JPH03104864U - - Google Patents
Info
- Publication number
- JPH03104864U JPH03104864U JP1181290U JP1181290U JPH03104864U JP H03104864 U JPH03104864 U JP H03104864U JP 1181290 U JP1181290 U JP 1181290U JP 1181290 U JP1181290 U JP 1181290U JP H03104864 U JPH03104864 U JP H03104864U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holder portion
- probe
- fixing
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1181290U JPH03104864U (nl) | 1990-02-08 | 1990-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1181290U JPH03104864U (nl) | 1990-02-08 | 1990-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104864U true JPH03104864U (nl) | 1991-10-30 |
Family
ID=31515330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1181290U Pending JPH03104864U (nl) | 1990-02-08 | 1990-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104864U (nl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008107142A (ja) * | 2006-10-24 | 2008-05-08 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
-
1990
- 1990-02-08 JP JP1181290U patent/JPH03104864U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008107142A (ja) * | 2006-10-24 | 2008-05-08 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
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