JPH03106745U - - Google Patents
Info
- Publication number
- JPH03106745U JPH03106745U JP1428190U JP1428190U JPH03106745U JP H03106745 U JPH03106745 U JP H03106745U JP 1428190 U JP1428190 U JP 1428190U JP 1428190 U JP1428190 U JP 1428190U JP H03106745 U JPH03106745 U JP H03106745U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- plastic sheet
- holding tape
- wafer holding
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1428190U JPH03106745U (de) | 1990-02-16 | 1990-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1428190U JPH03106745U (de) | 1990-02-16 | 1990-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106745U true JPH03106745U (de) | 1991-11-05 |
Family
ID=31517650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1428190U Pending JPH03106745U (de) | 1990-02-16 | 1990-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106745U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281001A (ja) * | 2006-04-03 | 2007-10-25 | Nec Electronics Corp | 半導体ウェーハの加工方法 |
| JPWO2016125841A1 (ja) * | 2015-02-07 | 2017-12-07 | 株式会社クリエイティブテクノロジー | 被加工物保持装置及びレーザカット加工方法 |
-
1990
- 1990-02-16 JP JP1428190U patent/JPH03106745U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281001A (ja) * | 2006-04-03 | 2007-10-25 | Nec Electronics Corp | 半導体ウェーハの加工方法 |
| JPWO2016125841A1 (ja) * | 2015-02-07 | 2017-12-07 | 株式会社クリエイティブテクノロジー | 被加工物保持装置及びレーザカット加工方法 |