JPH03110093A - Laser beam machining method - Google Patents
Laser beam machining methodInfo
- Publication number
- JPH03110093A JPH03110093A JP1248879A JP24887989A JPH03110093A JP H03110093 A JPH03110093 A JP H03110093A JP 1248879 A JP1248879 A JP 1248879A JP 24887989 A JP24887989 A JP 24887989A JP H03110093 A JPH03110093 A JP H03110093A
- Authority
- JP
- Japan
- Prior art keywords
- processed
- laser beam
- laser
- optical fiber
- iodine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 4
- 238000003754 machining Methods 0.000 title description 2
- 229910052740 iodine Inorganic materials 0.000 claims abstract description 23
- 239000011630 iodine Substances 0.000 claims abstract description 23
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000012545 processing Methods 0.000 claims abstract description 16
- 239000013307 optical fiber Substances 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000003672 processing method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000009736 wetting Methods 0.000 abstract 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 239000010979 ruby Substances 0.000 description 3
- 229910001750 ruby Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 238000006276 transfer reaction Methods 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002496 iodine Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、水中、もしくは雨、霧、あるいは雲のよう
な湿潤雰囲気中に置かれた物体の被加工部位に所望のレ
ーザ加工を施すためのレーザ加工方法に関する。[Detailed Description of the Invention] [Industrial Application Field] This invention is for performing desired laser processing on a workpiece part of an object placed underwater or in a humid atmosphere such as rain, fog, or clouds. This invention relates to a laser processing method.
１９６０年にルビーレーザがはじめて発振してから、２
０００種以上にのぼる波長のレーザが発振されている。Since the first ruby laser oscillated in 1960, 2
Lasers with more than 000 different wavelengths are oscillated.
そしてこれらのレーザ光の応用分野が著しく拡大され、
中でもレーザ加工の分野に注目が集められて、穴あけ、
切断、微小量除去、溶接および表面処理を含む加工に工
業的に広く応用されている。このようなレーザ加工に用
いられているレーザ光は主としてＣＯｔ レーザおよび
ルビーレーザである。The fields of application of these laser beams have expanded significantly,
Among them, the field of laser processing is attracting attention, and drilling,
It is widely applied industrially in processing including cutting, micro-removal, welding and surface treatment. The laser beams used in such laser processing are mainly COt lasers and ruby lasers.
ＣＯよレーザは、１０．６μ閑という長波長のために、
多種の材料に対する加工用に広く利用されているが、大
出力を得るためにはレーザ共振器が大型となり、使用条
件に制限を受ける。一方、ルビーレーザのような固体レ
ーザは、大出力が容易に得られる反面、波長が短いため
に、レーザ光が通過する媒体による吸収の影響を受けや
すく、たとえば水蒸気の多い雰囲気中、あるいは水中で
の使用は困難または不可能である。Because the CO laser has a long wavelength of 10.6μ,
Although it is widely used for processing various materials, the laser resonator must be large in order to obtain a large output, which limits the conditions of use. On the other hand, solid-state lasers such as ruby lasers can easily obtain high output power, but because of their short wavelengths, they are easily affected by absorption by the medium through which the laser light passes. is difficult or impossible to use.
この発明は、上記のようなレーザ加工の実情に鑑みてな
されたもので、水中、もしくは雨、露、あるいは雲のよ
うな湿潤雰囲気中に置かれた物体に対しても所望の加工
を効率的に行うことができるレーザ加工方法を提供する
ことを目的とする。This invention was made in view of the actual situation of laser processing as described above, and it is possible to efficiently perform desired processing even on objects placed underwater or in a humid atmosphere such as rain, dew, or clouds. The purpose of the present invention is to provide a laser processing method that can perform the following steps.
この発明のレーザ加工方法においては、レーザ光として
化学励起ヨウ素レーザ（Ｃ４ｍ１ｃａｌｌｙ Ｐｕｍｐ
ｅｄＩｎｄｉｎｅ Ｌａ５ｅｒ ： ＣＰ Ｉ Ｌ ）
を使用する。この発明では、この性質を利用して、共振
器から取り出したレーザ光を被加工部位の近傍まで導（
ために光ファイバを使用する。In the laser processing method of the present invention, a chemically excited iodine laser (C4m1cally pump) is used as the laser beam.
edIndine La5er: CPIL)
use. In this invention, by utilizing this property, the laser beam extracted from the resonator is guided (
use optical fiber for this purpose.
