JPH0297097A - Electromagnetic shielding material - Google Patents
Electromagnetic shielding materialInfo
- Publication number
- JPH0297097A JPH0297097A JP25058188A JP25058188A JPH0297097A JP H0297097 A JPH0297097 A JP H0297097A JP 25058188 A JP25058188 A JP 25058188A JP 25058188 A JP25058188 A JP 25058188A JP H0297097 A JPH0297097 A JP H0297097A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- copper foil
- electromagnetic shielding
- shielding material
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000011889 copper foil Substances 0.000 claims abstract description 44
- 239000010409 thin film Substances 0.000 claims abstract description 43
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 239000011135 tin Substances 0.000 claims description 16
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 7
- 150000004706 metal oxides Chemical class 0.000 abstract description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 6
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000011810 insulating material Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- -1 polyethylene terephthalate Polymers 0.000 abstract description 4
- 238000007738 vacuum evaporation Methods 0.000 abstract description 4
- 238000005299 abrasion Methods 0.000 abstract 1
- 230000032683 aging Effects 0.000 abstract 1
- 239000007767 bonding agent Substances 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 description 13
- 239000011888 foil Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 9
- 230000007613 environmental effect Effects 0.000 description 8
- 238000004804 winding Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 241000345998 Calamus manan Species 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 235000012950 rattan cane Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子回路や電線等に使用される電磁波シー
ルド材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electromagnetic shielding material used for electronic circuits, electric wires, and the like.
近年、半導体技術の進歩にともない、エレクトロニクス
機器も複雑かつ高度になってきている。In recent years, with advances in semiconductor technology, electronic devices have become more complex and sophisticated.
例えば、コンピュータ装置、コンピュータ装置を用いた
自動車搭載用機器、ワードプロセッサ、医療機器、ビデ
オレコーダやテレビジョン等の映像機器、テープレコー
ダやコンパクトディスク等の音９機器、さらに情報機器
等に使用される電子機器は目覚ましい発展を遂げ、多方
面で使用されている。しかし、これらの電子機器やこれ
らをつなぐ電線、情報網等から電磁波やノイズを発生し
たり、逆に外部より不要な電磁波を受けて機器の誤動作
を誘発するということがあった。For example, computer equipment, automotive equipment using computer equipment, word processors, medical equipment, video equipment such as video recorders and televisions, audio equipment such as tape recorders and compact discs, and electronic equipment used in information equipment, etc. Equipment has made remarkable progress and is used in a wide variety of fields. However, these electronic devices, the electric wires and information networks that connect them, generate electromagnetic waves and noise, or conversely, receive unnecessary electromagnetic waves from the outside, which can induce malfunctions in the devices.
従来、このような不要な電磁波やノイズを遮蔽するため
に、電子機器には透磁率の高い鋼板や電気伝導率の良い
鋼板が電磁波シールド材として使用されている。また、
電線には、電子機器と同様に透磁率の高い鋼板や、電気
伝導率の良い金属箔あるいは細い導体からなる電磁波シ
ールド材が使用されている。Conventionally, in order to shield such unnecessary electromagnetic waves and noise, steel plates with high magnetic permeability and steel plates with good electrical conductivity have been used as electromagnetic shielding materials in electronic devices. Also,
Like electronic devices, electric wires use electromagnetic shielding materials made of steel plates with high magnetic permeability, metal foil with good electrical conductivity, or thin conductors.
これらの電磁波シールド材の中にあっては、金属箔単体
、もしくは金属箔に高分子フィルムをラミネート加工し
たものが近年多く用いられている。Among these electromagnetic wave shielding materials, metal foil alone or metal foil laminated with a polymer film has been widely used in recent years.
