JPH0310673Y2 - - Google Patents

Info

Publication number

JPH0310673Y2

JPH0310673Y2 JP12998186U JP12998186U JPH0310673Y2 JP H0310673 Y2 JPH0310673 Y2 JP H0310673Y2 JP 12998186 U JP12998186 U JP 12998186U JP 12998186 U JP12998186 U JP 12998186U JP H0310673 Y2 JPH0310673 Y2 JP H0310673Y2

Authority

JP

Japan

Prior art keywords

frame

semiconductor wafer

mounting

opening

cut lines

Prior art date

1986-08-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 16
• 235000012431 wafers Nutrition 0.000 description 14
• 239000002390 adhesive tape Substances 0.000 description 4
• 238000001746 injection moulding Methods 0.000 description 2
• 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000011156 evaluation Methods 0.000 description 1
• 229920000915 polyvinyl chloride Polymers 0.000 description 1
• 239000004800 polyvinyl chloride Substances 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1