JPH0295165U - - Google Patents

Info

Publication number
JPH0295165U
JPH0295165U JP201089U JP201089U JPH0295165U JP H0295165 U JPH0295165 U JP H0295165U JP 201089 U JP201089 U JP 201089U JP 201089 U JP201089 U JP 201089U JP H0295165 U JPH0295165 U JP H0295165U
Authority
JP
Japan
Prior art keywords
circuit board
circuit
spacer
contact piece
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP201089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP201089U priority Critical patent/JPH0295165U/ja
Publication of JPH0295165U publication Critical patent/JPH0295165U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を組み立て前の状態
で示した斜視図、第2図は上記実施例を組み立て
た状態を示す断面図、第3図は従来例を示す斜視
図である。 1,3……積層型混成集積回路、11,31…
…回路基板、11a,31c……電極、2……プ
リント基板、2a……スルーホール、32……ス
ペーサ、32a……周壁部、33……中継用クリ
ツプ、33a,34d,34e……接触片、34
……端子付クリツプ、34b……端子部、35…
…ねじ部材。
FIG. 1 is a perspective view showing an embodiment of the present invention in an unassembled state, FIG. 2 is a sectional view showing the above embodiment in an assembled state, and FIG. 3 is a perspective view showing a conventional example. 1, 3... Stacked hybrid integrated circuit, 11, 31...
...Circuit board, 11a, 31c...Electrode, 2...Printed board, 2a...Through hole, 32...Spacer, 32a...Peripheral wall portion, 33...Relay clip, 33a, 34d, 34e...Contact piece , 34
...Clip with terminal, 34b...Terminal part, 35...
...Screw member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを搭載し且つ周辺部に多数の電極
が配置された複数の回路基板を相互に電気的接続
をとりながら積み重ね、プリント基板に実装する
積層型混成集積回路において、上記回路基板間に
配設される枠状のスペーサと、上記スペーサの周
壁部の上下面を挾み込み、回路基板の電極に対向
して装着される中継用クリツプと、一端に上記ス
ペーサの周壁部の上下面に接着される接触片を有
し、他端側に上記プリント基板のスルーホールに
挿入される端子部を設けた端子付クリツプと、上
記回路基板と上記スペーサを固定し、上記電極と
上記接触片とを圧接する固定手段とを備えたこと
を特徴とする積層型混成集積回路。
In a stacked hybrid integrated circuit in which a plurality of circuit boards each carrying a semiconductor chip and having a large number of electrodes arranged around the periphery are stacked together while electrically connected to each other and mounted on a printed circuit board, the circuit board is placed between the circuit boards. a frame-shaped spacer sandwiched between the upper and lower surfaces of the circumferential wall of the spacer, and a relay clip attached to face the electrodes of the circuit board; a clip with a terminal, which has a contact piece on the other end and a terminal portion to be inserted into a through hole of the printed circuit board, fixes the circuit board and the spacer, and presses the electrode and the contact piece together; 1. A stacked hybrid integrated circuit comprising: a fixing means for fixing the circuit;
JP201089U 1989-01-11 1989-01-11 Pending JPH0295165U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP201089U JPH0295165U (en) 1989-01-11 1989-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP201089U JPH0295165U (en) 1989-01-11 1989-01-11

Publications (1)

Publication Number Publication Date
JPH0295165U true JPH0295165U (en) 1990-07-30

Family

ID=31202405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP201089U Pending JPH0295165U (en) 1989-01-11 1989-01-11

Country Status (1)

Country Link
JP (1) JPH0295165U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0488667U (en) * 1990-12-17 1992-07-31
WO2014123023A1 (en) * 2013-02-05 2014-08-14 矢崎総業株式会社 Connecting structure between connector and cell electrodes of cell module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0488667U (en) * 1990-12-17 1992-07-31
WO2014123023A1 (en) * 2013-02-05 2014-08-14 矢崎総業株式会社 Connecting structure between connector and cell electrodes of cell module

Similar Documents

Publication Publication Date Title
JPH0295165U (en)
JPS6426896U (en)
JPS6169836U (en)
JPS61145489U (en)
JPS63121488U (en)
JPS647770U (en)
JPS61113382U (en)
JPS61173145U (en)
JPS63125365U (en)
JPS6159347U (en)
JPS60180911U (en) electric kotatsu tower
JPS63108675U (en)
JPS60160631U (en) Piezoelectric resonant components
JPS649380U (en)
JPH0415888U (en)
JPS62182579U (en)
JPH01161340U (en)
JPH0252423U (en)
JPS61197681U (en)
JPS59166386U (en) IC socket
JPH0436774U (en)
JPH0381676U (en)
JPS61156263U (en)
JPH01109173U (en)
JPS6315586U (en)