JPH0298648U - - Google Patents
Info
- Publication number
- JPH0298648U JPH0298648U JP1989007885U JP788589U JPH0298648U JP H0298648 U JPH0298648 U JP H0298648U JP 1989007885 U JP1989007885 U JP 1989007885U JP 788589 U JP788589 U JP 788589U JP H0298648 U JPH0298648 U JP H0298648U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonded
- ceramic package
- heat dissipation
- dissipation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989007885U JPH0298648U (enExample) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989007885U JPH0298648U (enExample) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298648U true JPH0298648U (enExample) | 1990-08-06 |
Family
ID=31213285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989007885U Pending JPH0298648U (enExample) | 1989-01-26 | 1989-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298648U (enExample) |
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1989
- 1989-01-26 JP JP1989007885U patent/JPH0298648U/ja active Pending