これは、金属箔単体や金属箔に高分子フィルムをラミネ
ート加工したものは、電線の電磁波シールド材として使
用する場合に、テープ状にして使用することができ、細
い導体を電磁波シールド材として使用する場合に比べて
生産性がよく、また末端処理が容易でかつ電磁波シール
ド特性も良好であるためである。特に、銅箔を用いた電
磁波シールド材は、アルミニウム箔を用いたものに比べ
て重量１価格等では劣るものの、同じ箔厚で使用した場
合に、銅箔を用いたものの力が電磁波シールド特性が優
れていることが知られている。Metal foil alone or metal foil laminated with a polymer film can be used in tape form when used as electromagnetic shielding material for electric wires, and thin conductors can be used as electromagnetic shielding material. This is because the productivity is better than in the conventional case, the end treatment is easy, and the electromagnetic shielding properties are also good. In particular, electromagnetic shielding materials using copper foil are inferior to those using aluminum foil in terms of weight, price, etc., but when used with the same foil thickness, the strength of the electromagnetic shielding material using copper foil is Known to be excellent.
従来のこの種の電磁波シールド材の一例を第５図および
第７図に基づいて説明する。第５図に示す電磁波シール
ド材は、箔厚が５０μｍの銅箔５２の金属箔単体からな
り、テープ状に形成されている。そして、第６図に示す
ように、導体５６の外周を絶縁体５７で被覆した電線５
日の外周を銅箔５２で螺旋状に巻回し、絶縁体５７と銅
箔５２との間にドレイン線５９を介挿している。さらに
、電磁波シールド材の銅箔５２の外周に外装６０を施し
シールド電線として完成し、使用されている。An example of a conventional electromagnetic shielding material of this type will be explained based on FIGS. 5 and 7. The electromagnetic shielding material shown in FIG. 5 is made of a single metal foil such as a copper foil 52 having a thickness of 50 μm, and is formed into a tape shape. As shown in FIG.
The outer periphery of the coil is spirally wound with a copper foil 52, and a drain wire 59 is inserted between the insulator 57 and the copper foil 52. Further, a sheath 60 is applied to the outer periphery of the copper foil 52 of the electromagnetic wave shielding material, and a shielded electric wire is completed and used.
また、第７図に示す電磁波シールド材は、箔厚１５μｍ
の銅７ａ５２’に厚さ１２μｍのポリエチレンテレフタ
レート（ＰＥＴ）フィルム５３を接着剤５４を介してラ
ミネートされ、テープ状に形成されている。In addition, the electromagnetic shielding material shown in Fig. 7 has a foil thickness of 15 μm.
A polyethylene terephthalate (PET) film 53 having a thickness of 12 μm is laminated on the copper 7a 52' via an adhesive 54, and is formed into a tape shape.
この１を磁波シールド材も、第５図に示す銅箔５２の金
属箔単体からなる電磁波シールド材と同様に、電線の外
周に巻回され、シールド電線に使用される。This magnetic wave shielding material 1 is also wound around the outer periphery of an electric wire and used for shielding electric wires, similarly to the electromagnetic wave shielding material made of a single metal foil such as the copper foil 52 shown in FIG.
しかし、このように銅７５５２．５２’を用いた電磁波
シールド材は、経時劣化により、銅箔５２５２′の表面
が腐食し、電磁波シールド特性が劣化するという問題が
あった。However, the electromagnetic shielding material using copper 7552.52' has a problem in that the surface of the copper foil 5252' corrodes due to deterioration over time and the electromagnetic shielding properties deteriorate.
したがって、この発明の目的は、電磁波シールド特性の
経時劣化を防止することができる電磁波シールド材を提
供することである。Therefore, an object of the present invention is to provide an electromagnetic shielding material that can prevent deterioration of electromagnetic shielding characteristics over time.
この発明の電磁波シールド材は、銅箔の表面に錫、ニッ
ケルおよびクロムから選ばれた金属薄膜を形成したこと
を特徴としている。The electromagnetic shielding material of the present invention is characterized in that a metal thin film selected from tin, nickel, and chromium is formed on the surface of copper foil.
さらに、金属薄膜に同種金属の酸化物を含ませてもよい
。Furthermore, the metal thin film may contain an oxide of the same kind of metal.
