JPH0299561A - Optical aromatic copolymerized polycarbonate resin composition - Google Patents
Optical aromatic copolymerized polycarbonate resin compositionInfo
- Publication number
- JPH0299561A JPH0299561A JP63251430A JP25143088A JPH0299561A JP H0299561 A JPH0299561 A JP H0299561A JP 63251430 A JP63251430 A JP 63251430A JP 25143088 A JP25143088 A JP 25143088A JP H0299561 A JPH0299561 A JP H0299561A
- Authority
- JP
- Japan
- Prior art keywords
- copolymerized polycarbonate
- aromatic copolymerized
- resin composition
- optical
- polycarbonate resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 24
- 230000003287 optical effect Effects 0.000 title claims abstract description 22
- 239000000203 mixture Substances 0.000 title claims abstract description 15
- 229920005668 polycarbonate resin Polymers 0.000 title claims description 11
- 239000004431 polycarbonate resin Substances 0.000 title claims description 11
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 18
- 239000004417 polycarbonate Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- -1 organic acid ester Chemical class 0.000 claims abstract description 11
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 8
- 239000012760 heat stabilizer Substances 0.000 claims abstract description 6
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 3
- 239000003381 stabilizer Substances 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 abstract description 9
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 6
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 abstract description 6
- 235000013872 montan acid ester Nutrition 0.000 abstract description 5
- 239000011342 resin composition Substances 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000001993 wax Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 125000006267 biphenyl group Chemical group 0.000 description 3
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
- 241000156978 Erebia Species 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 150000004668 long chain fatty acids Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 2
- YKPAABNCNAGAAJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)propane Chemical compound C=1C=C(O)C=CC=1C(CC)C1=CC=C(O)C=C1 YKPAABNCNAGAAJ-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- XQOAPEATHLRJMI-UHFFFAOYSA-N 2-ethyl-4-[2-(3-ethyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(CC)=CC(C(C)(C)C=2C=C(CC)C(O)=CC=2)=C1 XQOAPEATHLRJMI-UHFFFAOYSA-N 0.000 description 1
- ZDRSNHRWLQQICP-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZDRSNHRWLQQICP-UHFFFAOYSA-N 0.000 description 1
- UEZQPLQZAUVRDZ-UHFFFAOYSA-N 2-tert-butyl-4-propylphenol Chemical compound CCCC1=CC=C(O)C(C(C)(C)C)=C1 UEZQPLQZAUVRDZ-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- IJWIRZQYWANBMP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-propan-2-ylphenyl)propan-2-yl]-2-propan-2-ylphenol Chemical compound C1=C(O)C(C(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)C)=C1 IJWIRZQYWANBMP-UHFFFAOYSA-N 0.000 description 1
- VHLLJTHDWPAQEM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-4-methylpentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CC(C)C)C1=CC=C(O)C=C1 VHLLJTHDWPAQEM-UHFFFAOYSA-N 0.000 description 1
- ZQTPHEAGPRFALE-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)hexan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCC)C1=CC=C(O)C=C1 ZQTPHEAGPRFALE-UHFFFAOYSA-N 0.000 description 1
- WCUDAIJOADOKAW-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)pentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCC)C1=CC=C(O)C=C1 WCUDAIJOADOKAW-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- VASHFXYQYXZKJA-UHFFFAOYSA-N C=1C=CC(C(C)C)(C=2C=CC(O)=CC=2)CC=1C(C)(C)C1=CC=C(O)C=C1 Chemical compound C=1C=CC(C(C)C)(C=2C=CC(O)=CC=2)CC=1C(C)(C)C1=CC=C(O)C=C1 VASHFXYQYXZKJA-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- ZMBUHRQOZGBLKH-UHFFFAOYSA-N OC1=CC=C(C=C1)C1(CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O)C(C)C Chemical compound OC1=CC=C(C=C1)C1(CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O)C(C)C ZMBUHRQOZGBLKH-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229920000402 bisphenol A polycarbonate polymer Polymers 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- GLOQRSIADGSLRX-UHFFFAOYSA-N decyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCC)OC1=CC=CC=C1 GLOQRSIADGSLRX-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- NMAKPIATXQEXBT-UHFFFAOYSA-N didecyl phenyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OC1=CC=CC=C1 NMAKPIATXQEXBT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- RRTXPTNZWBIAKG-UHFFFAOYSA-N ethyl-hexyl-trihydroxy-$l^{5}-phosphane Chemical compound CCCCCCP(O)(O)(O)CC RRTXPTNZWBIAKG-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 1
- 150000002646 long chain fatty acid esters Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004206 montan acid ester Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- FICPQAZLPKLOLH-UHFFFAOYSA-N tricyclohexyl phosphite Chemical compound C1CCCCC1OP(OC1CCCCC1)OC1CCCCC1 FICPQAZLPKLOLH-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N tristearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野・従来の技術)
近年、芳香族ポリカーボネートは透明性、機械的強度、
耐衝撃性に優れたエンジニアリングプラスチックスとし
て広く成形品として用いられている。特に、光学式ディ
スク基板用樹脂として広く用いられつつある。精密成形
の代表例として、読み取り可能な情報を得るため、この
ような光デイスク基板上にレーザー光を反射するか若し
くはレーザー光により相変化若しくは蒸散などの物理変
化を示す金属若しくは金属酸化物等の薄膜が記録若しく
は読み取りレーザー光ガイドとなるグループに設置され
ている。[Detailed Description of the Invention] (Industrial Field of Application/Prior Art) In recent years, aromatic polycarbonates have been improved in their transparency, mechanical strength,
It is widely used in molded products as an engineering plastic with excellent impact resistance. In particular, it is becoming widely used as a resin for optical disk substrates. As a typical example of precision molding, in order to obtain readable information, a metal or metal oxide that reflects laser light or exhibits a physical change such as phase change or evaporation due to laser light is formed on the optical disk substrate. A thin film is placed in a group to serve as a recording or reading laser light guide.
