JPH0295203U - - Google Patents
Info
- Publication number
- JPH0295203U JPH0295203U JP334389U JP334389U JPH0295203U JP H0295203 U JPH0295203 U JP H0295203U JP 334389 U JP334389 U JP 334389U JP 334389 U JP334389 U JP 334389U JP H0295203 U JPH0295203 U JP H0295203U
- Authority
- JP
- Japan
- Prior art keywords
- board
- contact part
- molded
- sealing resin
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP334389U JPH0295203U (cs) | 1989-01-14 | 1989-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP334389U JPH0295203U (cs) | 1989-01-14 | 1989-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295203U true JPH0295203U (cs) | 1990-07-30 |
Family
ID=31204897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP334389U Pending JPH0295203U (cs) | 1989-01-14 | 1989-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295203U (cs) |
-
1989
- 1989-01-14 JP JP334389U patent/JPH0295203U/ja active Pending
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