この発明の構成によれば、錫、ニッケルおよびクロムか
ら選んだ金属薄膜を銅箔の表面に形成したので、銅箔表
面が耐環境性のよい金属薄膜で保護される。したがって
、銅箔を外部雰囲気から保護することができ、耐環境性
を向上することができる。According to the structure of the present invention, since a metal thin film selected from tin, nickel, and chromium is formed on the surface of the copper foil, the copper foil surface is protected by the metal thin film with good environmental resistance. Therefore, the copper foil can be protected from the external atmosphere, and environmental resistance can be improved.
さらに、金属薄膜に同種金属の酸化物を含ませると、金
属薄膜と銅箔との付着力を大きくすることができ、耐摩
耗性を高くすることができる。Furthermore, when the metal thin film contains an oxide of the same kind of metal, the adhesion between the metal thin film and the copper foil can be increased, and the wear resistance can be increased.
この発明の電磁波シールド材の第１の実施例を第１図な
いし第３図に基づいて説明する。A first embodiment of the electromagnetic shielding material of the present invention will be described with reference to FIGS. 1 to 3.
この電磁波シールド材は、この場合第１図に示すように
、錫（Ｓｎ）からなる金属薄膜１を銅箔２の一面に形成
している。銅箔２の他面には、接着剤４を介してポリエ
チレンテレフタレート（ＰＥＴ）等からなる絶縁材３が
ラミネートされている。In this case, this electromagnetic shielding material has a metal thin film 1 made of tin (Sn) formed on one surface of a copper foil 2, as shown in FIG. An insulating material 3 made of polyethylene terephthalate (PET) or the like is laminated on the other surface of the copper foil 2 via an adhesive 4.
以下、この電磁波シールド材の製造方法を説明する。銅
箔２の表面上への金属薄膜ｌの形成は、第３図に示す半
連続式巻取り式真空痕着＠Ａを用いている。この半連続
式巻取り式真空藤着機Ａは、真空槽１１を備え、この真
空槽１１が仕切り板１４により巻取り室２４と蒸着室２
５とに分けられている０巻取り室２４は、排気装置（図
示せず）により排気管１２を介し排気され、１０−１〜
１０−”Ｐａに減圧されている。また、蒸着室２５も排
気装置（図示せず）により排気管１３を介し排気され、
１０−２〜１０−’Ｐａに減圧されている。The method for manufacturing this electromagnetic shielding material will be explained below. The metal thin film 1 is formed on the surface of the copper foil 2 using a semi-continuous winding type vacuum marking @A shown in FIG. This semi-continuous winding type vacuum rattan binding machine A is equipped with a vacuum tank 11, and this vacuum tank 11 is separated by a partition plate 14 into a winding chamber 24 and a deposition chamber 2.
The 0 winding chamber 24, which is divided into 5 and 5, is exhausted through the exhaust pipe 12 by an exhaust device (not shown).
The pressure is reduced to 10-''Pa. The vapor deposition chamber 25 is also evacuated via the exhaust pipe 13 by an exhaust device (not shown).
The pressure is reduced to 10-2 to 10-'Pa.
そして、絶縁材３と銅Ｖｉ２とを接着剤４を介してラミ
ネート加工した蒸着基板１６を巻出し軸１５に巻回して
いる。この場合、銅箔２の箔厚を１５μｍとし、絶縁材
３の厚さを１２μｍとし、接着剤４の厚さを２μｍとし
ている。Then, a vapor deposition substrate 16 in which an insulating material 3 and copper Vi2 are laminated with an adhesive 4 interposed therebetween is wound around an unwinding shaft 15. In this case, the thickness of the copper foil 2 is 15 μm, the thickness of the insulating material 3 is 12 μm, and the thickness of the adhesive 4 is 2 μm.
つぎに、巻出し軸１５に巻回された蒸着基板１６は、巻
出し軸１５からフリーローラ（図示せず）。Next, the deposition substrate 16 wound around the unwinding shaft 15 is transferred from the unwinding shaft 15 to a free roller (not shown).