耐久力のある光学式ディスクを得るためには芳香族ポリ
カーボネート基板に設けられたグループがスタンバ−に
カッティングされたグループにより精密に転写されるこ
とが重要である。In order to obtain a durable optical disk, it is important that the groups provided on the aromatic polycarbonate substrate be precisely transferred by the groups cut into the stand bar.
グループが精密に転写され、且つ芳香族ポリカーボネー
ト樹脂が金型より脱離されるためには一般に離型剤を混
合することがよく知られている。また、ディスク成形の
際に流動性を向上するために樹脂を300°C以上に加
熱するため耐熱安定剤を混合することもよく知られてい
る。It is well known that a mold release agent is generally mixed in to ensure that the groups are accurately transferred and that the aromatic polycarbonate resin is released from the mold. It is also well known to mix a heat-resistant stabilizer in order to heat the resin to 300°C or higher in order to improve fluidity during disk molding.
一般に使用される離型剤としては、フッ素化合物、シリ
コン化合物、長鎖脂肪酸エステル、長鎖脂肪酸アミド、
長鎖脂肪酸の金属塩などがあり、また、一般に使用され
る耐熱安定剤としては、亜リン酸エステルヒンダードフ
ェノールがよく知られている。また、特開昭47−12
993ではポリカーボネートの熱安定性を改良するため
亜リン酸水素化合物も添加することが開示されているが
、光学用については全く開示されていない。Commonly used mold release agents include fluorine compounds, silicon compounds, long chain fatty acid esters, long chain fatty acid amides,
There are metal salts of long-chain fatty acids, and phosphite hindered phenol is well known as a commonly used heat stabilizer. Also, JP-A-47-12
No. 993 discloses the addition of a hydrogen phosphite compound to improve the thermal stability of polycarbonate, but does not disclose anything for optical use.
(発明が解決しようとする課題)
芳香族ポリカーボネートを高温で成形することが必要と
される光デイスク基板等の成形では耐熱安定剤や離型剤
が高温時に分解して成形表面にシルバーなどの外観不良
を引き起こすばかりでなく、これらの分解生成物が原因
となって光ディスクの耐久性を低下させる。(Problems to be Solved by the Invention) In the molding of optical disk substrates, etc., which requires molding aromatic polycarbonate at high temperatures, heat stabilizers and mold release agents decompose at high temperatures, resulting in silver or other appearance on the molded surface. These decomposition products not only cause defects, but also reduce the durability of the optical disc.
(課題を解決するための手段)
離型剤として高温時に分解生成を発生しにくいモンタン
酸エステルワックスと耐熱安定剤としてトリス(2,4
−ジターシャリ−ブチルフェニル)ホスファイトと2,
6−ジターシャリ−ブチルフェニル−4−ブロピオン酸
ステアリル(重量比2:1の混合物)を芳香族ポリカー
ボネート100重量部に対して各々0.005〜0.1
重量部、 0.001〜0.1重量部を加えることによ
り高温成形時に成形表面にシルバーなどの外観不良を引
き起こさず、耐久性の高い光デイスク基板が得られる事
実を見いだし、本発明に至ったものである。即ち、本発
明は、
(1)芳香族共重合ポリカーボネートに離型性化合物及
び耐熱安定剤を配合してなる光学用芳香族共重合ポリカ
ーボネート樹脂組成物。(Means for solving the problem) Montanic acid ester wax, which does not easily decompose at high temperatures, is used as a mold release agent, and Tris (2,4
-ditert-butylphenyl) phosphite and 2,
0.005 to 0.1 stearyl 6-ditertiary-butylphenyl-4-propionate (mixture in a weight ratio of 2:1) to 100 parts by weight of aromatic polycarbonate, respectively.
