JPH0296744U - - Google Patents
Info
- Publication number
- JPH0296744U JPH0296744U JP595989U JP595989U JPH0296744U JP H0296744 U JPH0296744 U JP H0296744U JP 595989 U JP595989 U JP 595989U JP 595989 U JP595989 U JP 595989U JP H0296744 U JPH0296744 U JP H0296744U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- molding
- tie bar
- lead frame
- axial direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP595989U JPH0296744U (no) | 1989-01-21 | 1989-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP595989U JPH0296744U (no) | 1989-01-21 | 1989-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296744U true JPH0296744U (no) | 1990-08-01 |
Family
ID=31209788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP595989U Pending JPH0296744U (no) | 1989-01-21 | 1989-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296744U (no) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226539A (ja) * | 1992-02-13 | 1993-09-03 | Nec Yamagata Ltd | 半導体装置用切断金型 |
-
1989
- 1989-01-21 JP JP595989U patent/JPH0296744U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226539A (ja) * | 1992-02-13 | 1993-09-03 | Nec Yamagata Ltd | 半導体装置用切断金型 |