エキスバンドローラ（図示せず）、蒸着ドラム１７゜さ
らにフリーローラ（図示せず）、エキスバンドローラ（
図示せず）を介して巻取り軸１９に巻取られる、このと
き、蒸着ドラム１７は、矢印Ｂの方向に回転している。An extract roller (not shown), a deposition drum 17°, a free roller (not shown), an extract roller (
At this time, the deposition drum 17 is being rotated in the direction of arrow B.
また、蒸着基板１６は、絶縁材３側が蒸着ドラム１７の
表面に接し、蒸着ドラム１７と同期して走行する。In addition, the insulating material 3 side of the vapor deposition substrate 16 is in contact with the surface of the vapor deposition drum 17, and the vapor deposition substrate 16 runs in synchronization with the vapor deposition drum 17.
また、蒸着ドラム１７の下方の蒸着室２５には、蒸着材
料である錫２２を入れたルツボ２１が備えられており、
このルツボ２１を電子ビーム加熱源２３により加熱し、
錫２２を加熱、溶解しさらに蒸発させている。蒸発した
錫２２は、原子流２０となり蒸着基板１６の銅箔２の表
面に付着堆積して金属薄膜１を形成する。この場合、銅
箔２の表面に形成された錫２２の金属薄膜１は、厚さを
５００オングストロームとしている。これにより、銅箔
２の表面が耐環境性の高い金属で保護されることになる
。Further, the evaporation chamber 25 below the evaporation drum 17 is equipped with a crucible 21 containing tin 22, which is the evaporation material.
This crucible 21 is heated by an electron beam heating source 23,
Tin 22 is heated, melted, and further evaporated. The evaporated tin 22 becomes an atomic flow 20 and is deposited on the surface of the copper foil 2 of the vapor deposition substrate 16 to form the metal thin film 1. In this case, the metal thin film 1 of tin 22 formed on the surface of the copper foil 2 has a thickness of 500 angstroms. Thereby, the surface of the copper foil 2 is protected by a metal with high environmental resistance.
さらに、この蒸着基板１６の銅箔２への錫２２の原子流
２０の蒸着中に、蒸着基板１６への錫２２の原子流２０
の蒸着が終了する位置の蒸着ドラム１７の近傍に設けた
ノズル２６から酸素（０□）２７を毎分０．３１供給す
る。これにより、蒸着基板１６の銅ｗｉ２の表面に形成
された錫２２の金属薄膜１の一部が酸化し、酸化錫（Ｓ
ｎＯｘ）となる。このように、金属薄膜１の一部を同種
金属酸化物とすることにより、金属薄膜１と１ｌｉｉＩ
ＰＨとの付着力を強くすることができ、しかも金属薄膜
１の耐摩耗性の向上を図ることができる。Furthermore, during the vapor deposition of the atomic flow 20 of tin 22 onto the copper foil 2 of the vapor deposition substrate 16, the atomic flow 20 of tin 22 onto the vapor deposition substrate 16
Oxygen (0□) 27 is supplied at a rate of 0.3 per minute from a nozzle 26 provided near the vapor deposition drum 17 at the position where the vapor deposition ends. As a result, a part of the metal thin film 1 of tin 22 formed on the surface of the copper wi2 of the vapor deposition substrate 16 is oxidized, and tin oxide (S
nOx). In this way, by making a part of the metal thin film 1 the same kind of metal oxide, the metal thin film 1 and 1liiI
The adhesion to PH can be strengthened, and the wear resistance of the metal thin film 1 can also be improved.
そして、金属薄膜ｌの一部が同種金属酸化物とされてｗ
４箔２の表面に金属薄膜１が形成された蒸着基板１８が
巻取り軸１９に巻き取られ、電磁波シールド材原板とし
て完成する。Then, a part of the metal thin film l becomes a homogeneous metal oxide w
The evaporation substrate 18 on which the metal thin film 1 is formed on the surface of the 4-foil 2 is wound up on the winding shaft 19, and is completed as an electromagnetic shielding material original plate.