The inventors have discovered that by adding 0.001 to 0.1 parts by weight, a highly durable optical disk substrate can be obtained without causing appearance defects such as silver on the molded surface during high temperature molding, leading to the present invention. It is something. That is, the present invention provides: (1) An aromatic copolymerized polycarbonate resin composition for optical use, which is obtained by blending an aromatic copolymerized polycarbonate with a mold release compound and a heat-resistant stabilizer.
(2)芳香族共重合ポリカーボネートは下記の一般式(
I )、(II)、(III)で示されるビスフェノー
ルから選ばれる2種以上をモノマーとしてカーボネート
結合して得られる前記(1)記載の光学用芳香族共重合
ポリカーボネート樹脂組成物。(2) Aromatic copolymerized polycarbonate has the following general formula (
The optical aromatic copolymerized polycarbonate resin composition according to (1) above, which is obtained by carbonate bonding two or more selected from the bisphenols represented by I), (II), and (III) as monomers.
(R1、R2は水素又は枝分れを含む01〜c6のアル
キル基、又はシクロヘキサン環、又は芳香族炭化水素基
である。)
(Raはメチル基、エチル基、n−プロピル基、 1s
o−プロピル基、 tert−ブチル基である。)へは
枝分れを含む01〜C6のアルキル基である。(R1 and R2 are hydrogen or a branched alkyl group of 01 to C6, a cyclohexane ring, or an aromatic hydrocarbon group.) (Ra is a methyl group, ethyl group, n-propyl group, 1s
o-propyl group and tert-butyl group. ) is an alkyl group of 01 to C6 including branching.
(3)離型性化合物が有機酸エステルワックスである前
記(1)又は(2)記載の光学用芳香族共重合ポリカー
ボネート樹脂組成物。(3) The optical aromatic copolycarbonate resin composition according to (1) or (2) above, wherein the releasing compound is an organic acid ester wax.
(4)耐熱安定剤が有機ホスファイト系化合物である前
記(1)又は(2)又は(3)記載の光学用芳香族共重
合ポリカーボネート樹脂組成物。(4) The optical aromatic copolycarbonate resin composition according to (1), (2), or (3) above, wherein the heat-resistant stabilizer is an organic phosphite compound.
(5)芳香族共重合ポリカーボネート100重量部に対
して離型性化合物0.005〜0.1重量部及び耐熱安
定剤0.01〜0.1重量部からなる前記(1)又は(
2)又は(3)又は(4)記載の光学用芳香族共重合ポ
リカーボネート樹脂組成物である。(5) The above-mentioned (1) or (
The optical aromatic copolymerized polycarbonate resin composition described in 2), (3), or (4).
前記(2)記載の一般式(I)で示される構造を与える
ビスフェノール化合物としては、例えば、ビス−(4−
ヒドロキシフェニル)メタン、1,1−(4−ヒドロキ
シフェニル)エタン、1,1−ビス−(4−ヒドロキシ
フェニル)プロパン、2,2−ビス−(4−ヒドロキシ
フェニルシンプロパン(ビスフェノールA)、2,2−
ビス−(4−ヒドロキシフェニル)ブタン、2,2−ビ
ス−(4−ヒドロキシフェニル)ペンタン、2,2−ビ
ス−(4−ヒドロキシフェニル)−3,メチルブタン、
2,2−ビス−(4−ヒドロキシフェニル)ヘキサン、
2,2−ビス−(4−ヒドロキシフェニル)−4−メチ
ルペンタン、4,41−ジヒドロキシ−2,2,2−ト
リフェニルエタン、1,1−ビス−(4−ヒドロキシフ
ェニル)シクロヘキサン、2,2−ビス−(4−ヒドロ
キシ、3−クロロフェニル)プロパン等が挙げられる。Examples of the bisphenol compound giving the structure represented by the general formula (I) described in (2) above include bis-(4-
hydroxyphenyl)methane, 1,1-(4-hydroxyphenyl)ethane, 1,1-bis-(4-hydroxyphenyl)propane, 2,2-bis-(4-hydroxyphenylsynpropane (bisphenol A), 2 ,2-
Bis-(4-hydroxyphenyl)butane, 2,2-bis-(4-hydroxyphenyl)pentane, 2,2-bis-(4-hydroxyphenyl)-3,methylbutane,
2,2-bis-(4-hydroxyphenyl)hexane,
2,2-bis-(4-hydroxyphenyl)-4-methylpentane, 4,41-dihydroxy-2,2,2-triphenylethane, 1,1-bis-(4-hydroxyphenyl)cyclohexane, 2, Examples include 2-bis-(4-hydroxy, 3-chlorophenyl)propane.
