JPH03104753U - - Google Patents

Info

Publication number
JPH03104753U
JPH03104753U JP1433990U JP1433990U JPH03104753U JP H03104753 U JPH03104753 U JP H03104753U JP 1433990 U JP1433990 U JP 1433990U JP 1433990 U JP1433990 U JP 1433990U JP H03104753 U JPH03104753 U JP H03104753U
Authority
JP
Japan
Prior art keywords
mounting part
element mounting
lead frame
frame
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1433990U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1433990U priority Critical patent/JPH03104753U/ja
Publication of JPH03104753U publication Critical patent/JPH03104753U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1433990U 1990-02-15 1990-02-15 Pending JPH03104753U (US07223432-20070529-C00017.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1433990U JPH03104753U (US07223432-20070529-C00017.png) 1990-02-15 1990-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1433990U JPH03104753U (US07223432-20070529-C00017.png) 1990-02-15 1990-02-15

Publications (1)

Publication Number Publication Date
JPH03104753U true JPH03104753U (US07223432-20070529-C00017.png) 1991-10-30

Family

ID=31517710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1433990U Pending JPH03104753U (US07223432-20070529-C00017.png) 1990-02-15 1990-02-15

Country Status (1)

Country Link
JP (1) JPH03104753U (US07223432-20070529-C00017.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019021684A (ja) * 2017-07-12 2019-02-07 株式会社東芝 半導体パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019021684A (ja) * 2017-07-12 2019-02-07 株式会社東芝 半導体パッケージ

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