近年、化学励起ヨウ素レーザの研究開発が進み、１．３
１５μｍの波長の高出力レーザの発生に成功している。In recent years, research and development of chemically excited iodine lasers has progressed, and 1.3
We have succeeded in generating a high-power laser with a wavelength of 15 μm.
このＣＰＩＬは、レーザ発振のためのボンピング源とし
て電気エネルギを必要とせず、化学燃料によってレーザ
発振を行うことができ、構造が比較的簡単であるという
利点を有している。This CPIL has the advantage that it does not require electrical energy as a pumping source for laser oscillation, can perform laser oscillation using chemical fuel, and has a relatively simple structure.
そしてその比較的長い波長のために、レーザ光が通過す
る媒体による吸収の影響を受けにくく、水蒸気の多い雰
囲気中、あるいは水中でも、物１体の被加工部位にエネ
ルギを効果的に伝達することができる。またヨウ素レー
ザは、光フアイバ中をきわめて小さい損失で通過する性
質を有する。Because of its relatively long wavelength, it is less susceptible to absorption by the medium through which the laser beam passes, and can effectively transmit energy to the processed part of an object even in an atmosphere with a lot of water vapor or underwater. I can do it. Furthermore, the iodine laser has the property of passing through an optical fiber with extremely low loss.
ＣＰＩＬの基本原理は、次式で示されるエネルギ移乗反
応である。The basic principle of CPIL is an energy transfer reaction expressed by the following equation.
０？ＣΔ） ＋ Ｉ （Ｐｓ／ｚ） −” Ｏｘ （３
Σ） ＋Ｉ”（Ｐ＋／ｚ） −（１）ここで０！”（’
Δ）は励起状態の酸素、■“（Ｐ１／□）は励起状態の
ヨウ素を示す。0? CΔ) + I (Ps/z) −” Ox (3
Σ) +I"(P+/z) -(1) 0 here!"('
Δ) indicates oxygen in an excited state, and ■"(P1/□) indicates iodine in an excited state.
（１）式の反応において、左辺から右辺への反応速度が
速いため、効率よくボンピングが行われ、！”（Ｐ＋ｚ
＊）が生成される。このＩ”（Ｐ＋／ｚ）がレーザ媒質
となり、波長１．３１５μｍのレーザ光を発生する。こ
こで最も重要なことは、ボンピング源であるＯｘ”（’
Δ）をいかに効率よく発生させるか、ということである
、現在知られている最も効率のよい方法は、次式で示す
過酸化水素の分解反応である。In the reaction of equation (1), the reaction speed from the left side to the right side is fast, so the bombing is performed efficiently, and! ”(P+z
*) is generated. This I''(P+/z) becomes a laser medium and generates a laser beam with a wavelength of 1.315 μm.The most important thing here is that Ox''('
The most efficient method currently known to efficiently generate Δ) is the decomposition reaction of hydrogen peroxide shown by the following formula.
ＨｚＯｚ＋２ＮａＯＨ＋Ｃ１ｇ−＋Ｏｚ”＋２８ｚＯ＋
２８ａＣ１−（２）この反応は、高濃度過酸化水素水溶
液に水酸化ナトリウム水溶液を加えてアルカリ性にし、
この混合溶液中に塩素ガスをバブリングすることによっ
て行うことができ、０？ＣΔ）が容易に発生する。HzOz+2NaOH+C1g-+Oz"+28zO+
28aC1-(2) This reaction involves adding a sodium hydroxide aqueous solution to a highly concentrated hydrogen peroxide aqueous solution to make it alkaline.
This can be done by bubbling chlorine gas into this mixed solution, and 0? CΔ) easily occurs.