また、−数式(II)で示される構造を与えるビスフェ
ノール化合物としては、例えば、2,2−ビス−(4−
ヒドロキシ−3−メチルフェニル)プロパン、2,2−
ビス−(4−ヒドロキシ−3−エチルフェニル)プロパ
ン、2,2−ビス−(4−ヒドロキシ−3−イソプロピ
ルフェニル)プロパン、2,2−ビス−(4−ヒドロキ
シ−3−sec、ブチルフェニル)プロパン、2,2−
ビス−(4−ヒドロキシ−3−ターシャリ−ブチルフェ
ニル)プロパン等が挙げられる。In addition, as a bisphenol compound giving the structure represented by formula (II), for example, 2,2-bis-(4-
Hydroxy-3-methylphenyl)propane, 2,2-
Bis-(4-hydroxy-3-ethylphenyl)propane, 2,2-bis-(4-hydroxy-3-isopropylphenyl)propane, 2,2-bis-(4-hydroxy-3-sec, butylphenyl) Propane, 2,2-
Bis-(4-hydroxy-3-tert-butylphenyl)propane and the like can be mentioned.
また、−数式(III)で示される構造を与えるビスフ
ェノール化合物としては、例えば、1,1′−ビス−(
4−ヒドロキシフェニル)−パラ−ジイソプロピルベン
ゼン、1,1′−ビス−(4−ヒドロキシフェニル)−
メタ−ジイソプロピルベンゼンが挙げられる。尚、本発
明の共重合体のビスフェノールA−ポリカーボネート換
算の粘度平均分子量は13,000〜30,000が好
ましい。13,000未満では共重合が体脆くなり、3
0.000を越えると溶融流動性が悪くなり成形性が劣
る′。本発明のポリカーボネート共重合体を製造する方
法としては、−数式(I )、(II)、(III)か
ら選ばれる2種又は3種のモノマーをジフェニルカーボ
ネートとエステル交換し溶融重縮合で合成する方法又は
ホスゲンを用いて界面重合ないし溶液重合させる方法が
提案される。In addition, as a bisphenol compound giving the structure represented by formula (III), for example, 1,1'-bis-(
4-hydroxyphenyl)-para-diisopropylbenzene, 1,1'-bis-(4-hydroxyphenyl)-
Meta-diisopropylbenzene is mentioned. The copolymer of the present invention preferably has a viscosity average molecular weight in terms of bisphenol A-polycarbonate of 13,000 to 30,000. If it is less than 13,000, the copolymerization becomes brittle, and the
If it exceeds 0.000, melt fluidity will be poor and moldability will be poor. The method for producing the polycarbonate copolymer of the present invention includes: - transesterifying two or three monomers selected from formulas (I), (II), and (III) with diphenyl carbonate and synthesizing them by melt polycondensation; A method of interfacial polymerization or solution polymerization using phosgene is proposed.
使用される耐熱安定剤の亜リン酸エステルは例えば、ト
リブチルホスファイト、トリス(2−エチルヘキシル)
、ホスファイト、トリデシルホスファイト、トリステア
リルホスファイト、トリフェニルホスファイト、トリク
レジルホスファイト、トリス(ノニルフェニル)ホスフ
ァイト、トリス(2,4−ジ−t−ブチルフェニル)ホ
スファイト、デシル−ジフェニルホスファイト、フェニ
ル−ジー2.エチルへキシルホスファイト、フェニル−
ジデシルホスファイト、トリシクロヘキシルホスファイ
ト、ジステアリル−ペンタエリスリチル−ジホスファイ
ト、ジフェニル、ペンタエリスリチル−ジホスファイト
、トリス(混合モノ−、ジフェニル)ホスファイト等が
挙げられるが、その中でもトリフェニルホスファイト、
トリス(ノニルフェニル)ホスファイト、トリス(混合
モノ−、ジフェニル)ホスファイト、トリス(2,4−
ジ−t−ブチルフェニル)ホスファイトが好ましく、さ
らに好ましくは、トリス(2,4−ジターシャリ−ブチ
ルフェニル)ホスファイトと2,6−ジターシャリ−ブ
チル−4−プロピオン酸ステアリルを重量比で2:1で
混合した耐熱安定剤がよい。Phosphite esters of heat-resistant stabilizers used include, for example, tributyl phosphite and tris(2-ethylhexyl).
