JPH03101201U - - Google Patents
Info
- Publication number
- JPH03101201U JPH03101201U JP1010790U JP1010790U JPH03101201U JP H03101201 U JPH03101201 U JP H03101201U JP 1010790 U JP1010790 U JP 1010790U JP 1010790 U JP1010790 U JP 1010790U JP H03101201 U JPH03101201 U JP H03101201U
- Authority
- JP
- Japan
- Prior art keywords
- outsole
- seam
- band
- foot
- sole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009958 sewing Methods 0.000 claims description 3
- 238000010097 foam moulding Methods 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Description
図面は本考案のサンダルを示す斜視図である。
１……本底、１ａ……縫代部、１ｂ……凹溝、
２……バンド、２ａ……縫代部、３……縫糸。
The drawing is a perspective view of the sandal of the present invention. 1...Outsole, 1a...Seam allowance, 1b...Concave groove,
2...Band, 2a...Seam allowance, 3...Sewing thread.
Claims (1)
湾曲面を形成するとともに中底をかねる表面仕上
げを施した本底の上端周縁の縫代部に足の甲を覆
うバンドの周縁の縫代部を重ねて該両縫代部と前
記本底の周側壁に設けた凹溝間に縫糸を刺通して
綴じ着けてバンドと本底を一体的に縫合してなる
サンダル。 The upper surface is made of synthetic resin foam molding to form a curved surface that follows the sole of the foot, and the outer sole has a surface finish that also serves as the midsole.The seam allowance for the periphery of the band that covers the top of the foot is located at the seam allowance around the top edge of the outsole. The sandals are made by integrally sewing the band and the outsole by overlapping the two seam allowances and sewing threads between the seam allowances and the grooves provided on the circumferential side wall of the outsole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1010790U JPH03101201U (en) | 1990-02-02 | 1990-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1010790U JPH03101201U (en) | 1990-02-02 | 1990-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101201U true JPH03101201U (en) | 1991-10-22 |
Family
ID=31513701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1010790U Pending JPH03101201U (en) | 1990-02-02 | 1990-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101201U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4945748B1 (en) * | 1970-07-22 | 1974-12-05 | ||
| JPS635802B2 (en) * | 1978-05-31 | 1988-02-05 | Matsushita Electric Ind Co Ltd |
-
1990
- 1990-02-02 JP JP1010790U patent/JPH03101201U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4945748B1 (en) * | 1970-07-22 | 1974-12-05 | ||
| JPS635802B2 (en) * | 1978-05-31 | 1988-02-05 | Matsushita Electric Ind Co Ltd |
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