JPH0310537U - - Google Patents
Info
- Publication number
- JPH0310537U JPH0310537U JP1989071910U JP7191089U JPH0310537U JP H0310537 U JPH0310537 U JP H0310537U JP 1989071910 U JP1989071910 U JP 1989071910U JP 7191089 U JP7191089 U JP 7191089U JP H0310537 U JPH0310537 U JP H0310537U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- solder bumps
- circuit board
- mounting position
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071910U JPH0310537U (enExample) | 1989-06-19 | 1989-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071910U JPH0310537U (enExample) | 1989-06-19 | 1989-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310537U true JPH0310537U (enExample) | 1991-01-31 |
Family
ID=31609369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989071910U Pending JPH0310537U (enExample) | 1989-06-19 | 1989-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310537U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50152766U (enExample) * | 1975-02-10 | 1975-12-18 | ||
| JPS523767U (enExample) * | 1975-06-24 | 1977-01-11 | ||
| JP2014132682A (ja) * | 2014-03-14 | 2014-07-17 | Renesas Electronics Corp | 樹脂封止型半導体装置の製造方法 |
| USRE45931E1 (en) | 1999-11-29 | 2016-03-15 | Renesas Electronics Corporation | Method of manufacturing a semiconductor device |
-
1989
- 1989-06-19 JP JP1989071910U patent/JPH0310537U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50152766U (enExample) * | 1975-02-10 | 1975-12-18 | ||
| JPS523767U (enExample) * | 1975-06-24 | 1977-01-11 | ||
| USRE45931E1 (en) | 1999-11-29 | 2016-03-15 | Renesas Electronics Corporation | Method of manufacturing a semiconductor device |
| JP2014132682A (ja) * | 2014-03-14 | 2014-07-17 | Renesas Electronics Corp | 樹脂封止型半導体装置の製造方法 |