第２図は、上記した製造方法により得られた電磁波シー
ルド材原板を裁断し、テープ状に形成した電磁波シール
ド材５を用いたシールド電線を示している。この場合、
電磁波シールド材５は、幅５００閣の電磁波シールド材
原板を幅８ｍｍに裁断し、テープ状に形成したものを示
している。FIG. 2 shows a shielded wire using an electromagnetic shielding material 5 formed into a tape shape by cutting the electromagnetic shielding material original plate obtained by the above-described manufacturing method. in this case,
The electromagnetic shielding material 5 is a material obtained by cutting an electromagnetic shielding material original plate with a width of 500 mm into a width of 8 mm and forming it into a tape shape.
そして、この電磁波シールド材５を電線８の外周に螺旋
上に巻回し、外装置０を施してシールド電線を完成して
いる。電磁波シールド材５は、導体部分すなわち金属薄
膜１側を内側にして巻回されている。６は電線８の導体
を示し、７は絶縁体を示している。９はドレイン線を示
し、電線８の絶縁体７と電磁波シールド材５との間に介
挿されている。Then, this electromagnetic shielding material 5 is spirally wound around the outer periphery of the electric wire 8, and an outer device 0 is applied to complete the shielded electric wire. The electromagnetic shielding material 5 is wound with the conductor portion, that is, the metal thin film 1 side facing inside. 6 indicates a conductor of the electric wire 8, and 7 indicates an insulator. Reference numeral 9 indicates a drain wire, which is inserted between the insulator 7 of the electric wire 8 and the electromagnetic shielding material 5.
このように、゛この電磁波シールド材は、錫２２の金属
薄膜１を銅箔２の表面に形成したので、電磁波シールド
特性を損なうことなく、銅箔２の表面を耐環境性のよい
金属薄膜１で保護することができる。したがって、銅箔
２を外部雰囲気から保護することができ、耐環境性が向
上する。この結果、銅箔２の腐食を防止することができ
、電磁波シールド特性の経時劣化を低減することができ
る。In this way, since this electromagnetic shielding material has a metal thin film 1 of tin 22 formed on the surface of the copper foil 2, the surface of the copper foil 2 can be coated with a metal thin film 1 having good environmental resistance without impairing the electromagnetic shielding properties. can be protected by Therefore, the copper foil 2 can be protected from the external atmosphere, and environmental resistance is improved. As a result, corrosion of the copper foil 2 can be prevented, and deterioration of electromagnetic shielding characteristics over time can be reduced.
さらに、金属薄膜１の一部を同種金属酸化物としたので
、金属Ｆｉｌｌ！１と銅箔２との付着力を大きくするこ
とができ、耐摩耗性を向上することができる。この結果
、さらに耐環境性の信転性を高いものにできる。Furthermore, since a part of the metal thin film 1 is made of the same kind of metal oxide, the metal Fill! The adhesion between copper foil 1 and copper foil 2 can be increased, and wear resistance can be improved. As a result, reliability of environmental resistance can be further improved.
また、金属薄膜ｌの形成に真空蒸着手段を用いたので、
湿式による金属薄膜の形成に比べて金属薄膜１の形成を
極めて短い時間で行うことができ、製造工数の低減を行
うことができ、生産性の向上を図ることができる。In addition, since a vacuum evaporation method was used to form the metal thin film l,
Compared to forming a metal thin film by a wet method, the metal thin film 1 can be formed in an extremely short time, the number of manufacturing steps can be reduced, and productivity can be improved.
つぎに、この発明の電磁波シールド材の第２の実施例を
第４図に基づいて説明する。この電磁波シールド材は、
銅箔２の両面に、第１図に示す第１の実施例と同様に、
錫からなる金属薄膜１を形成し、さらに金属薄膜１の一
部を同種金属酸化物である酸化錫としたものである。こ
の第２の実施例の電磁波シールド材の作用、効果は、第
１の実施例の電磁波シールド材と同様である。Next, a second embodiment of the electromagnetic shielding material of the present invention will be described based on FIG. 4. This electromagnetic shielding material is
On both sides of the copper foil 2, similar to the first embodiment shown in FIG.
