JPH03107472A - Method for plating metallic strip with molten metal - Google Patents

Abstract

PURPOSE:To freely adjust the width of a plating in accordance with the width of a metallic strip when an ultrasonic wave is radiated into the liq. reservoir formed at the tip of a metallic material to atomize the metal and the atomized metal is deposited on the metallic strip by sliding the mask of an ultrasonic wave focusing cover. CONSTITUTION:The solid plating metal 2 is successively melted in the vicinity of a traveling metallic strip S. An ultrasonic wave from an ultrasonic wave generator 3 is radiated into the obtained liq. reservoir 12 to atomize the molten metal. The generator 3 is provided with a mask 21 slidable on both sides of the front of a trough-shaped ultrasonic wave focusing cover 11, arranged in the cross direction of the metal 2 and formed into a linear focusing type. The atomized fine droplets 13 are deposited on the strip S to form a plating film. In this case, the mask 21 is slid in accordance with the width of the strip S. As a result, the ultrasonic wave is projected on the reservoir 12 in the width corresponding to that of the strip S.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method by which the surface of a metal strip can be continuously plated without using a molten metal bath.

[Conventional technology]

Conventionally, as a method of forming a plating film on the surface of a copper strip,
Hot-dip plating is a widely used method in which a copper strip is immersed in pre-molten plating metal.

In continuous hot-dip galvanizing, which is a typical example of this type of plating method, the copper strip is heat-treated and surface-cleaned in a pretreatment furnace, then immersed in a hot-dip zinc bath to form a plating film, and then pulled out of the bath. The removed copper strip is then subjected to surface conditioning such as adjusting the amount of plating deposited by gas throttling and galvanizing.

The hot-dip plated steel sheet thus obtained has a relatively beautiful surface and excellent corrosion resistance, so it is widely used in practical applications.

[Problem to be solved by the invention]

However, conventional hot dip galvanizing methods have various problems associated with the use of plating baths. Particularly recently, plated steel strips are required to have a more uniform, smooth, and beautiful surface than ever before, mainly for use in home appliances, automobile exterior panels, etc. There is also a high demand for new products such as, and as a result, problems with the quality of plated steel strips and the plating process itself using conventional hot-dip plating methods have become apparent. Some of such problems are discussed below.

(1) Fe from the surface of the copper strip is eluted into the plating bath,
Dross often occurs due to oxidation of the plating metal, and this must be pumped up and removed.
A loss of plated metal other than that attached to the copper strip occurs.

(2) Impurities are likely to be mixed into the plating bath, such as dross generated in the plating bath or debris from the bricks that make up the pot mixed into the bath, and these will adhere to the steel strip and deteriorate its appearance. .

(3) The trace elements in the plating metal ingots put into the bath, the components that adhere to the copper strip, and the components discharged outside the bath as by-products such as dross are different, so the necessary elements are contained as per the target. It is difficult to adjust and control the plating bath components.

For this reason, various plating defects such as poor plating adhesion and poor alloying of the galvanic material occur.

It is necessary to immerse steel mechanical parts, such as rolls for threading steel strips, roll support arms, and bearings, in a high-temperature, highly corrosive plating metal bath.

This causes problems such as erosion of these members, generation of dross accompanying this, and deterioration of the appearance of the plating surface due to erosion of the surface of the roll in the bath.

Furthermore, operation downtime is required to periodically repair or replace eroded or damaged parts of these mechanical parts, making it impossible to effectively and maximally utilize the production capacity of the equipment.

By using a passing roll in a plating bath, the group grooves of the roll are likely to be transferred to the plating surface, resulting in deterioration of the appearance.

High-temperature and multi-purpose work such as draining the bottom dross that accumulates at the bottom of the bath, discharging the top dross that accumulates on the bath surface, initial threading of the copper strip into the bath, and maintenance of rolls in the plating bath. Working near large amounts of plating baths places a heavy burden on the worker and is dangerous.

(7) Pot - Since only one type of plating can be performed per base, when performing various types of different plating, it is necessary to practice by pumping out the bath, or prepare a pot in which different types of plating metals are melted, and then It is necessary to carry out work such as moving the

(8) When producing double-sided plated materials and single-sided plated materials in a single facility, it is necessary to change the plating equipment for the pot part.
In addition to the burden on the equipment, a lot of time and effort are required for switching.

