JPH03106204U - - Google Patents
Info
- Publication number
- JPH03106204U JPH03106204U JP1423890U JP1423890U JPH03106204U JP H03106204 U JPH03106204 U JP H03106204U JP 1423890 U JP1423890 U JP 1423890U JP 1423890 U JP1423890 U JP 1423890U JP H03106204 U JPH03106204 U JP H03106204U
- Authority
- JP
- Japan
- Prior art keywords
- mold member
- die
- housing mold
- die ring
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Extrusion Of Metal (AREA)
Description
第１図ないし第５図はこの考案のダイス組込み
解体装置の一実施例を示すもので、第１図はその
平面図、第２図は一部切欠正面図、第３図は第２
図の−線断面矢視図、第４図は第２図の−
線断面矢視図、第５図は作動状態を示す一部切
欠概略正面図である。第６図イは従来のダイス組
込み方法を示す部分断面図、第６図ロは金型の使
用状態を示す部分断面図である。
１……ダイス組込み解体装置、２……ダイリン
グ固定装置、３……収容金型部材受け装置、４…
…収容金型部材挾持移送装置、４１……ダイリン
グ、４２，４３，４４……収容金型部材。
Figures 1 to 5 show an embodiment of the die assembly and disassembly device of this invention, in which Figure 1 is a plan view thereof, Figure 2 is a partially cutaway front view, and Figure 3 is a
Figure 4 is a cross-sectional view taken along the line - of Figure 2.
5 is a partially cutaway schematic front view showing the operating state. FIG. 6A is a partial sectional view showing a conventional method of assembling a die, and FIG. 6B is a partial sectional view showing the state in which the mold is used. 1...Dice assembly and disassembly device, 2...Die ring fixing device, 3...Accommodating mold member receiving device, 4...
...accommodating mold member clamping and transferring device, 41...die ring, 42, 43, 44...accommodating mold member.
Claims (1)
固定装置と、 該固定装置に隣接配置され、ダイリング内に収
容されるダイス等の収容金型部材を横向き状態で
前記ダイリングと同軸上に支承する収容金型部材
受け装置と、 収容金型部材をその前後両端面においてダイリ
ング内を通して挾持し、該収容金型部材を受け装
置とダイリング内との間で軸線方向に移動せしめ
る収容金型部材挾持移送装置と、 からなるダイス組込み解体装置。[Claims for Utility Model Registration] A die ring fixing device that fixes a die ring in a sideways state, and a die ring fixing device that is arranged adjacent to the fixing device and holds a housing mold member such as a die accommodated in the die ring in a sideways state. A housing mold member receiving device is supported coaxially with the ring, and the housing mold member is passed through the die ring at both front and rear end surfaces to be held between the housing mold member receiving device and the die ring, and the housing mold member is supported in the axial direction between the housing mold member receiving device and the inside of the die ring. A die assembly and disassembly device comprising: a holding mold member clamping and transferring device for moving the housing mold member;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1423890U JPH0744323Y2 (en) | 1990-02-15 | 1990-02-15 | Die built-in dismantling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1423890U JPH0744323Y2 (en) | 1990-02-15 | 1990-02-15 | Die built-in dismantling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03106204U true JPH03106204U (en) | 1991-11-01 |
| JPH0744323Y2 JPH0744323Y2 (en) | 1995-10-11 |
Family
ID=31517608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1423890U Expired - Lifetime JPH0744323Y2 (en) | 1990-02-15 | 1990-02-15 | Die built-in dismantling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744323Y2 (en) |
-
1990
- 1990-02-15 JP JP1423890U patent/JPH0744323Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744323Y2 (en) | 1995-10-11 |