JPH03109352U - - Google Patents

Info

Publication number
JPH03109352U
JPH03109352U JP1633890U JP1633890U JPH03109352U JP H03109352 U JPH03109352 U JP H03109352U JP 1633890 U JP1633890 U JP 1633890U JP 1633890 U JP1633890 U JP 1633890U JP H03109352 U JPH03109352 U JP H03109352U
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
lower surfaces
package
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1633890U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1633890U priority Critical patent/JPH03109352U/ja
Publication of JPH03109352U publication Critical patent/JPH03109352U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1633890U 1990-02-21 1990-02-21 Pending JPH03109352U (US07847105-20101207-C00016.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1633890U JPH03109352U (US07847105-20101207-C00016.png) 1990-02-21 1990-02-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1633890U JPH03109352U (US07847105-20101207-C00016.png) 1990-02-21 1990-02-21

Publications (1)

Publication Number Publication Date
JPH03109352U true JPH03109352U (US07847105-20101207-C00016.png) 1991-11-11

Family

ID=31519607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1633890U Pending JPH03109352U (US07847105-20101207-C00016.png) 1990-02-21 1990-02-21

Country Status (1)

Country Link
JP (1) JPH03109352U (US07847105-20101207-C00016.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017011192A (ja) * 2015-06-25 2017-01-12 アサヒ・エンジニアリング株式会社 電子素子の樹脂封止装置および樹脂封止方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017011192A (ja) * 2015-06-25 2017-01-12 アサヒ・エンジニアリング株式会社 電子素子の樹脂封止装置および樹脂封止方法

Similar Documents

Publication Publication Date Title
JPH03109352U (US07847105-20101207-C00016.png)
JPH0279044U (US07847105-20101207-C00016.png)
JPH0397952U (US07847105-20101207-C00016.png)
JPS62152474U (US07847105-20101207-C00016.png)
JPS62182555U (US07847105-20101207-C00016.png)
JPH0476056U (US07847105-20101207-C00016.png)
JPH01121946U (US07847105-20101207-C00016.png)
JPS6310550U (US07847105-20101207-C00016.png)
JPS6322749U (US07847105-20101207-C00016.png)
JPS61127693U (US07847105-20101207-C00016.png)
JPH0399443U (US07847105-20101207-C00016.png)
JPH0336140U (US07847105-20101207-C00016.png)
JPH02742U (US07847105-20101207-C00016.png)
JPH0247034U (US07847105-20101207-C00016.png)
JPH02136355U (US07847105-20101207-C00016.png)
JPS61205145U (US07847105-20101207-C00016.png)
JPH03117928U (US07847105-20101207-C00016.png)
JPH0288240U (US07847105-20101207-C00016.png)
JPS6367235U (US07847105-20101207-C00016.png)
JPS62103262U (US07847105-20101207-C00016.png)
JPH0351847U (US07847105-20101207-C00016.png)
JPS62116563U (US07847105-20101207-C00016.png)
JPH01113338U (US07847105-20101207-C00016.png)
JPS6454394U (US07847105-20101207-C00016.png)
JPH01125543U (US07847105-20101207-C00016.png)