JPH03106756U - - Google Patents
Info
- Publication number
- JPH03106756U JPH03106756U JP1550690U JP1550690U JPH03106756U JP H03106756 U JPH03106756 U JP H03106756U JP 1550690 U JP1550690 U JP 1550690U JP 1550690 U JP1550690 U JP 1550690U JP H03106756 U JPH03106756 U JP H03106756U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- semiconductor device
- sealed semiconductor
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1550690U JPH03106756U (fi) | 1990-02-19 | 1990-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1550690U JPH03106756U (fi) | 1990-02-19 | 1990-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106756U true JPH03106756U (fi) | 1991-11-05 |
Family
ID=31518809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1550690U Pending JPH03106756U (fi) | 1990-02-19 | 1990-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106756U (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012060314A1 (ja) * | 2010-11-02 | 2012-05-10 | 船井電機株式会社 | ディスク装置 |
-
1990
- 1990-02-19 JP JP1550690U patent/JPH03106756U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012060314A1 (ja) * | 2010-11-02 | 2012-05-10 | 船井電機株式会社 | ディスク装置 |