A metal thin film 1 made of tin is formed, and a part of the metal thin film 1 is made of tin oxide, which is a metal oxide of the same kind. The functions and effects of the electromagnetic shielding material of the second embodiment are similar to those of the electromagnetic shielding material of the first embodiment.
なお、この第１および第２の実施例においては、ｆｌ箔
２の表面に錫からなる金属薄膜１を形成したが、錫の他
にニッケル（Ｎｉ）またはクロム（Ｃｒ）を用いて、第
１および第２の実施例と同様に、金属薄膜を形成し、さ
らに金属薄膜の一部を同種金属酸化物〔酸化ニッケル（
ＮｔＯｘ）、酸化クロム（Ｃｒｕｘ））としてもよい。In the first and second embodiments, the metal thin film 1 made of tin was formed on the surface of the fl foil 2, but the first Similarly to the second embodiment, a metal thin film is formed, and a part of the metal thin film is further covered with the same metal oxide [nickel oxide (nickel oxide)].
NtOx) or chromium oxide (Crux) may be used.
また、第１の実施例の電磁波シールド材においては、電
磁波シールド材の材料の各寸法や量、また電線のシール
ド構造等の寸法を具体的に示したが、これらに限定され
ない。また、電磁波シールド材を電線８に用いてシール
ド電線としたものを説明したが、電磁波シールド材とし
て使用する対象は電線に限らない。Further, in the electromagnetic shielding material of the first embodiment, the dimensions and amounts of the materials of the electromagnetic shielding material and the dimensions of the electric wire shielding structure are specifically shown, but the present invention is not limited to these. Moreover, although the electromagnetic wave shielding material is used for the electric wire 8 to form a shielded electric wire, the object to be used as the electromagnetic wave shielding material is not limited to electric wires.
また、第１および第２の実施例において、真空蒸着によ
り金属薄膜１を銅箔２の表面に形成したが、金属薄膜の
形成方法は真空蒸着に限らない。Further, in the first and second embodiments, the metal thin film 1 was formed on the surface of the copper foil 2 by vacuum evaporation, but the method for forming the metal thin film is not limited to vacuum evaporation.
この発明の電磁波シールド材は、錫、ニッケルおよびク
ロムから選んだ金属薄膜を銅箔の表面に形成したので、
銅箔を耐環境性のよい金属薄膜で外部雰囲気から保護す
ることができる。この結果、銅箔の腐食を防止すること
ができ、電磁波シールド特性の経時劣化を低減すること
ができる。The electromagnetic shielding material of this invention has a metal thin film selected from tin, nickel, and chromium formed on the surface of copper foil.
Copper foil can be protected from the external atmosphere with a metal thin film that has good environmental resistance. As a result, corrosion of the copper foil can be prevented, and deterioration of electromagnetic shielding characteristics over time can be reduced.
さらに、金属薄膜に同種金属の酸化物を含んだ場合、金
属薄膜と銅箔との付着強度を増すことができ、しかも耐
摩耗性を高くすることができる。Furthermore, when the metal thin film contains an oxide of the same kind of metal, the adhesion strength between the metal thin film and the copper foil can be increased, and the wear resistance can be increased.
この結果、さらに耐環境性の信鎖性の高いものにできる
。As a result, it can be made to have even higher environmental resistance and reliability.
