JPH0295568U - - Google Patents
Info
- Publication number
- JPH0295568U JPH0295568U JP228289U JP228289U JPH0295568U JP H0295568 U JPH0295568 U JP H0295568U JP 228289 U JP228289 U JP 228289U JP 228289 U JP228289 U JP 228289U JP H0295568 U JPH0295568 U JP H0295568U
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- adhesive
- dish
- piston
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP228289U JPH0295568U (enrdf_load_stackoverflow) | 1989-01-11 | 1989-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP228289U JPH0295568U (enrdf_load_stackoverflow) | 1989-01-11 | 1989-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295568U true JPH0295568U (enrdf_load_stackoverflow) | 1990-07-30 |
Family
ID=31202915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP228289U Pending JPH0295568U (enrdf_load_stackoverflow) | 1989-01-11 | 1989-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295568U (enrdf_load_stackoverflow) |
-
1989
- 1989-01-11 JP JP228289U patent/JPH0295568U/ja active Pending