(9) It is difficult to perform special plating such as double-sided dissimilar plating, multilayer plating, and double-sided differential thickness plating.

In contrast to such conventional hot-dip plating methods, JP-A-61-2
In No. 07555, etc., a nozzle is brought close to the surface of the running copper strip, and the molten metal supplied from the molten metal tank is sucked out from the nozzle by the wet adhesive force between the molten metal and the surface of the copper strip, and is made to adhere to the copper strip. A solid plating method has been proposed.

This method applies coating technology for high-viscosity paint, etc., but the molten metal is fed from the molten metal tank to the nozzle, and the amount of plating deposited is controlled by the head pressure of the molten metal tank. Therefore, a change in the height of the bath surface in the tank results in variations in the amount of plating deposited, and this has the disadvantage of poor accuracy in the amount of plating deposited. Furthermore, in any case, since a molten metal bath corresponding to an immersion type plating bath is required, there are various problems as described above.

As described above, conventional hot-dip plating methods have various problems.

The present inventors have developed a method for such conventional hot-dip plating methods.
He devised a new plating method that did not require a molten metal bath at all, and proposed this as Japanese Patent Application No. 103302/1982 and Japanese Patent Application No. 264087/1983.

In the former method, a solid-phase plated metal material is continuously fed toward the surface of the copper strip through which the sheet is passed, and the tip side of the plated metal material is heated to melt copper by a heating melting device facing the copper strip. The copper strip is sequentially melted just before the surface of the copper strip, and the molten plating metal is continuously attached to the surface of the copper strip as a plating film.

In addition, in the latter method, the continuously supplied solid phase plated metal material is sequentially melted from the tip side near the steel strip through which the plate is passed, and the plated metal material is melted in the direction of the copper strip. The hot-dip plated metal is atomized by blowing high-temperature gas at a temperature higher than the melting point of the metal, and the atomized hot-dip plated metal is deposited as a plating film on the copper strip through which the plate is passed.

These methods melt the plating metal just before plating and deposit this molten metal as plating metal, and do not require a molten metal bath at all, so they solve the conventional problems associated with the use of plating baths. Furthermore, by controlling the feeding speed of the solid-phase plated metal material, there is an advantage that the amount of plating deposited can be controlled with high precision.

However, in the former plating method, the amount of plating metal supplied from the nozzle is determined by the gap between the nozzle tip and the plate surface, so the gap between the nozzle tip and the copper strip surface is approximately equal to the thickness of the plating film. It needs to be very fine.

However, it is difficult to maintain a constant minute gap between the plated copper strip and the nozzle because it is unavoidable that the copper strip undergoes some vibration during passing, and the shape of the strip may be defective.
This may lead to problems such as uneven plating thickness and collision between the nozzle and the plate.

In addition, the latter plating method does not cause the above problems because the gap between the nozzle and the plate surface is relatively wide, but it not only requires a large amount of gas to atomize the molten metal, but also requires a large amount of gas to atomize the molten metal. Since the diameter of the droplets of the molten metal is large, it is difficult to obtain a plated film with a fine structure, and the plated film has the disadvantage of poor workability, particularly press workability.

In view of these problems, the present invention makes it possible to continuously apply hot-dip plating to a metal strip without using a single molten metal bath as in the past, and to achieve highly accurate control and uniformity of the coating amount. The purpose of the present invention is to provide a new plating method that can produce a plating film with an even finer structure. Another object of the present invention is to enable the plating width to be freely changed according to the metal strip width in such a plating method.

[Means to solve the problem]

For this reason, the present invention sequentially melts the continuously supplied solid-phase plated metal material in the vicinity of the metal strip through which the plate is passed, and also melts the solid-phase plated metal material sequentially in the vicinity of the metal strip through which the plated metal material is passed. A line-focused ultrasonic generator equipped with a mask and placed along the width of the plated metal material emits ultrasonic waves to atomize it, and the resulting atomization causes minute droplets to adhere to the metal strip passing through the plate. In the plating process, by sliding the mask of the ultrasonic focusing cover in accordance with the width of the metal strip, ultrasonic waves are applied to the molten metal with a width corresponding to the width of the metal strip. Its first feature is that it emits radiation.

