JPH0298575A - Holding jig of chip-type electronic part and method for handling - Google Patents

Abstract

PURPOSE:To increase the number of electronic parts to be held without increasing a size of a plate by a method wherein an elastic body is attached to an inner periphery of an installing hole on the plate and a holding hole for holding a plurality of electronic parts simultaneously is formed. CONSTITUTION:A plurality of installing holes 11 in a long shape are formed in parallel on a plate 4 with a rubber 12 integrally formed by molding on the inner periphery to form holding holes 9 for elastically holding sides of electronic parts 6. Many electronic parts 6 are installed and held in the holding hole 9, wherein a diameter D2 along a widthwise side of the holding hole 9 is formed according to a distance between electrodes 6a, 6b at both ends.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention is applicable to measuring the operating characteristics of chip-type electronic components (hereinafter simply referred to as electronic components), or marking the surfaces of chip-type electronic components. The present invention relates to a holding jig for storing and holding electronic components in a predetermined position in order to carry out necessary processing such as so-called taping to hold the components on a holding tape, and a method for handling the holding jig.

(Prior Art) FIG. 5 is a partially cutaway perspective view of a conventional holding jig of this kind, and FIG. 6 is a side sectional view of the main part of the holding jig shown in FIG. As shown in these figures, the conventional holding jig 2 is composed of a rectangular plate 4 having a predetermined thickness, and 6, the plate 4 is made up of a multilayer capacitor-like structure arranged vertically and horizontally. A large number of holding holes 8 for holding electronic components 6 are arranged and formed. Each holding hole 8 includes a first opening 8a having an open shape that matches the planar outline of the electronic component 6 and a depth that matches the thickness of the electronic component 6;
A second opening 8b having an opening diameter of 1 and 1 diameter smaller than the opening diameter of the opening 8a is formed in series, and both openings 8
A stepped portion 8c on which both lower ends of the electronic component 6 are placed is formed at the boundary between the portions a and 8b.

Then, the electronic component 6 is housed inside the first opening 8a of the holding hole 8 in the direction shown by the arrow in FIG.

In the conventional holding jig 2 having such a structure, when measuring, measuring, or marking the electrical performance of the electronic component 6, the electronic component 6 is fixed in the holding hole 8. Since it is necessary to keep the electronic component 6 in place, the electronic component 6 is fixed in the first opening 8a by vacuum suction through the second opening 8b.

However, with such fixing, if there is a clearance between the inner circumferential surface of the first opening 8a and the side surface of the electronic component 6, the accuracy of positioning the electronic component 6 within the first opening 8a may be affected. Therefore, there is a problem in that it is difficult to measure and mark with high precision.

On the other hand, an interesting prior example that solves the above-mentioned problems has been devised as shown in FIG. FIG. 7 is a partially cutaway perspective view of this prior example. In addition,
In FIG. 7, parts corresponding to those in FIGS. 5 and 6 are given the same reference numerals.

The holding jig 10 shown in FIG. 7 has a rubber attachment hole 11 formed in the plate 4, and an elastic body, for example, rubber 12, is integrally fixed to the inner peripheral surface of the rubber attachment hole 11 by molding. It is configured. In this case, a holding hole 9 for holding the electronic component 6 is formed in the rubber 12 in the same manner as the holding hole 8 shown in FIG. In this case, the holding hole 9 shown in FIG. 7 is configured to have a slightly smaller diameter than the outer shape of the electronic component 6. And this holding jig 10
In this case, the electronic components 6 are held in the respective holding holes 9, and the electronic components 6 are subjected to processing such as marking.

As described above, in the holding jig 10 of the prior example shown in FIG. Since there is no clearance between them, it is easy to position the electronic component 6 with high precision, and therefore measurements, markings, etc. can be performed with high precision.

Now - (Problems to be Solved by the Invention) The interesting prior art holding jig 10 shown in FIG. Is possible.

By the way, if there is a request to increase the number of electronic components 6 held in one holding jig IO, the structure of the previous example is such that each holding hole 9 holds one electronic component 6. Therefore, it is possible to increase the number of holding holes 9 that can be formed in the plate 4 by increasing the size of the plate 4, but increasing the size of the plate 4 will only increase the material cost. Moreover, the large plate 4 structure is inconvenient in its storage and handling. Further, even if the plate 4 is simply made larger, there is a limit to the increase in the number of holding holes 9.

The present invention has been made in view of the above-mentioned problems, and it is possible to make the plate convenient for storage and handling without increasing the size of the plate, that is, without increasing the material cost, and to hold the plate. The purpose is to increase the number of electronic components.