またこの発明においては、共振器から取り出したレーザ
光を被加工部位の近傍まで導くために光ファイバを使用
する。これによって共振器から被加工部位までの距離が
長い場合でも、エネルギの伝達損失を最小限に抑えるこ
とができる。Further, in this invention, an optical fiber is used to guide the laser beam extracted from the resonator to the vicinity of the part to be processed. This allows energy transmission loss to be minimized even if the distance from the resonator to the workpiece is long.
以下に図面を参照して、この発明のレーザ加工方法を船
体の補修に適用した一実施例を説明する。An embodiment in which the laser processing method of the present invention is applied to ship hull repair will be described below with reference to the drawings.
図において、符号１はヨウ素レーザ発生装置を示し、こ
れは、アルカリ性過酸化水素水溶液に塩素または塩素化
合物を接触させて励起酸素を発生させる酸素発生器と、
この励起酸素を導入してその中にヨウ素を添加し、励起
酸素からヨウ素へのエネルギ移乗反応によりヨウ素を励
起してレーザ発振を得るレーザ共振器とを主要構成要素
としている。このヨウ素レーザ発生装置１の構成および
動作は通常のものと同じであるので、その詳細な説明を
省略する。In the figure, reference numeral 1 indicates an iodine laser generator, which includes an oxygen generator that generates excited oxygen by bringing chlorine or a chlorine compound into contact with an alkaline hydrogen peroxide aqueous solution;
The main component is a laser resonator in which this excited oxygen is introduced, iodine is added therein, and the iodine is excited by an energy transfer reaction from the excited oxygen to the iodine to obtain laser oscillation. The configuration and operation of this iodine laser generator 1 are the same as those of ordinary ones, so detailed explanation thereof will be omitted.
ヨウ素レーザ発生装置ｌのレーザ光出力端には、適当な
カプラー（図示せず）を介して光ファイバ２の一端が接
続されている。この光ファイバ２は、ヨウ素レーザ発生
装置ｌから、加工対象である船体３の被加工部位までの
距離よりも十分に長いもので、その先端には、所望の加
工を行うのに適した集束装置４が取り付けられている。One end of an optical fiber 2 is connected to the laser light output end of the iodine laser generator 1 via a suitable coupler (not shown). This optical fiber 2 is sufficiently longer than the distance from the iodine laser generator l to the part to be processed on the ship's hull 3, and has a focusing device 4 suitable for performing the desired processing at its tip. is installed.
この集束装置４は、適当な支持装置によって船体３の被
加工部位に対して所定の位置に保持されてもよく、ある
いは潜水作業員によって保持されてもよい。なお加工の
種類によっては集束装置４を省略できる場合がある。こ
の発明方法によって行われる加工とは、穴あけ、切断、
溶接、あるいは熱処理などの、ヨウ素レーザ光によって
行うことができるすべての加工を包含する。This focusing device 4 may be held in position relative to the part to be processed of the hull 3 by suitable support devices or by a diving operator. Note that the focusing device 4 may be omitted depending on the type of processing. The processing performed by this invention method includes drilling, cutting,
It includes all processing that can be performed with iodine laser light, such as welding or heat treatment.
加工作業は、集束装置４を船体３の被加工部位に対して
所定の位置に保持した状態で、ヨウ素レーザ発生装置１
からのレーザ光を光ファイバ２、集束装置４を介してレ
ーザ光を照射することによって行われる。The machining operation is carried out using the iodine laser generator 1 while the focusing device 4 is held at a predetermined position relative to the part to be processed on the hull 3.
This is carried out by irradiating laser light from a source through an optical fiber 2 and a focusing device 4.
以上に説明したようにこの発明によれば、水による吸収
の影響を受けることが少ないヨウ素レーザ光を使用し、
これを光ファイバによって被加工部位に導いている。し
たがって所望の加工を能率的に行うことができる。また
ヨウ素レーザ発生装置はＣＯ，レーザなどの他のレーザ
光の発生装置と比較して構造が簡単で小型化が容易なの
で、広い範囲にわたる被加工部位に沿って自由に移動さ
せることができ、簡便に作業することが可能となる。As explained above, according to the present invention, iodine laser light that is less affected by absorption by water is used,
This is guided to the part to be processed using an optical fiber. Therefore, desired processing can be performed efficiently. In addition, the iodine laser generator has a simpler structure and is easier to miniaturize than other laser light generators such as CO and lasers, so it can be moved freely along a wide range of workpieces, making it easy to use. It becomes possible to work on
図面はこの発明方法にしたがって船体を加工する状態を
示す説明図である。
図において、１はヨウ素レーザ発生装置、２は光ファイ
バ、３は船体、４は集束装置をそれぞれ示す。The drawings are explanatory diagrams showing a state in which a hull is processed according to the method of this invention. In the figure, 1 is an iodine laser generator, 2 is an optical fiber, 3 is a hull, and 4 is a focusing device.