In addition, the present invention sequentially melts the continuously supplied solid-phase plated metal material in the vicinity of the metal strip through which the plated metal strip is passed, and also melts the solid-phase plated metal material that is continuously supplied in the vicinity of the metal strip through which the plated metal material is passed. Atomizing by emitting ultrasonic waves from a single point focusing type ultrasonic generator, and forming a plating film by adhering minute droplets of the atomization to a metal strip passing through the plate, and in the plating process. ,
By using the required number of ultrasonic generators arranged along the width direction of the plated metal material according to the width of the metal strip, ultrasonic waves are emitted to the molten metal in a width corresponding to the width of the metal strip. Its second feature is that it is made as follows.

In the present invention, it is preferable to divide the plating metal material into a plurality of parts in the width direction and supply the plating metal material in a width corresponding to the width of the metal strip to be plated. The width corresponds to the width of the plated metal material.

According to the present invention, the solid-phase plating metal material is melted just before plating and is plated on the metal strip through which the plate is passed, making it extremely easy to handle the plating metal and control the amount of adhesion. It is easy to use, and since the molten plated metal is atomized by ultrasonic waves, very fine molten metal droplets (particle size of several tens of μm) can be obtained.
Therefore, a plating film with a fine structure can be formed. Furthermore, since the distance between the plating metal material supply device and the metal strip to be passed through can be relatively wide, a uniform plating film can be obtained without being affected by vibrations of the plate or the like.

In addition, when using a line focusing type ultrasonic generation device, by moving the mask of the ultrasonic focusing cover, or when using a point focusing type ultrasonic generation bag 11, a plurality of devices can be used. By using the required number of devices, the radiation width of each ultrasonic wave is adjusted to the width of the metal strip, and the molten metal is atomized. This prevents unnecessary atomization of molten metal and also prevents troubles caused by minute droplets of excess molten metal.

In addition, when the plated metal material is divided into multiple parts in the width direction and the plated metal material is supplied in a width corresponding to the width of the metal strip, in other words, when the plated metal material is partially melted in the width direction, When ultrasonic waves hit a non-dissolution plated metal material, the reflected waves interfere with the ultrasonic waves emitted to the molten metal, reducing the effective output of the ultrasonic waves. In this regard, in the present invention, since the radiation width of the ultrasonic wave can be matched to the melting width of the plated metal, the problem caused by the reflected waves can be avoided.
High-power ultrasonic waves can be applied to molten metal.

〔Example〕

Figures 1 to 3 show an example in which the method of the present invention is applied to continuous plating of copper strips. Using a plated metal supply device having an opening, the solid phase plated metal is sequentially fed in the direction of the opening within the device, and melted sequentially from the tip side just before the opening by the heating melting mechanism, and superfluous is applied to the hot-dip plated metal. It is atomized by applying sound waves, and the minute droplets are made to adhere to the copper strip that passes through the plate.

In the figure, (IA) is a plating metal material supply device, (2)
1 is a plated metal material, (3) is an ultrasonic generator, and (S) is a copper strip through which the plate is passed.

The plated metal material supply device (IA) has a guide part (4) for guiding the plated metal material (2) upward (plate-shaped in this embodiment), and the guide part (4) Its tip (
It has an opening (5) at its upper end for forming a reservoir of molten plating metal.

In this embodiment, the guide part (4) is composed of a cylindrical body with an elongated cross section, and a heating element (6) (heater) for melting the plated metal material is installed at the tip side of the guide part (4). etc)
A heating melting mechanism is provided.

The plated metal material supply device (IA) is equipped with a feeding mechanism (not shown) consisting of a feeding roller or cylinder device, etc. in order to feed the solid phase plated metal material (2) toward the upper opening.
have.

In addition, the above-mentioned plating metal material supply device (IA) is
It is preferable to divide the plated metal material into a plurality of pieces in the width direction, so that each divided plated metal piece can be individually supplied and melted. Can supply and melt plated metal materials.

The ultrasonic generator (3) is a line focusing type device disposed along the width direction of the plated metal material, and is powered by a high frequency power source (7).
), a vibrator (8), an amplitude expander (9) (horn), a resonator (10), and a trough-like ultrasonic focusing cover (11)' (radiation direction changer).

