JPH03101540U - - Google Patents
Info
- Publication number
- JPH03101540U JPH03101540U JP923290U JP923290U JPH03101540U JP H03101540 U JPH03101540 U JP H03101540U JP 923290 U JP923290 U JP 923290U JP 923290 U JP923290 U JP 923290U JP H03101540 U JPH03101540 U JP H03101540U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- circuit board
- transistor
- bare chip
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Junction Field-Effect Transistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP923290U JPH03101540U (ro) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP923290U JPH03101540U (ro) | 1990-01-31 | 1990-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03101540U true JPH03101540U (ro) | 1991-10-23 |
Family
ID=31512837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP923290U Pending JPH03101540U (ro) | 1990-01-31 | 1990-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03101540U (ro) |
-
1990
- 1990-01-31 JP JP923290U patent/JPH03101540U/ja active Pending