, phosphite, tridecyl phosphite, tristearylphosphite, triphenyl phosphite, tricresyl phosphite, tris (nonylphenyl) phosphite, tris (2,4-di-t-butylphenyl) phosphite, decyl -diphenyl phosphite, phenyl di2. Ethylhexylphosphite, phenyl-
Didecyl phosphite, tricyclohexyl phosphite, distearyl-pentaerythrityl-diphosphite, diphenyl, pentaerythrityl-diphosphite, tris (mixed mono-, diphenyl) phosphite, etc., among which triphenyl phosphite,
Tris (nonylphenyl) phosphite, tris (mixed mono-, diphenyl) phosphite, tris (2,4-
Di-t-butylphenyl) phosphite is preferred, and more preferably tris(2,4-ditertiary-butylphenyl) phosphite and stearyl 2,6-ditertiary-butyl-4-propionate in a weight ratio of 2:1. A heat stabilizer mixed with
一方、使用される離型性化合物は、カルナバワックス、
ヘキストワックス、モンタン酸エステルワックス、シリ
コンオイル、ステアリン酸、パルミチン酸、ステアリン
酸エステル、グリセリントリステアレート、ステアリン
酸カルシウム、ステアリン酸亜鉛などが挙げられるが、
その中でもモンタン酸エステルワックスが好ましい。On the other hand, the mold release compounds used are carnauba wax,
Hoechst wax, montanic acid ester wax, silicone oil, stearic acid, palmitic acid, stearic acid ester, glycerin tristearate, calcium stearate, zinc stearate, etc.
Among these, montan acid ester wax is preferred.
本発明を実施例によって限定されるものではない。尚、
以下の実施例に示した粘度平均分子量とは、ビスフェノ
ールA・ポリカーボネートの20’Cにおける塩化メチ
レン溶液を用いて測定して固有粘度[11]と分子量M
vの関係式として得られた[f11= 1.11 X
10− ’(Mv)0−82[イ、ミイラー、アンド、
オー、バイエル;米国特許2.999,844(191
6月の式を用い固有粘度がら計算したビスフェノールA
・ポリカーボネート換算の分子量である。The present invention is not limited to the examples. still,
The viscosity average molecular weight shown in the examples below refers to the intrinsic viscosity [11] and the molecular weight M
[f11= 1.11 X obtained as the relational expression of v
10-'(Mv)0-82 [I, Mummy, And,
Oh, Bayer; U.S. Pat. No. 2,999,844 (191
Bisphenol A calculated from intrinsic viscosity using June's formula
- Molecular weight in terms of polycarbonate.
(実施例)
実施例1
4.4′−ジヒドロキシ−2,2,2−トリフェニルエ
タン174重量部(50mo1%)と2,2−ビス−(
4−ヒドロキシ−3−ターシャリ−ブチルフェニル)プ
ロパン154重量部(50mo1%)とジフェニルカー
ボネート264重量部を31三つロフラスコに入れ、脱
気、N2パージを5回繰り返した後、シリコンバス16
0°Cで窒素を導入しながら溶融させた。溶融したら、
カーボネート化触媒である水素化ホウ素カリウムを予め
フェノールに溶かした溶液(仕込んだビスフェノール全
量に対して10−3mo1%量)を加え、160’C,
N2下。(Example) Example 1 174 parts by weight (50 mo 1%) of 4,4'-dihydroxy-2,2,2-triphenylethane and 2,2-bis-(
154 parts by weight (50 mo1%) of 4-hydroxy-3-tert-butylphenyl propane and 264 parts by weight of diphenyl carbonate were placed in a 31-lough flask, and after repeating degassing and N2 purge 5 times, they were placed in a silicon bath 16
It was melted at 0°C while nitrogen was being introduced. Once melted,
A solution of potassium borohydride, which is a carbonation catalyst, dissolved in phenol (10-3 mo1% amount based on the total amount of bisphenol charged) was added, and the mixture was heated at 160'C.
N2 lower.