The ultrasonic focusing cover (11) is configured such that the vibrations of the resonator (10) have opposite phases on the transducer side and the anti-oscillator side.
In order to overlap these radiated sound waves with opposite phases in the same phase on the surface of the liquid reservoir, an opening (5
), the ultrasonic waves are emitted obliquely from above, making it possible to focus the ultrasonic waves in a line on the molten metal surface of the liquid reservoir. The ultrasonic focusing cover (11) has a parabolic reflecting surface in order to appropriately focus the ultrasonic waves on the molten metal liquid surface.

A mask (21) for adjusting the opening width of the cover is slidably provided on both sides of the front surface of the ultrasonic focusing cover (11). This mask (21) is slidably held in a suitable guide mechanism (not shown) provided on the focusing cover. Note that this mask (21) may be made of any material as long as it can absorb ultrasonic waves.

Further, the resonator (10) needs to be made of a material that has low internal loss, high resonance sharpness, and high fatigue strength. As a material that meets these conditions,
A titanium alloy or an aluminum alloy is preferred. The vibration of this resonator (10) radiates sound waves into the atmospheric gas.

In this example, the copper strip (S) is supplied by the plating metal material supply device (I).
Thread the side of A) upward. In the guide section (4) of the plated metal material supply device (IA), the solid phase plated metal material (
2) are sequentially sent in the direction of the upper opening. Immediately before the opening, the melted metal is sequentially melted from the tip side, and the hot-dip plated metal forms a liquid reservoir (12) within the opening (5). Note that when the plated metal material (2) is divided into a plurality of pieces in the width direction, the plated metal material (2) is supplied and melted in a width corresponding to the width of the steel strip.

Then, ultrasonic waves are emitted from the ultrasonic generator (3) toward the liquid surface of the liquid reservoir (12), and the action of the ultrasonic waves causes the hot-dip metal in the liquid reservoir (12) to atomize into minute droplets. become

The ultrasonic generator (3) adjusts the position of the mask (21) so that the opening width of the ultrasonic focusing cover (11) matches the width of the copper strip in advance. As a result, ultrasonic waves 6- are radiated to the liquid reservoir (12) with a radius corresponding to the width of the steel strip.

In the ultrasonic generator (3), an ultrasonic transducer (8) is vibrated by a high frequency power source (7), and a resonator (10) is connected to the transducer (8) via an amplitude expander (9). vibrate. By appropriately selecting the frequency of this ultrasonic wave, the particle size of the fine metal powder can be changed. Ultrasonic waves are emitted by the vibration of the resonator (10) using the atmospheric gas as a medium. This radiated ultrasonic wave is focused on the surface of the liquid reservoir (12) by a radial direction converter (11) installed so that the ultrasonic waves are in phase and overlapped on the surface of the liquid reservoir (12).

When the focused ultrasound acts on the surface of the liquid reservoir (12), the liquid reservoir (12)
Capillary waves are formed on the surface of the liquid reservoir (12), which overcomes the surface tension and causes micro droplets (13) to flow from the surface of the liquid reservoir (12).
to jump up. In this example, ultrasonic waves are applied to the liquid reservoir (1
2), the generated microdroplets (13) are emitted from the copper band (
It flows in the S) direction and adheres as a plating film to the surface of the copper strip through which it passes. The micro droplets (13) have a particle size of about several tens of μm, and the plating film formed by such droplets has a very fine structure compared to a plating film formed by gas atomization or the like.

In addition, in this embodiment, the carrier gas may be made to flow in the direction of the steel strip from the ultrasonic generator (3) side, thereby more reliably directing the micro droplets (13) in the direction of the copper strip (S). can lead. This carrier gas contains micro droplets (13
) to adhere to the steel strip surface in a molten state, it is preferable that the temperature is higher than the melting point of the plating metal.

Further, it is preferable to preheat the copper strip (S) to be plated before plating, so that droplets of the hot-dip plated metal attached to the copper strip are spread out on the surface of the copper strip, resulting in a smooth and uniform plating film.

