JPH0292021U - - Google Patents
Info
- Publication number
- JPH0292021U JPH0292021U JP1689U JP1689U JPH0292021U JP H0292021 U JPH0292021 U JP H0292021U JP 1689 U JP1689 U JP 1689U JP 1689 U JP1689 U JP 1689U JP H0292021 U JPH0292021 U JP H0292021U
- Authority
- JP
- Japan
- Prior art keywords
- cooler
- cooling medium
- path
- bypass path
- collected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
Landscapes
- Heat Treatment Of Strip Materials And Filament Materials (AREA)
Description
第１図はこの考案にかかる冷却装置の一実施例
を示す概略系統図、第２図は従来の実施例を示す
概略系統図である。
１……第１冷却器、３……第２冷却器、４……
第３冷却器、５……第４冷却器、７……第２調整
弁、８……バイパス管、９……第１調整弁、１２
……第５冷却器、１４……第１バイパス路、１５
……接続路。
FIG. 1 is a schematic system diagram showing an embodiment of the cooling device according to this invention, and FIG. 2 is a schematic system diagram showing a conventional embodiment. 1...First cooler, 3...Second cooler, 4...
Third cooler, 5... Fourth cooler, 7... Second regulating valve, 8... Bypass pipe, 9... First regulating valve, 12
...Fifth cooler, 14...First bypass path, 15
...connection path.
Claims (1)
３冷却器、第４冷却器等に送り、ここで加熱媒体
を冷却させ、加温された冷却媒体は第５冷却器に
集められ、集められた加温冷却媒体は、再度、冷
却されて第１冷却器に戻す、閉ループ形成の冷却
装置において、第１冷却器からの冷却媒体を第２
冷却器に送る送路に、第１バイパス路を備え、ま
た第１冷却器の入力から分れ、第３冷却器、第４
冷却器に直接冷却媒体を送る送路に、上記第１バ
イパス路と結ぶ接続路を有することを特徴とする
冷却装置。 The cooling medium exiting the first cooler is sent to the second cooler, third cooler, fourth cooler, etc., where the heating medium is cooled, and the heated cooling medium is collected in the fifth cooler. The heated cooling medium that has been collected is cooled again and returned to the first cooler.In the closed-loop cooling device, the cooling medium from the first cooler is transferred to the second cooler.
A first bypass path is provided in the feed path to the cooler, and it is separated from the input of the first cooler, a third cooler, and a fourth bypass path.
A cooling device characterized by having a connection path connected to the first bypass path in a feed path that directly sends a cooling medium to the cooler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1689U JPH0292021U (en) | 1989-01-05 | 1989-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1689U JPH0292021U (en) | 1989-01-05 | 1989-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292021U true JPH0292021U (en) | 1990-07-20 |
Family
ID=31198662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1689U Pending JPH0292021U (en) | 1989-01-05 | 1989-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292021U (en) |
-
1989
- 1989-01-05 JP JP1689U patent/JPH0292021U/ja active Pending
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