JPH03104727U - - Google Patents
Info
- Publication number
- JPH03104727U JPH03104727U JP1287890U JP1287890U JPH03104727U JP H03104727 U JPH03104727 U JP H03104727U JP 1287890 U JP1287890 U JP 1287890U JP 1287890 U JP1287890 U JP 1287890U JP H03104727 U JPH03104727 U JP H03104727U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- resist
- jig
- flat plate
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1287890U JPH03104727U (en, 2012) | 1990-02-13 | 1990-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1287890U JPH03104727U (en, 2012) | 1990-02-13 | 1990-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104727U true JPH03104727U (en, 2012) | 1991-10-30 |
Family
ID=31516325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1287890U Pending JPH03104727U (en, 2012) | 1990-02-13 | 1990-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104727U (en, 2012) |
-
1990
- 1990-02-13 JP JP1287890U patent/JPH03104727U/ja active Pending