Furthermore, when ultrasonic waves are used under pressure, the density of the atmospheric gas becomes higher and the oscillation efficiency of the resonator (10) becomes better, so that the hot-dip metal can be atomized more efficiently. Therefore, by performing the process shown in FIG. 1 in a pressurized chamber, the plating process can be performed more efficiently.

In addition, according to what the present inventors confirmed through experiments, using an ultrasonic generator (3) as shown in FIG. 1, an argon gas atmosphere with an absolute pressure of 1 kg/cm2 and 9
9 kg/an 2 and frequency 10
When a resonator set at 0 kHz was vibrated and the half amplitude was approximately 16 μm, ultrasonic waves with sound pressure levels of 170 dB and 190 dB were obtained near the surface of the molten metal pool, respectively. Ta. In this experiment, a titanium alloy was used as the resonator and an aluminum alloy was used as the molten metal. Then, as a result of applying this ultrasonic wave to the surface of this aluminum alloy liquid reservoir, spherical particles with a particle size of 30 to 50 μm and an average particle size of 40 μm were obtained.

FIG. 4 shows an embodiment in which a single point focusing type device is used as the ultrasonic generator, and a plurality of ultrasonic generators (3a) to (3e) are arranged along the width direction of the plated metal material. It is arranged as follows. These ultrasonic generators (3a) to (3e)
The ultrasonic focusing cover (11') in ) is configured in a bowl shape, whereas the focusing cover in the device shown in FIG.

The rest of the structure and the operation of molten metal atomization are the same as those of the embodiment shown in FIG.

A plurality of single point focusing devices (3a) to (3e) as described above
), the ultrasonic generator to be used is selected according to the width of the copper strip, and the liquid reservoir (12) is
Ultrasonic waves are emitted. For example, in the case of a wide copper strip (S), devices (3a) to (3e) are used, and in the case of a narrow strip, devices (3b) to (3d) are used to emit ultrasonic waves.

5 to 14 respectively show other embodiments of the present invention, in which the ultrasonic generator is a line focusing type as shown in FIG. 1 and a single point focusing type as shown in FIG. It can be applied to any case.

Of these, FIG. 5 shows a gas supply port (14) for the carrier gas on the side of the opening (5) of the guide part (4) in order to guide the generated micro droplets (13) toward the surface of the copper strip using the carrier gas. ).

20 According to such a configuration, micro droplets generated by ultrasonic radiation to the liquid reservoir (12) are transported through the gas supply port (1) on the side of the opening.
The carrier gas from step 4) is guided toward the copper strip, and the copper strip is reliably attached to the surface of the copper strip.

In this example, since a carrier gas is used, the radial direction converter (11) of the ultrasonic generator (3) is connected to the liquid reservoir (1).
2), and ultrasonic waves are applied perpendicularly to the liquid surface, but the invention is not necessarily limited to this. For example, as shown in FIG. 1, ultrasonic waves may be applied from an oblique direction.

Note that other conditions and the like are the same as those described in the embodiment shown in FIG.

Figure 6 shows the plating metal material (2) supplied by the plating metal material supply device (IC) being melted into the opening by a heating device (15) (heater, etc.) provided outside the opening. A liquid reservoir (12) of plated metal is formed, and ultrasonic waves are radiated into this liquid reservoir (12).

In this embodiment, the plated metal material supply device (IC) is provided with a preheating mechanism consisting of a heating body (6') (heater, etc.) for preheating the plated metal material on the tip side of its guide part (4). It is being

Note that other conditions and the like are the same as those described in FIG.

Figures 7 and 8 show the guide section (4) for guiding the molten plated metal.
) through the opening (5) of the hot-dip metal flow (
16) is atomized by emitting ultrasonic waves, and Figure 7 shows that the plated metal material (2) is melted by the heating melting mechanism (heating body (6)) of the plated metal material supply device (ID). Figure 8 shows the plated metal material (2).
This is a type in which the liquid is melted by a heating device (15) facing the opening (5).

Note that other configurations, conditions, etc. are the same as in the embodiment described above.

The embodiment shown in FIG. 9 has a gas supply port (1) on the side of the opening (5).
7), and by blowing high-temperature gas at a temperature higher than the melting point of the plated metal material in the direction of the copper strip (S) from the gas supply port (17), the hot-dip plated metal discharged from the opening (5) is directed in the direction of the copper strip. This hot-dip metal flow (16
) is designed to emit ultrasonic waves.