(Means for solving the problem) In order to achieve such an object, claim (1) of the present invention
), an elastic body is provided at least on the inner peripheral surface of the mounting hole provided in the plate, and the elastic body includes:
It is characterized by having a holding hole that is large enough to accommodate a plurality of electronic components at the same time and that elastically holds the plurality of electronic components on the inner peripheral surface.

In claim (2) of the present invention, a plurality of electronic components are housed in the holding hole, and the plurality of electronic components are elastically held on the inner peripheral surface of the holding hole.

(Function) According to the above configuration, a plurality of electronic components can be tightly housed and held in the holding hole provided in the elastic body formed in the plate and provided at least on the inner peripheral surface of the saw attachment hole. As a result, the number of electronic parts to be held can be increased without increasing the size of the plate.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a partially cutaway perspective view of a holding jig for a chip-type electronic component according to an embodiment of the present invention, and FIG. FIG.

In these figures, the same reference numerals as those shown in FIGS. 5 to 7 according to the prior example indicate parts similar to or corresponding to the parts, parts, etc. indicated by the reference numerals.

In the plate 4 of the electronic component holding jig 14 in this embodiment, a plurality of elongated mounting holes 11 are formed at predetermined intervals with their long sides parallel to each other. and,
The inner peripheral surface of each mounting hole 11 is made of rubber as an elastic body. 2 are integrally formed by molding. A plurality of holding holes 9 are formed in the rubber 12 to elastically hold the sides of the electronic component 6. Dl indicates the diameter of the long side of the holding hole 9, and D2 indicates the diameter of the short side of the holding hole 9.

In the holding jig 14 of this embodiment having such a structure, a large number of electronic components 6 are housed and held in the holding hole 9 as shown in FIG.

In this case, the diameter I) of the short side of the holding hole 9 is formed in accordance with the distance between the electrodes 6a on both ends of each electronic component 6.
When a and 6a are arranged as shown in FIG. 3, it is preferable that the diameter D2 of the short side of the holding hole 9 is shorter than that shown in FIG.

In addition, in the holding jig 14 of this embodiment, one unit of holding holes 9 is formed in one row in the long direction of the plate 4, but as shown in the holding jig 16 of FIG. Of course, the holding holes 9 may be formed in two rows in the direction, or in three or more rows, and the positions where the holding holes 9 are formed are arbitrary.

Moreover, although the rubber 12 is used as the elastic body in this embodiment, it is not necessarily necessary to be rubber, and it goes without saying that other elastic materials may be used.

Further, in this embodiment, each electronic component 6 is held in close contact with each other in the holding hole 9, but it is not necessarily necessary to hold each electronic component 6 in close contact with each other, and they may be held with some distance from each other.

In the holding jig 14 of this embodiment having the structure described above, a large number of electronic components 6 can be tightly housed and held in each holding hole 9. As a result, the number of electronic parts to be held can be increased without increasing the size of the plate 4, that is, with an inexpensive structure.

(Effects of the Invention) As is clear from the above description, according to the present invention, the plate does not become large, that is, the material cost does not increase, and it is convenient to store and handle. The number of electronic components that can be held can also be increased.

[Brief explanation of drawings]

1 to 4 relate to each embodiment of the present invention, FIG. 1 is a perspective view of the embodiment, FIG. 2 is a plan view of the main part of the embodiment, and FIG. FIG. 3 is a plan view of the main part of the apparatus for explaining another usage example, and FIG. 4 is a plan view of the main part of another embodiment. 5 to 7 relate to the conventional example, FIG. 5 is a partially cutaway perspective view of the conventional example, FIG. 6 is a side sectional view of the main part of FIG. 5,
FIG. 7 is a partially cutaway perspective view of another conventional example. 4... Plate, 9 Holding hole, II/recess 4 = I hole, 12... Rubber (elastic body), 14.16... Holding jig.

Claims (2)

[Claims] (1) An elastic body is attached to at least the inner peripheral surface of the mounting hole provided in the plate, and the elastic body has a size that can accommodate a plurality of chip-type electronic components at the same time, and the plurality of chips are mounted on the inner peripheral surface of the elastic body. A holding jig for a chip type electronic component, characterized in that a holding hole is formed to elastically hold the type electronic component. (2) A plurality of chip-type electronic components are housed in the holding hole according to claim (1), and the plurality of chip-type electronic components are elastically held on the inner peripheral surface of the holding hole. How to handle holding jigs for chip-type electronic components.