30分撹はん醸成した。次に、同温度下IQQTorr
にし30分撹はんした後、同温度下でさらに1QQTo
rrに(,30分撹はんした後、同温度下でさらに5Q
Torrに減圧し、30分反応させた。次に徐々に温度
を220°Cまで上げ60分反応させ、ここまでの反応
でフェノール留出理論量の80%を留出させた。しかる
後、同温度下で1QTorrに減圧し30分反応させ温
度を徐々に270°Cに上げ、30分反応させた。さら
に同温度下で5Torrに減圧し30分反応させ、フェ
ノール留出理論量のほぼ全量を留出させ前縮合を終えた
。次に同温度下でQ、l−Q、3Torrで2時間後縮
合させた。窒素下にて生成物のポリマーを取り出し冷却
した後、ジクロルメタンを溶媒に用いて20°Cにて溶
液粘度を測定した。この値から算出した粘度平均分子量
Mv=21,500であった。ここで得られた共重合ポ
リカーボネート100重量部に対して離型性化合物とし
てモンタン酸エステルワックス(ヘキスト社製)0.0
5重量部とトリス(2,4−ジターシャリブチルフェニ
ル)ホスファイト(Mark2112 、アデカ・アー
ガス社製)と2,6−ジターシャリブチル−4−プロピ
オン酸ス、テアリル(MarkAD−50、アデカ・ア
ーガス社製)を重量比2:1で混合し・た耐熱安定剤を
0.05重量部を配合し、20Φベント押出機で230
’C’″C′練込みベレットとした。The mixture was stirred and brewed for 30 minutes. Next, under the same temperature IQQTorr
After stirring for 30 minutes, add another 1QQTo at the same temperature.
(After stirring for 30 minutes, add 5Q at the same temperature.
The pressure was reduced to Torr and the reaction was carried out for 30 minutes. Next, the temperature was gradually raised to 220° C. and the reaction was continued for 60 minutes, and 80% of the theoretical amount of phenol was distilled out through the reaction up to this point. Thereafter, the pressure was reduced to 1 Q Torr at the same temperature, and the reaction was carried out for 30 minutes.The temperature was gradually raised to 270°C, and the reaction was carried out for 30 minutes. Further, at the same temperature, the pressure was reduced to 5 Torr and the reaction was allowed to proceed for 30 minutes, and almost all of the theoretical amount of phenol was distilled out to complete the precondensation. Next, condensation was carried out at the same temperature for 2 hours at Q, l-Q, and 3 Torr. After the product polymer was taken out and cooled under nitrogen, the solution viscosity was measured at 20°C using dichloromethane as a solvent. The viscosity average molecular weight Mv calculated from this value was 21,500. Montanic acid ester wax (manufactured by Hoechst) 0.0 as a mold release compound per 100 parts by weight of the copolymerized polycarbonate obtained here.
5 parts by weight, tris(2,4-ditertiarybutylphenyl) phosphite (Mark 2112, manufactured by Adeka Argus), and 2,6-ditertiarybutyl-4-propionate, thearyl (MarkAD-50, manufactured by Adeka Argus). 0.05 parts by weight of a heat-resistant stabilizer made by mixing 2:1 weight ratio of
It was made into a 'C'''C' kneaded pellet.
実施例2
1.1′−ビス−(4−ヒドロキシフェニル)−メタ−
ジイソプロピルベンゼン116重量部(40m1%)と
1,1′−ビス−(4−ヒドロキシフェニル)−バラ−
ジイソプロピルベンゼン125重量部(30m1%)と
4,4′−ジヒドロキシ−2,2,2−トリフェニルエ
タン104重量部(30m1%)とジフェニルカーボネ
ート264重量部を実施例1と同様の方法で合成した。Example 2 1.1'-bis-(4-hydroxyphenyl)-meta-
116 parts by weight (40ml 1%) of diisopropylbenzene and 1,1'-bis-(4-hydroxyphenyl)-
125 parts by weight (30 m1%) of diisopropylbenzene, 104 parts by weight (30 m1%) of 4,4'-dihydroxy-2,2,2-triphenylethane, and 264 parts by weight of diphenyl carbonate were synthesized in the same manner as in Example 1. .
粘度平均分子量は
Mv=20,300であった。これを実施例1と同様の
離型性化合物と耐熱安定剤を各々同量配合してベレット
とした。The viscosity average molecular weight was Mv=20,300. This was mixed with the same amount of the same release compound and heat-resistant stabilizer as in Example 1 to form a pellet.
比較例1及び2
比較のため実施例1及び2で合成した共重合ポリカーボ
ネートに離型性化合物及び耐熱安定剤が無配合のものを
夫々実施例と対応した比較例として示す。Comparative Examples 1 and 2 For comparison, copolymerized polycarbonates synthesized in Examples 1 and 2 without a mold release compound and a heat-resistant stabilizer are shown as comparative examples corresponding to the respective examples.
上記のようにして製造したポリカーボネート共重合体に
記録膜を付けて、光記録特性評価した。A recording film was attached to the polycarbonate copolymer produced as described above, and the optical recording properties were evaluated.