Further, in the embodiment shown in FIG. 10, as in FIG. 9, the opening (5)
A gas supply port (17) is provided on the side of the gas supply port (
17) by blowing high-temperature gas at a temperature higher than the melting point of the plated metal material in the direction of the copper strip, the tip of the plated metal material (2) supplied from the opening (5) is melted, and the hot-dip plated metal is heated to the high temperature. The plating metal stream (16) is forced to flow in the direction of the copper strip using gas, and ultrasonic waves are radiated to this plating metal flow (16). In this example, a plating metal material supply device (I
G) has a preheating mechanism similar to that shown in FIG. 6 in its guide portion (4).

As shown in Figures 9 and 10 above, by blowing high-temperature gas from the side of the opening, the melted state of the plated metal becomes uniform in the width direction, and the hot-dip plated metal is supplied in the width direction of the plate at a constant flow rate. can do. In other words, some degree of unevenness is unavoidable in the melting of plated metal materials, and for this reason, if hot-dip plated metal is allowed to flow naturally in the direction of the copper strip, the melting state will be uneven and the metal flow will be uneven. This causes the flow velocity to become inconsistent, leading to non-uniformity in the amount of adhesion in the longitudinal direction (board line direction). In this respect, in the above embodiment, the metal melting is made uniform in the width direction by gas spraying and is controlled at a constant flow rate, so that uniform plating is possible. In addition to the above-mentioned effects as in the embodiment shown in FIG. 10, in a system in which high-temperature gas acts to melt the plated metal material, the melting of the plated metal material can be made more uniform.

The above-mentioned high-temperature gas is usually a gas whose temperature is below the boiling point of the plated metal material and about the melting point + (50 to 150)"C. For example, when the plated metal material is Zn, it is usually 500°C. The above gases are used.

When hot-dip galvanizing a copper strip using these methods, it can be carried out, for example, under the following conditions.

Zn plate (plated metal material) thickness: 5+nm24- Zn plate thermal temperature: 410°C High-temperature gas temperature: 550°C High-temperature gas flow rate: 5m/s Gas supply loss slit @: 5+m+ Note that the embodiments shown in Figures 9 and 10 also , and other conditions are the same as in each of the above embodiments.

In the embodiments shown in FIGS. 11 and 12, the plating metal supply device (11()) (II) is arranged downward to allow the hot-dip metal to flow down by gravity, and the hot-dip metal flow (16) has sideways. Fig. 11 shows a type in which the plated metal material (2) is melted by the heating melting mechanism (heating body (6)) of the plated metal material supply device (IH). Figure 12 also shows plated metal materials (
2) is melted using a heating device (15) facing the opening (5). Note that other configurations, conditions, etc. are the same as in the embodiment described above.

In the embodiments shown in FIGS. 13 and 14, the molten plated metal is made to flow down along the slope guide (18) while being heated, and an electromagnetic force is applied to the molten plated metal flow (16) on the slope guide (18). By acting on the metal flow, the metal flow is urged in the flow direction and the slope guide (18
), and radiates ultrasonic waves to this metal stream.In this way, instead of letting the molten plated metal flow down as it is, it attaches the molten plated metal stream using electromagnetic force. By injecting the plated metal material in the form of a film, the distance between the plated metal material supply device and the metal strip to be passed through can be made relatively wide. Fig. 13 shows a type in which the plated metal material (2) is melted by the heating melting mechanism (heating body (6)) of the plated metal material supply device (IJ), and Fig. 14 shows the type in which the plated metal material (2) is melted through the opening. (5), and in each embodiment, from the opening (5) in the direction of the copper strip, there is a slope for flowing the hot-dip metal flow. A guide (18) is provided, and this slope guide (18) includes a heating element (19) for heating the plating metal flowing down.
A biasing device (20) is provided for biasing (accelerating) the plating metal flow in the direction of the copper strip by the action of electromagnetic force.

As this urging device (20), any suitable known means can be used, such as a traveling magnetic field type pump using a linear motor mechanism.

The guide surface (1) near the end of the slope guide (18)
80) is inclined slightly upward toward the steel strip, so that the hot-dip metal flow can be injected slightly upward toward the copper strip.

