JPH03101544U - - Google Patents
Info
- Publication number
- JPH03101544U JPH03101544U JP935290U JP935290U JPH03101544U JP H03101544 U JPH03101544 U JP H03101544U JP 935290 U JP935290 U JP 935290U JP 935290 U JP935290 U JP 935290U JP H03101544 U JPH03101544 U JP H03101544U
- Authority
- JP
- Japan
- Prior art keywords
- package
- integrated circuit
- molding
- recessed portion
- attachment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 4
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP935290U JP2521478Y2 (ja) | 1990-02-01 | 1990-02-01 | 集積回路パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP935290U JP2521478Y2 (ja) | 1990-02-01 | 1990-02-01 | 集積回路パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03101544U true JPH03101544U (tr) | 1991-10-23 |
JP2521478Y2 JP2521478Y2 (ja) | 1996-12-25 |
Family
ID=31512957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP935290U Expired - Lifetime JP2521478Y2 (ja) | 1990-02-01 | 1990-02-01 | 集積回路パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2521478Y2 (tr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015195334A (ja) * | 2014-03-26 | 2015-11-05 | 株式会社デンソー | 半導体モジュール |
-
1990
- 1990-02-01 JP JP935290U patent/JP2521478Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015195334A (ja) * | 2014-03-26 | 2015-11-05 | 株式会社デンソー | 半導体モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP2521478Y2 (ja) | 1996-12-25 |