JPH03101526U - - Google Patents
Info
- Publication number
- JPH03101526U JPH03101526U JP1990009226U JP922690U JPH03101526U JP H03101526 U JPH03101526 U JP H03101526U JP 1990009226 U JP1990009226 U JP 1990009226U JP 922690 U JP922690 U JP 922690U JP H03101526 U JPH03101526 U JP H03101526U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- semiconductor device
- type semiconductor
- hole
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990009226U JPH03101526U (xx) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990009226U JPH03101526U (xx) | 1990-01-31 | 1990-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03101526U true JPH03101526U (xx) | 1991-10-23 |
Family
ID=31512830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990009226U Pending JPH03101526U (xx) | 1990-01-31 | 1990-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03101526U (xx) |
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1990
- 1990-01-31 JP JP1990009226U patent/JPH03101526U/ja active Pending