内部の水冷部分には多数の放熱フィン2が設けられて
いる。この基体金属lの平坦部11.テーパ部12.側
面部13にはタングステンよりなる薄板3が被せられて
おり、基体金属1とは溶融接合により接続されている。[Embodiment] FIG. 1 is a sectional view of an anode portion showing an embodiment of the present invention. In FIG. 1, a base metal 1 made of hollow copper is
It has a flat part 11 on the front, a tapered part 12, and a side part 13, and a large number of radiation fins 2 are provided in the water-cooled part inside. Flat portion 11 of this base metal l. Tapered portion 12. The side surface portion 13 is covered with a thin plate 3 made of tungsten, and is connected to the base metal 1 by fusion bonding.
具体的には、例えばタングステンの薄板の厚み1.5.
、、であり、基体金属(銅)の厚みはタングステンで覆
われている部分がl〜t、S、、であり、タングステン
で覆われていない部分が31.である。Specifically, for example, the thickness of a thin tungsten plate is 1.5.
, , and the thickness of the base metal (copper) is l~t, S, in the part covered with tungsten, and 31. in the part not covered with tungsten. It is.
次に、この陽極部の製造方法について述べる。Next, a method for manufacturing this anode portion will be described.
基体金属lの前面ならびに側面を被覆するタングステン
の薄板は、例えば、所定の大きさのタングステン体から
機械加工により切り出す等の方法により、製作すること
ができる。The thin tungsten plate that covers the front and side surfaces of the base metal l can be manufactured, for example, by cutting out a tungsten body of a predetermined size by machining.
次いで、所定の形状にされたタングステンの薄板をカー
ボン治具に入れ、その上に最終形状に必要に応じ、充分
な容量の銅を置き、N2雰囲気中(温度1100℃)に
て溶解した後、冷却凝固させ、さらにN2雰囲気中(温
度1100℃以上)にて再び溶解した後、冷却凝固させ
て銅とタングステンの薄板を接合させる。Next, a thin tungsten plate shaped into a predetermined shape was placed in a carbon jig, and a sufficient amount of copper was placed on top of it as required for the final shape, and after melting in an N2 atmosphere (temperature 1100°C), After being cooled and solidified, it is further melted again in an N2 atmosphere (at a temperature of 1100° C. or higher), and then cooled and solidified to join the copper and tungsten thin plates.
上記方法で得た電極は、気泡のない緻密な銅とタングス
テンの薄板の接合品となる。The electrode obtained by the above method is a bonded product of dense copper and tungsten thin plates without bubbles.
このようにして接合した電極を最後に外周を機械加工に
て仕上げ、目的の寸法とする。Finally, the outer periphery of the electrodes bonded in this manner is finished by machining to obtain the desired dimensions.
また、第2図はこの発明の他の実施・例を示す断面図で
、タングステンよりなる薄板3が基体金属lのテーバ部
まで被せられている場合の具体例を示したものである。Further, FIG. 2 is a sectional view showing another embodiment/example of the present invention, showing a specific example in which the thin plate 3 made of tungsten covers the base metal l up to the tapered portion.
さらに、第3図はこの発明のさらに他の実施例を示す断
面図て、先端が球状をした場合の具体例を示したもので
ある。Furthermore, FIG. 3 is a sectional view showing still another embodiment of the present invention, and shows a specific example in which the tip is spherical.
尚、第2図、第3図共に、第1図と同一または相当部分
には同一符号を用いてあり、その製造方法及びこれらの
構成による動作は第1図と同一であるので、説明は省略
する。In addition, in both FIGS. 2 and 3, the same reference numerals are used for the same or equivalent parts as in FIG. 1, and the manufacturing method and operation of these structures are the same as in FIG. 1, so explanations will be omitted. do.
[発明の効果コ
以上説明したとおり、この発明の水冷型放電灯用電極は
、次のような効果を有する。[Effects of the Invention] As explained above, the electrode for a water-cooled discharge lamp of the present invention has the following effects.
■前面から側面にかけてタングステンの薄板で覆われて
いるので、アークによる電極ダメージが軽減される。■Since the front and sides are covered with a thin tungsten plate, electrode damage from arcing is reduced.
■銅よりなる基体金属とタングステンの薄板が溶融接合
により接続されているので1品質が安定化する。■Since the base metal made of copper and the thin tungsten plate are connected by fusion bonding, the quality is stabilized.
■結果として、電極の長寿命化が図れる。■As a result, the life of the electrode can be extended.
第1図はこの発明の一実施例を示す陽極部の断面図、第
2図はこの発明の他の実施例を示す断面図、第3図はこ
の発明のさらに他の実施例を示す断面図、第4図は従来
の水冷型放電灯用電極の陽極部の概略構成を示す断面図
である。
図中。
l:基体金属
2:放熱フィン
3:タングステンよりなる薄板
4:ろう材
11:平坦部
12:テーパ部
13:側面部FIG. 1 is a sectional view of an anode section showing one embodiment of the invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG. 3 is a sectional view showing still another embodiment of the invention. , FIG. 4 is a sectional view showing a schematic structure of an anode portion of a conventional electrode for a water-cooled discharge lamp. In the figure. l: Base metal 2: Radiation fin 3: Thin plate made of tungsten 4: Brazing material 11: Flat part 12: Tapered part 13: Side part
Claims (1)
グステンよりなる薄板で覆い、該薄板と前記基体金属を
溶融接合させた構成を有することを特徴とする水冷型放
電灯用電極。1. An electrode for a water-cooled discharge lamp, characterized in that a hollow base metal made of copper is covered with a thin plate made of tungsten from the front to the side, and the thin plate and the base metal are fused and bonded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24643089A JP2742576B2 (en) | 1989-09-25 | 1989-09-25 | Electrodes for water-cooled discharge lamps |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24643089A JP2742576B2 (en) | 1989-09-25 | 1989-09-25 | Electrodes for water-cooled discharge lamps |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03110749A true JPH03110749A (en) | 1991-05-10 |
JP2742576B2 JP2742576B2 (en) | 1998-04-22 |
Family
ID=17148365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24643089A Expired - Fee Related JP2742576B2 (en) | 1989-09-25 | 1989-09-25 | Electrodes for water-cooled discharge lamps |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2742576B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007244697A (en) * | 2006-03-16 | 2007-09-27 | Nissei Metals Co Ltd | Fixing implement for furniture |
JP2008006116A (en) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Works Ltd | Wall surface storage structure |
CN112185803A (en) * | 2019-07-02 | 2021-01-05 | 珠海格力电器股份有限公司 | Power device substrate back processing method and power device manufacturing method |
-
1989
- 1989-09-25 JP JP24643089A patent/JP2742576B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007244697A (en) * | 2006-03-16 | 2007-09-27 | Nissei Metals Co Ltd | Fixing implement for furniture |
JP2008006116A (en) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Works Ltd | Wall surface storage structure |
CN112185803A (en) * | 2019-07-02 | 2021-01-05 | 珠海格力电器股份有限公司 | Power device substrate back processing method and power device manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JP2742576B2 (en) | 1998-04-22 |
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