第１図はこの発明の第１の実施例の斜視図、第２図は第
１図の電磁波シールド材を用いた電線の構造を示す斜視
図、第３図は第１図の電磁波シールド材の製造方法を説
明するための半連続式巻取り式真空蒸着機の概念図、第
４図はこの発明の第２の実施例の斜視図、第５図は従来
の銅箔単体からなる電磁波シールド材の斜視図、第６図
は従来のシールド電線の構造を示す斜視図、第７図は従
来の銅箔にポリエチレンテレフタレートを被覆した電磁
波シールド材の斜視図である。
１・・・金属薄膜、２・・・銅箔
第２図
第３図
第
図
第
図
第
図
第
図1 is a perspective view of the first embodiment of the present invention, FIG. 2 is a perspective view showing the structure of an electric wire using the electromagnetic shielding material of FIG. 1, and FIG. 3 is a perspective view of the electromagnetic shielding material of FIG. 1. A conceptual diagram of a semi-continuous winding type vacuum evaporation machine for explaining the manufacturing method, Fig. 4 is a perspective view of the second embodiment of the present invention, and Fig. 5 is a conventional electromagnetic shielding material made of a single copper foil. FIG. 6 is a perspective view showing the structure of a conventional shielded wire, and FIG. 7 is a perspective view of a conventional electromagnetic shielding material in which copper foil is coated with polyethylene terephthalate. 1... Metal thin film, 2... Copper foil Figure 2 Figure 3 Figure Figure Figure Figure Figure
Claims (2)
ばれた金属薄膜を形成したことを特徴とする電磁波シー
ルド材。(1) An electromagnetic shielding material characterized by forming a thin metal film selected from tin, nickel and chromium on the surface of copper foil.
請求の範囲第（１）項記載の電磁シールド材。(2) The electromagnetic shielding material according to claim (1), wherein the metal thin film contains an oxide of the same kind of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25058188A JPH0297097A (en) | 1988-10-03 | 1988-10-03 | Electromagnetic shielding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25058188A JPH0297097A (en) | 1988-10-03 | 1988-10-03 | Electromagnetic shielding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0297097A true JPH0297097A (en) | 1990-04-09 |
Family
ID=17210019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25058188A Pending JPH0297097A (en) | 1988-10-03 | 1988-10-03 | Electromagnetic shielding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0297097A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121961A (en) * | 1997-10-13 | 1999-04-30 | Etsumi Kogaku:Kk | Electromagnetic wave shield molding |
| US5990465A (en) * | 1995-03-27 | 1999-11-23 | Omron Corporation | Electromagnetic induction-heated fluid energy conversion processing appliance |
| JP2000216591A (en) * | 1999-01-25 | 2000-08-04 | Matsushita Electric Ind Co Ltd | Shielding material |
| WO2011121801A1 (en) | 2010-03-30 | 2011-10-06 | Jx日鉱日石金属株式会社 | Composite for electromagnetic shielding |
| US9549471B2 (en) | 2010-07-15 | 2017-01-17 | Jx Nippon Mining & Metals Corporation | Copper foil composite |
| US9955574B2 (en) | 2012-01-13 | 2018-04-24 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| US9981450B2 (en) | 2012-01-13 | 2018-05-29 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| US10178816B2 (en) | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
-
1988
- 1988-10-03 JP JP25058188A patent/JPH0297097A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5990465A (en) * | 1995-03-27 | 1999-11-23 | Omron Corporation | Electromagnetic induction-heated fluid energy conversion processing appliance |
| JPH11121961A (en) * | 1997-10-13 | 1999-04-30 | Etsumi Kogaku:Kk | Electromagnetic wave shield molding |
| JP2000216591A (en) * | 1999-01-25 | 2000-08-04 | Matsushita Electric Ind Co Ltd | Shielding material |
| WO2011121801A1 (en) | 2010-03-30 | 2011-10-06 | Jx日鉱日石金属株式会社 | Composite for electromagnetic shielding |
| US9549471B2 (en) | 2010-07-15 | 2017-01-17 | Jx Nippon Mining & Metals Corporation | Copper foil composite |
| US10178816B2 (en) | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
| US9955574B2 (en) | 2012-01-13 | 2018-04-24 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| US9981450B2 (en) | 2012-01-13 | 2018-05-29 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
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