即ち、実施例1及び2に記載のポリカーボネート共重合
体を射出成形機(各機製作所製、ダイナメルター)を用
いて直径130mm、厚さ1.2mmの円盤状基板に成
形し、この基板上にTb23.5 Fe64.2CO1
2,3(原子%)の合金ターゲットを用いてスパッタリ
ング装置(RFスパッタリング装置、日本真空(株)製
)中で光磁気記録膜を1,000人形成した。この記録
膜上に本出願人による特開昭60−177449号に記
載の無機ガラスの保護膜i、ooo人を上記と同じスパ
ッタリング装置を用いて形成した。結果は表1の通りで
あった。That is, the polycarbonate copolymers described in Examples 1 and 2 were molded into a disc-shaped substrate with a diameter of 130 mm and a thickness of 1.2 mm using an injection molding machine (Kamaki Seisakusho, Dynamelter), and on this substrate. Tb23.5 Fe64.2CO1
Magneto-optical recording films were formed by 1,000 people in a sputtering device (RF sputtering device, manufactured by Nihon Shinku Co., Ltd.) using an alloy target of 2.3 (atomic %). On this recording film, inorganic glass protective films i and ooo described in Japanese Patent Application Laid-open No. 177449/1983 by the present applicant were formed using the same sputtering apparatus as above. The results are shown in Table 1.
(注1)CN比=書き込みパワー7mW(ミリワット)
、読み取りパワー1mW、キャリア周波数IMHz、分
解能帯域中30KHzで測定
(注2)ON変化率(%)=初期CN比に対する60°
C,90RH%条件下で30日経過後のCN比の低下度
(発明の効果)
表1かられかるように、特定の離型性化合物と耐熱安定
剤を配合した光学用芳香族共重合ポリカーボネート樹脂
組成物から耐久性の高い光デイスク基板を得ることがで
きる。(Note 1) CN ratio = writing power 7mW (milliwatt)
, measured at read power 1mW, carrier frequency IMHz, and 30KHz in resolution band (Note 2) ON change rate (%) = 60° with respect to initial CN ratio
C, degree of decrease in CN ratio after 30 days under 90RH% conditions (effect of the invention) As seen from Table 1, optical aromatic copolymerized polycarbonate resin blended with a specific mold release compound and a heat resistant stabilizer. A highly durable optical disk substrate can be obtained from the composition.
Claims (5)
び耐熱安定剤を配合してなる光学用芳香族共重合ポリカ
ーボネート樹脂組成物。(1) An aromatic copolymerized polycarbonate resin composition for optical use, which is prepared by blending an aromatic copolymerized polycarbonate with a mold release compound and a heat-resistant stabilizer.
I )、(II)、(III)で示されるビスフェノールから
選ばれる2種以上をモノマーとしてカーボネート結合し
て得られる特許請求の範囲第1項記載の光学用芳香族共
重合ポリカーボネート樹脂組成物。 ▲数式、化学式、表等があります▼( I ) (R_1、R_2は水素又は枝分れを含むC_1〜C_
6のアルキル基、又はシクロヘキサン環、又は芳香族炭
化水素基である。) ▲数式、化学式、表等があります▼(II) (R_3はメチル基、エチル基、n−プロピル基、is
o−プロピル基、tert−ブチル基である。) ▲数式、化学式、表等があります▼(III) R_4は枝分れを含むC_1〜C_6のアルキル基であ
る。(2) Aromatic copolymerized polycarbonate has the following general formula (
The optical aromatic copolymerized polycarbonate resin composition according to claim 1, which is obtained by carbonate bonding of two or more bisphenols selected from bisphenols represented by I), (II), and (III) as monomers. ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) (R_1, R_2 are C_1 to C_ containing hydrogen or branching
6, a cyclohexane ring, or an aromatic hydrocarbon group. ) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) (R_3 is a methyl group, ethyl group, n-propyl group, is
They are o-propyl group and tert-butyl group. ) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (III) R_4 is an alkyl group of C_1 to C_6 including branching.
許請求の範囲第1項又は第2項記載の光学用芳香族共重
合ポリカーボネート樹脂組成物。(3) The optical aromatic copolymerized polycarbonate resin composition according to claim 1 or 2, wherein the mold release compound is an organic acid ester wax.
許請求の範囲第1項又は第2項記載の光学用芳香族共重
合ポリカーボネート樹脂組成物。(4) The optical aromatic copolymerized polycarbonate resin composition according to claim 1 or 2, wherein the heat-resistant stabilizer is an organic phosphite compound.
