JPH0289847U - - Google Patents
Info
- Publication number
- JPH0289847U JPH0289847U JP17052688U JP17052688U JPH0289847U JP H0289847 U JPH0289847 U JP H0289847U JP 17052688 U JP17052688 U JP 17052688U JP 17052688 U JP17052688 U JP 17052688U JP H0289847 U JPH0289847 U JP H0289847U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- land
- base
- electronic component
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17052688U JPH0289847U (sh) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17052688U JPH0289847U (sh) | 1988-12-27 | 1988-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0289847U true JPH0289847U (sh) | 1990-07-17 |
Family
ID=31461554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17052688U Pending JPH0289847U (sh) | 1988-12-27 | 1988-12-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0289847U (sh) |
-
1988
- 1988-12-27 JP JP17052688U patent/JPH0289847U/ja active Pending