JPH0297960U - - Google Patents
Info
- Publication number
- JPH0297960U JPH0297960U JP585589U JP585589U JPH0297960U JP H0297960 U JPH0297960 U JP H0297960U JP 585589 U JP585589 U JP 585589U JP 585589 U JP585589 U JP 585589U JP H0297960 U JPH0297960 U JP H0297960U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- soldering iron
- iron member
- tip
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 10
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の半田ごて装置における半田ご
て部材の正面図、第２図はその−線に沿う断
面図、第３図は従来の半田ごて装置における半田
ごて部材の正面図である。
３……半田ごて部材、３１……先端部、３１ａ
……穴、３１ｂ……貫通孔。
Fig. 1 is a front view of a soldering iron member in the soldering iron device of the present invention, Fig. 2 is a sectional view taken along the - line, and Fig. 3 is a front view of a soldering iron member in a conventional soldering iron device. It is. 3... Soldering iron member, 31... Tip part, 31a
...hole, 31b...through hole.
Claims (1)
において、前記半田ごて部材の先端部に穴を形成
し、この穴に貫通孔を形成し、この貫通孔および
前記穴に溶融半田ごてを充填して構成されている
ことを特徴とする半田ごて装置。 In a soldering iron device comprising a soldering iron member provided on the handle, a hole is formed at the tip of the soldering iron member, a through hole is formed in the hole, and a molten soldering iron is inserted into the through hole and the hole. A soldering iron device characterized in that it is filled with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP585589U JPH0297960U (en) | 1989-01-20 | 1989-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP585589U JPH0297960U (en) | 1989-01-20 | 1989-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0297960U true JPH0297960U (en) | 1990-08-03 |
Family
ID=31209592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP585589U Pending JPH0297960U (en) | 1989-01-20 | 1989-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0297960U (en) |
-
1989
- 1989-01-20 JP JP585589U patent/JPH0297960U/ja active Pending