JPH03106411U - - Google Patents

Info

Publication number
JPH03106411U
JPH03106411U JP1385590U JP1385590U JPH03106411U JP H03106411 U JPH03106411 U JP H03106411U JP 1385590 U JP1385590 U JP 1385590U JP 1385590 U JP1385590 U JP 1385590U JP H03106411 U JPH03106411 U JP H03106411U
Authority
JP
Japan
Prior art keywords
fixed surface
surface plate
plate
light source
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1385590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1385590U priority Critical patent/JPH03106411U/ja
Publication of JPH03106411U publication Critical patent/JPH03106411U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の厚み及び反り量測定装置を示
す平面図、第2図は第1図のA−A線断面図、第
3図及び第4図は従来の厚み及び反り量測定装置
を示す断面図である。 1……板、2……固定定盤、3……レーザー光
源、4……CCDカメラ、5……連結フレーム、
6……サーボモータ、7……ボールネジ。
Fig. 1 is a plan view showing the thickness and warpage measuring device of the present invention, Fig. 2 is a sectional view taken along the line A-A in Fig. 1, and Figs. 3 and 4 show the conventional thickness and warpage measuring device. FIG. 1...Plate, 2...Fixed surface plate, 3...Laser light source, 4...CCD camera, 5...Connection frame,
6... Servo motor, 7... Ball screw.

Claims (1)

【実用新案登録請求の範囲】 被測定対象物としての板を載置する固定定盤と
、 前記固定定盤の両側端部にそれぞれ水平状態に
対向させたレーザー光源及びCCDカメラと、 前記レーザー光源とCCDカメラとを同期させ
て前記固定定盤の水平方向に前・後進させる移動
機構とを有することを特徴とする板厚及び反り量
測定装置。
[Scope of Claim for Utility Model Registration] A fixed surface plate on which a plate as an object to be measured is placed; a laser light source and a CCD camera that are horizontally opposed to each other at both ends of the fixed surface plate; and the laser light source. A plate thickness and warpage measuring device comprising: a moving mechanism that synchronizes the fixed surface plate with a CCD camera and moves the fixed surface plate forward and backward in the horizontal direction.
JP1385590U 1990-02-15 1990-02-15 Pending JPH03106411U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1385590U JPH03106411U (en) 1990-02-15 1990-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1385590U JPH03106411U (en) 1990-02-15 1990-02-15

Publications (1)

Publication Number Publication Date
JPH03106411U true JPH03106411U (en) 1991-11-01

Family

ID=31517245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1385590U Pending JPH03106411U (en) 1990-02-15 1990-02-15

Country Status (1)

Country Link
JP (1) JPH03106411U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022539984A (en) * 2019-07-12 2022-09-14 エーエスエムエル ネザーランズ ビー.ブイ. Substrate shape measuring device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57119205A (en) * 1981-01-17 1982-07-24 Kawasaki Heavy Ind Ltd Measurement of sectional shape of plate-shaped body
JPH01250809A (en) * 1988-03-31 1989-10-05 Fujitsu Ltd Measuring instrument for curvature quantity of printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57119205A (en) * 1981-01-17 1982-07-24 Kawasaki Heavy Ind Ltd Measurement of sectional shape of plate-shaped body
JPH01250809A (en) * 1988-03-31 1989-10-05 Fujitsu Ltd Measuring instrument for curvature quantity of printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022539984A (en) * 2019-07-12 2022-09-14 エーエスエムエル ネザーランズ ビー.ブイ. Substrate shape measuring device

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