JPH03109765U - - Google Patents
Info
- Publication number
- JPH03109765U JPH03109765U JP1828090U JP1828090U JPH03109765U JP H03109765 U JPH03109765 U JP H03109765U JP 1828090 U JP1828090 U JP 1828090U JP 1828090 U JP1828090 U JP 1828090U JP H03109765 U JPH03109765 U JP H03109765U
- Authority
- JP
- Japan
- Prior art keywords
- whetstone
- thin
- flange
- edged
- holds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
第1図は、本考案による第1の実施例を示す断
面図、第2図は、第1の砥石フランジを示す正面
図、第3図は、本考案による第2の実施例を示す
断面図、第4図a,bは、従来技術の説明図であ
る。
3……(薄刃)砥石、5,35……第1の砥石
フランジ、5a,6a……溝部、5b,35b…
…孔部、6……第2の砥石フランジ、23,24
……液溜め。
FIG. 1 is a cross-sectional view showing a first embodiment of the present invention, FIG. 2 is a front view showing a first grindstone flange, and FIG. 3 is a cross-sectional view showing a second embodiment of the present invention. , FIGS. 4a and 4b are explanatory diagrams of the prior art. 3... (thin blade) grindstone, 5, 35... first grindstone flange, 5a, 6a... groove, 5b, 35b...
...Hole, 6...Second grindstone flange, 23, 24
...liquid reservoir.
Claims (1)
フランジにおいて、 前記砥石フランジは、前記薄刃砥石を挾持した
状態でこの薄刃砥石とで液溜めが形成されるよう
、砥石保持面側に凹部が形設されており、かつ前
記液溜めに研削液が供給されるよう、連通部が設
けてあり、さらに前記液溜めより外部に研削液が
吐出されるよう、砥石保持面に複数の溝部が形設
されていることを特徴とする砥石フランジ。 (2) 薄刃砥石を挾持した状態で、溝部は、その
底部が前記薄刃砥石のほぼ外周部に向かうように
形成されていることを特徴とする請求項1記載の
砥石フランジ。 (3) 連通部が複数設けられており、かつ溝部と
前記連通部とは位相がずれて配置されていること
を特徴とする請求項1記載の砥石フランジ。[Scope of Claim for Utility Model Registration] (1) In a whetstone flange that holds and holds a thin-edged whetstone on a whetstone shaft, the whetstone flange holds the thin-edged whetstone and forms a liquid reservoir with this thin-edged whetstone. A recess is formed on the grinding wheel holding surface side, and a communication part is provided so that the grinding fluid is supplied to the fluid reservoir, and further, the grinding fluid is discharged from the fluid reservoir to the outside. A whetstone flange characterized by having a plurality of grooves formed on a whetstone holding surface. (2) The grindstone flange according to claim 1, wherein the groove is formed so that the bottom of the groove faces substantially toward the outer periphery of the thin-blade whetstone when the thin-blade grindstone is held between the grooves. (3) The grindstone flange according to claim 1, wherein a plurality of communicating portions are provided, and the groove portion and the communicating portion are arranged out of phase.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1828090U JPH03109765U (en) | 1990-02-27 | 1990-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1828090U JPH03109765U (en) | 1990-02-27 | 1990-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03109765U true JPH03109765U (en) | 1991-11-11 |
Family
ID=31521441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1828090U Pending JPH03109765U (en) | 1990-02-27 | 1990-02-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03109765U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010284791A (en) * | 2009-05-11 | 2010-12-24 | Ito Yukio | Grinding wheel, holder for the same, method and device for cooling the same |
JP2014128865A (en) * | 2012-12-31 | 2014-07-10 | Yukio Ito | In-abrasive-grain grinding fluid feeder for super abrasive grain electrodeposited abrasive grain and grinding method for the same |
JP2016068165A (en) * | 2014-09-26 | 2016-05-09 | 株式会社ディスコ | Cutting liquid supply mechanism |
WO2024140373A1 (en) * | 2022-12-30 | 2024-07-04 | 桂林磨院材料科技有限公司 | Composite function pressing plate for semiconductor scribing blade |
-
1990
- 1990-02-27 JP JP1828090U patent/JPH03109765U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010284791A (en) * | 2009-05-11 | 2010-12-24 | Ito Yukio | Grinding wheel, holder for the same, method and device for cooling the same |
JP2014128865A (en) * | 2012-12-31 | 2014-07-10 | Yukio Ito | In-abrasive-grain grinding fluid feeder for super abrasive grain electrodeposited abrasive grain and grinding method for the same |
JP2016068165A (en) * | 2014-09-26 | 2016-05-09 | 株式会社ディスコ | Cutting liquid supply mechanism |
WO2024140373A1 (en) * | 2022-12-30 | 2024-07-04 | 桂林磨院材料科技有限公司 | Composite function pressing plate for semiconductor scribing blade |
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