JPH0310694Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electronic device casing having a heat diffusion structure that equalizes the internal temperature distribution.

[Conventional technology]

If there is a heat generating element inside the casing of an electronic device, in order to prevent the heat from concentrating near the heating element, expose the heat dissipation plate with a part of it in contact with the heating element to the outside of the casing or make it contact the casing. The heat dissipation structure is effective.

[Problem that the invention attempts to solve]

However, depending on the housing structure or surrounding space constraints, the above-described heat dissipation structure may not be possible. The present invention aims to avoid a local temperature rise near the heat generation source in such a case by providing a heat diffusion structure that equalizes the temperature distribution inside the casing.

[Means for solving problems]

In the present invention, a floating heat dissipation plate is disposed inside a casing containing a heat generation source so that a part of the floating heat dissipation plate is close to the heat generation source, and the heat from the heat generation source is transferred to the casing by the heat dissipation plate. Although it is characterized by having a structure that diffuses inside, the details of its structure and operation will be explained together with the illustrated embodiments.

〔Example〕

FIG. 1 is a block diagram showing an embodiment of the present invention, and a
is a sectional view, and b is a plan view. In the figure, 1 is the housing,
2 is the front plate, 3 is the LCD (liquid crystal), 4 is the lamp,
5 is a light guide plate, and 6 is a heat sink. In this example, lamp 4
guide the light to the back of the LCD 3 through the light guide plate 5,
A case is illustrated in which the display pattern is visible through the window 7, and in this case, the lamp 4 becomes a heat source and the temperature around it rises. Therefore, the heat of the lamp 4 is widely diffused into the housing 1 by the heat radiating plate 6 to avoid a local temperature rise.

Since the heat dissipation plate 6 has a large area, through holes 8 etc. for switch operation are provided at various locations. In order to bring the heat sink 6 into a thermal floating state where it does not come into direct contact with either the heat source 4 or the housing 1, a support structure as shown in FIG. 2 is adopted, for example. In the same figure, 1
0 is a printed circuit board, 11 is a switch mounted there, 12 is its push button, 13 is a return sponge (elastic body), 14 is an acrylic board (front plate), 15
is its holder.

The holder 15 is for holding the acrylic plate by engaging the claws 16 of the acrylic plate 14, but in this example, the holder 15 and the sponge 13
A heat sink 6 is interposed between the two. When the holder 15 is made of resin, the heat dissipation plate 6 becomes thermally floating, diffusing the heat from the heat source 4 into the casing 1, and equalizing the internal temperature. However, the holder 15 may be made of metal, and in that case, the heat sink 6 may have the function of a holder.

[Effect of idea]

As described above, according to the present invention, there is no need to connect the heat source, the heat sink, or the housing, so even if a normal heat dissipation structure cannot be used, the generation of localized high temperature areas can be avoided, and the space is It is advantageous in terms of cost and workability.

[Brief explanation of drawings]

Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is a sectional view showing a specific example. In the figure, 1 is a housing, 2 is a front plate, 4 is a heat source, and 6 is a heat sink.

Claims (1)

[Scope of utility model registration request] A floating heat dissipation plate is disposed inside the casing containing the heat generation source so that a part of the floating heat dissipation plate is close to the heat generation source, and the heat from the heat generation source is diffused into the interior of the casing by the heat dissipation plate. An electronic device housing characterized by a structure.