JPH0298648U - - Google Patents
Info
- Publication number
- JPH0298648U JPH0298648U JP788589U JP788589U JPH0298648U JP H0298648 U JPH0298648 U JP H0298648U JP 788589 U JP788589 U JP 788589U JP 788589 U JP788589 U JP 788589U JP H0298648 U JPH0298648 U JP H0298648U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonded
- ceramic package
- heat dissipation
- dissipation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP788589U JPH0298648U (ru) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP788589U JPH0298648U (ru) | 1989-01-26 | 1989-01-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0298648U true JPH0298648U (ru) | 1990-08-06 |
Family
ID=31213285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP788589U Pending JPH0298648U (ru) | 1989-01-26 | 1989-01-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0298648U (ru) |
-
1989
- 1989-01-26 JP JP788589U patent/JPH0298648U/ja active Pending