Claims (1)
に、ヨウ素レーザ装置から取り出したヨウ素レーザ光を
、光ファイバを通して導くことによって前記被加工部位
に所望のレーザ加工を施すことを特徴とするレーザ加工
方法。A laser characterized in that the iodine laser beam extracted from an iodine laser device is guided through an optical fiber to the part to be processed of an object placed in water or in a humid atmosphere, thereby performing desired laser processing on the part to be processed. Processing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1248879A JPH03110093A (en) | 1989-09-25 | 1989-09-25 | Laser beam machining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1248879A JPH03110093A (en) | 1989-09-25 | 1989-09-25 | Laser beam machining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110093A true JPH03110093A (en) | 1991-05-10 |
Family
ID=17184793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1248879A Pending JPH03110093A (en) | 1989-09-25 | 1989-09-25 | Laser beam machining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110093A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5977515A (en) * | 1994-10-05 | 1999-11-02 | Hitachi, Ltd. | Underwater laser processing device including chamber with partitioning wall |
| US6084202A (en) * | 1995-01-31 | 2000-07-04 | Kabushiki Kaisha Toshiba | Underwater laser processing method and apparatus |
-
1989
- 1989-09-25 JP JP1248879A patent/JPH03110093A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5977515A (en) * | 1994-10-05 | 1999-11-02 | Hitachi, Ltd. | Underwater laser processing device including chamber with partitioning wall |
| US6084202A (en) * | 1995-01-31 | 2000-07-04 | Kabushiki Kaisha Toshiba | Underwater laser processing method and apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6462621A (en) | Laser beam generation method and apparatus | |
| CN101378875A (en) | Cutting method using a laser having at least one ytterbium-based fibre, in which at least the power of the laser source, the diameter of the focused beam and the beam quality factor are controlled | |
| JPH09242453A (en) | Drilling method | |
| GB2175737A (en) | Laser material processing | |
| JPH03110093A (en) | Laser beam machining method | |
| JPH11207478A (en) | Method and device therefor laser beam machining | |
| JP2001166090A (en) | Method for decommissioning nuclear reactor and laser cutting device | |
| WO2016059936A1 (en) | Direct diode laser processing device and sheet metal processing method using same | |
| JP2016078051A (en) | Direct diode laser processing device and processing method for metal plate using the same | |
| CN217115140U (en) | Eccentric Gaussian beam optical fiber laser | |
| JP5909537B1 (en) | Direct diode laser oscillator, direct diode laser processing apparatus and reflected light detection method | |
| JP2016221579A (en) | Direct diode laser processing device and processing method for metal plate using the same | |
| JPH01192492A (en) | Laser processing device | |
| CN201659822U (en) | Combined type multipurpose multi-wavelength laser processing machine | |
| JPH0417378A (en) | Ring resonator for iodine laser | |
| JP2000176669A (en) | Laser beam cutting device | |
| JPH03109783A (en) | Iodine laser device | |
| Hack et al. | Cutting and welding applications of high power Nd: YAG lasers with high beam quality | |
| Junichi et al. | Application of chemical oxygen iodine laser (COIL) for dismantling of nuclear facilities | |
| JPH09225657A (en) | Movable laser beam machine | |
| JP6937865B2 (en) | Direct diode laser machining equipment and sheet metal machining method using this | |
| JPS5825888A (en) | Laser working device | |
| JPH0451027A (en) | Waveguide type optical amplification method and waveguide type optical amplifier | |
| Hügel | Laser materials processing-application potentials of solid-state high-power lasers | |
| Uren et al. | Novel method for generating high purity vortex modes |