Note that other configurations, conditions, etc. are the same as in the above-described embodiment.

In the present invention, there are no restrictions on the direction in which the copper strip is threaded. That is, in each of the above embodiments, the copper strip is threaded upward, but it may be threaded downward, diagonally, or in some cases horizontally.

In addition, among the methods of each of the embodiments described above, in the methods shown in FIGS. 7 to 13, the molten metal does not form a liquid reservoir in the opening (5), so the molten metal flows onto the inner wall surface of the guide part. It is possible to appropriately avoid troubles such as inserting the plated metal material between the plated metal material and the continuous supply of the plated metal material.

Further, the plating film formed as described above may have slight unevenness in the amount of adhesion, and in order to make this unevenness uniform, a uniforming treatment can be performed using a surface conditioning device. As this surface conditioning device, for example, a conventional gas throttle nozzle type device, an ultrasonic vibration type device having an ultrasonic vibrator (so-called ultrasonic iron), etc. are used.

In addition, the plating process according to the present invention also improves the wettability of the plating,
To ensure adhesion, use a non-oxidizing atmosphere (e.g. N2
:5 to 25%, N2 = 80 to 95%). Also in the method of the present invention, it is preferable that the surface of the copper strip be as clean as possible before plating.

The plating method according to the present invention can be applied to various metal or alloy plating, for example, Zn plating of steel strip, A
Including n-Zn alloy plating, Co-Cr-Zn alloy plating (for example, 1%Co-1%16-Cr-Zn alloy plating), Al1-Mg-Zn alloy plating (for example, 5%An-0.6 %Mg-Zn alloy plating), AM-Si-Zn alloy plating (e.g. 55%Afi, -1.6%Si-Zn alloy plating)
, Si-Al1 alloy plating (e.g. 10% Si-
Al1 alloy plating), 5n-Pb alloy plating (e.g.
10%Sn-Pb alloy plating) etc. can be performed.

In addition, in the above embodiment, the plating metal material (2) is supplied only to one side of the copper strip (S), but in the case of double-sided plating of the copper strip, the device (1) is supplied to both sides of the steel strip. It goes without saying that the plates are placed on each surface and plating is performed on each surface. In this case, plating on both sides does not need to be performed at the same position in the line direction.

In addition, when plating both sides of the steel strip in the method of the present invention,
By arranging plating metal materials (2) having different compositions on both sides of the copper strip, double-sided dissimilar plating can be easily performed. For example, a steel plate having an Fe=Zn alloy plating film on one side (painted surface) and a Zn plating film on the other side (bare surface) can be obtained as an outer panel material for home appliances or the like.

In the above embodiments, plate-shaped metal materials (2) were used in all cases, but instead of this, for example, powder-like materials may be used. Even in this case, the plated metal material (2) is filled in the guide portion (4) and sent toward the nozzle by a suitable feeding means.

〔Effect of the invention〕

According to the present invention described above, a plating film made of molten metal can be continuously formed on a metal strip without using a molten metal bath, and the following advantages are obtained compared to the conventional method using a plating bath. It will be done.

(1) Since there is no dross generated when a plating bath is used, there is no loss of plating metal other than adhesion to the copper strip.

(2) Dross, impurities, etc. do not adhere to the surface, and the appearance is kept beautiful.

(3) Since the plating metal is directly welded, almost the same components as the plating metal material are plated, (4) (5) (6) (7) (8) The components in the plating film are uniform, and the components are Control becomes easier.

There is no need to use bath-immersed parts, and therefore there is no need to shut down operations to repair or replace eroded machine parts.

Since there is no need to use rolls in the bath, there is no deterioration in appearance due to transfer of roll groups.

This eliminates the need for discharging bottom dross and top dross, threading steel plates into the bath, and caring for rolls in the bath, significantly reducing the burden on the operator.

Even when performing various types of alloy plating, it is only necessary to replace the plating metal material supplied to the copper strip, and there is no need for major work such as changing baths or moving pots, so various types of plating can be performed easily. be.

Select the arrangement of plated metal materials, mode of supply, feeding speed, etc.
By changing, various types of plating can be easily performed, such as single-sided plating, multilayer plating, double-sided differential thickness plating, and double-sided plating of different types.

