JPH0289880U - - Google Patents
Info
- Publication number
- JPH0289880U JPH0289880U JP16976588U JP16976588U JPH0289880U JP H0289880 U JPH0289880 U JP H0289880U JP 16976588 U JP16976588 U JP 16976588U JP 16976588 U JP16976588 U JP 16976588U JP H0289880 U JPH0289880 U JP H0289880U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base material
- circuit pattern
- insulating layer
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16976588U JPH0289880U (pt) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16976588U JPH0289880U (pt) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289880U true JPH0289880U (pt) | 1990-07-17 |
Family
ID=31460112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16976588U Pending JPH0289880U (pt) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289880U (pt) |
-
1988
- 1988-12-28 JP JP16976588U patent/JPH0289880U/ja active Pending