JPH03109350U - - Google Patents
Info
- Publication number
- JPH03109350U JPH03109350U JP1623790U JP1623790U JPH03109350U JP H03109350 U JPH03109350 U JP H03109350U JP 1623790 U JP1623790 U JP 1623790U JP 1623790 U JP1623790 U JP 1623790U JP H03109350 U JPH03109350 U JP H03109350U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- mounting
- mounting structure
- mounting board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011295 pitch Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1623790U JPH03109350U (enExample) | 1990-02-22 | 1990-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1623790U JPH03109350U (enExample) | 1990-02-22 | 1990-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109350U true JPH03109350U (enExample) | 1991-11-11 |
Family
ID=31519517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1623790U Pending JPH03109350U (enExample) | 1990-02-22 | 1990-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109350U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62293750A (ja) * | 1986-06-13 | 1987-12-21 | Nippon Telegr & Teleph Corp <Ntt> | 配線板およびその製造方法 |
| JPH02181465A (ja) * | 1989-01-06 | 1990-07-16 | Matsushita Electric Ind Co Ltd | 半導体チップ実装方法 |
-
1990
- 1990-02-22 JP JP1623790U patent/JPH03109350U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62293750A (ja) * | 1986-06-13 | 1987-12-21 | Nippon Telegr & Teleph Corp <Ntt> | 配線板およびその製造方法 |
| JPH02181465A (ja) * | 1989-01-06 | 1990-07-16 | Matsushita Electric Ind Co Ltd | 半導体チップ実装方法 |