して離型性化合物0.005〜0.1重量部及び耐熱安
定剤0.01〜0.1重量部からなる特許請求の範囲第
1項又は第2項又は第3項又は第4項記載の光学用芳香
族共重合ポリカーボネート樹脂組成物。(5) Claim 1 comprising 0.005 to 0.1 parts by weight of a mold release compound and 0.01 to 0.1 parts by weight of a heat stabilizer based on 100 parts by weight of the aromatic copolymerized polycarbonate; or The optical aromatic copolymerized polycarbonate resin composition according to item 2, item 3, or item 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63251430A JPH0299561A (en) | 1988-10-05 | 1988-10-05 | Optical aromatic copolymerized polycarbonate resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63251430A JPH0299561A (en) | 1988-10-05 | 1988-10-05 | Optical aromatic copolymerized polycarbonate resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0299561A true JPH0299561A (en) | 1990-04-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63251430A Pending JPH0299561A (en) | 1988-10-05 | 1988-10-05 | Optical aromatic copolymerized polycarbonate resin composition |
Country Status (1)
Country | Link |
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JP (1) | JPH0299561A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH041229A (en) * | 1990-04-19 | 1992-01-06 | Daicel Chem Ind Ltd | Production of polycarbonate |
JPH041227A (en) * | 1990-04-19 | 1992-01-06 | Daicel Chem Ind Ltd | Production of polycarbonate |
JPH0415221A (en) * | 1990-05-08 | 1992-01-20 | Daicel Chem Ind Ltd | Preparation of polycarbonate |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51117750A (en) * | 1975-04-10 | 1976-10-16 | Mitsubishi Chem Ind Ltd | Polycarbonate resin compositions |
JPS5476651A (en) * | 1977-11-30 | 1979-06-19 | Mitsubishi Chem Ind Ltd | Polycarbonate resin composition |
JPS56152863A (en) * | 1980-04-28 | 1981-11-26 | Adeka Argus Chem Co Ltd | Synthetic resin composition |
JPS596233A (en) * | 1982-06-16 | 1984-01-13 | バイエル・アクチエンゲゼルシヤフト | Stabilizer composition, use for stabilizing thermoplastic polycarbonate and stabilized thermoplastic polycarbonate |
JPS61287954A (en) * | 1985-06-14 | 1986-12-18 | Teijin Chem Ltd | Polycarbonate resin composition |
JPS6264860A (en) * | 1985-09-17 | 1987-03-23 | Teijin Chem Ltd | Molding material for optical use |
JPS62148559A (en) * | 1985-12-23 | 1987-07-02 | Mitsubishi Chem Ind Ltd | Polycarbonate resin composition for use in disc |
JPS63193921A (en) * | 1987-02-06 | 1988-08-11 | Daicel Chem Ind Ltd | Aromatic polycarbonate terpolymer |
JPH01249855A (en) * | 1988-03-31 | 1989-10-05 | Idemitsu Petrochem Co Ltd | Polycarbonate resin composition |
JPH01249856A (en) * | 1988-03-31 | 1989-10-05 | Idemitsu Petrochem Co Ltd | Polycarbonate resin composition |
-
1988
- 1988-10-05 JP JP63251430A patent/JPH0299561A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51117750A (en) * | 1975-04-10 | 1976-10-16 | Mitsubishi Chem Ind Ltd | Polycarbonate resin compositions |
JPS5476651A (en) * | 1977-11-30 | 1979-06-19 | Mitsubishi Chem Ind Ltd | Polycarbonate resin composition |
JPS56152863A (en) * | 1980-04-28 | 1981-11-26 | Adeka Argus Chem Co Ltd | Synthetic resin composition |
JPS596233A (en) * | 1982-06-16 | 1984-01-13 | バイエル・アクチエンゲゼルシヤフト | Stabilizer composition, use for stabilizing thermoplastic polycarbonate and stabilized thermoplastic polycarbonate |
JPS61287954A (en) * | 1985-06-14 | 1986-12-18 | Teijin Chem Ltd | Polycarbonate resin composition |
JPS6264860A (en) * | 1985-09-17 | 1987-03-23 | Teijin Chem Ltd | Molding material for optical use |
JPS62148559A (en) * | 1985-12-23 | 1987-07-02 | Mitsubishi Chem Ind Ltd | Polycarbonate resin composition for use in disc |
JPS63193921A (en) * | 1987-02-06 | 1988-08-11 | Daicel Chem Ind Ltd | Aromatic polycarbonate terpolymer |
JPH01249855A (en) * | 1988-03-31 | 1989-10-05 | Idemitsu Petrochem Co Ltd | Polycarbonate resin composition |
JPH01249856A (en) * | 1988-03-31 | 1989-10-05 | Idemitsu Petrochem Co Ltd | Polycarbonate resin composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH041229A (en) * | 1990-04-19 | 1992-01-06 | Daicel Chem Ind Ltd | Production of polycarbonate |
JPH041227A (en) * | 1990-04-19 | 1992-01-06 | Daicel Chem Ind Ltd | Production of polycarbonate |
JPH0415221A (en) * | 1990-05-08 | 1992-01-20 | Daicel Chem Ind Ltd | Preparation of polycarbonate |
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