In addition to these advantages, the method uses a method in which the solid-phase plated metal material is fed, melted just before the plating area, and then adhered to the metal strip, making the handling of the plated material extremely easy. It is easy to use, and the amount of plating deposited can be controlled by the feeding speed of the solid-phase plated metal material, thereby ensuring a high degree of accuracy in the amount of plating.

In addition, since the present invention atomizes the molten plating metal material by the action of ultrasonic waves, it is possible to obtain extremely fine droplets of the hot-dip plating metal compared to conventional gas atomization methods, which are then attached to the surface of the metal strip. As a result, a highly dense film with excellent workability, especially press formability, can be obtained.

The method of the present invention also has the advantage of not requiring a large amount of gas unlike gas atomization.

Furthermore, the distance between the plated metal material supply device and the metal strip to be passed through can be kept relatively wide, and a uniform plating film can be obtained without being affected by vibrations of the plate, and collisions between the plate and the nozzle. Such troubles can be appropriately prevented.

In addition, when using a focusing type ultrasonic generator, by moving the mask of the ultrasonic focusing cover, or when using a point focusing type ultrasonic generator, the required number of devices can be adjusted. By using the device, it is possible to atomize the molten metal by adjusting the emission width of the ultrasonic waves to the width of the metal strip, which prevents unnecessary atomization of the molten metal and also eliminates the minute liquid of excess molten metal. Trouble caused by dripping can be prevented. In addition, when the plated metal material is divided into multiple parts in the width direction and the plated metal material is supplied and melted in a width corresponding to the metal strip width, when the ultrasonic wave hits the non-dissolved plated metal material, the reflection There is a problem that the waves interfere with the ultrasonic waves emitted to the molten metal side, reducing the effective output of the ultrasonic waves, but in the present invention, the emission width of the ultrasonic waves can be matched to the melting width of the plated metal. Therefore, the problem caused by the reflected waves can be avoided, and high-power ultrasonic waves can be applied to the molten metal. Thus, according to the present invention,
It becomes possible to perform appropriate plating treatment according to the width of the metal strip.

[Brief explanation of drawings]

1 to 3 show an embodiment in which a line focusing type ultrasonic generator is used in the present invention, in which FIG. 1 is a longitudinal sectional view, FIG. 2 is a perspective view, and FIG. is m-m in Figure 1
It is an arrow view along a line. FIG. 4 is a perspective view showing an embodiment using a single point focusing type ultrasonic generator. FIGS. 5 to 14 are longitudinal cross-sectional views showing other embodiments of the present invention. In the figure, (IA) to (ratio) are plated metal material supply devices, (2) are plated metal materials, (3), (3a) to (3
e) is an ultrasonic generator, (5) is an opening, (12) is a liquid reservoir, (13) is a micro droplet, (16) is a hot-dip metal flow,
(21) is a mask, and (S) is a copper band. JP-A-3-107472 (11) Figure 11 Figure 2 Figure 14 5

Claims (2)

[Claims] (1) Continuously supplied solid-phase plated metal material is sequentially melted near the metal strip through which the plate is passed, and this hot-dip plated metal is equipped with slideable masks on both sides of the front of the ultrasonic focusing cover. The plating metal material is atomized by emitting ultrasonic waves from a line-focused ultrasonic generator arranged along the width direction, and minute droplets from the atomization are attached to the metal strip passing through the plate. Forming a plating film, and during the plating process, emitting ultrasonic waves to the molten metal with a width corresponding to the width of the metal strip by sliding the mask of the ultrasonic focusing cover in accordance with the width of the metal strip. A method for hot-dip metal plating of metal strips. (2) The continuously supplied solid-phase plated metal material is sequentially melted near the metal strip through which the plate is passed, and multiple points are placed on the hot-dip plated metal along the width direction of the plated metal material. A focused ultrasonic generator emits ultrasonic waves to atomize the atomized micro droplets, which adhere to a metal strip passing through the plate to form a plating film, and in the plating process, the metal By using the required number of ultrasonic generators arranged along the width direction of the plated metal material according to the width of the strip,
A method for molten metal plating of a metal strip, characterized by emitting ultrasonic waves to the molten metal at a width corresponding to the width of the metal strip.