JPH0292947U - - Google Patents

Info

Publication number
JPH0292947U
JPH0292947U JP1989001063U JP106389U JPH0292947U JP H0292947 U JPH0292947 U JP H0292947U JP 1989001063 U JP1989001063 U JP 1989001063U JP 106389 U JP106389 U JP 106389U JP H0292947 U JPH0292947 U JP H0292947U
Authority
JP
Japan
Prior art keywords
light emitting
power source
pair
emitting element
emitting diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989001063U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989001063U priority Critical patent/JPH0292947U/ja
Publication of JPH0292947U publication Critical patent/JPH0292947U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/547Dispositions of multiple bond wires
    • H10W72/5473Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
JP1989001063U 1989-01-09 1989-01-09 Pending JPH0292947U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989001063U JPH0292947U (enExample) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989001063U JPH0292947U (enExample) 1989-01-09 1989-01-09

Publications (1)

Publication Number Publication Date
JPH0292947U true JPH0292947U (enExample) 1990-07-24

Family

ID=31200622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989001063U Pending JPH0292947U (enExample) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0292947U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332765A (ja) * 2000-05-22 2001-11-30 Iwasaki Electric Co Ltd Led表示灯

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332765A (ja) * 2000-05-22 2001-11-30 Iwasaki Electric Co Ltd Led表示灯

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