JPH0289697A - Semiconductor integrated circuit card module - Google Patents

Abstract

PURPOSE:To enhance an electrical and mechanical reliability and safety in handling by forming engaging parts on a pair of panels which clamp therebetween a non-conductive terminal support member provided with a connection terminal to an external device from the top and back surfaces thereof. CONSTITUTION:Panels 18, 19 are securely bonded on the top and back surfaces of a support member 13, and the four side edge parts of each of the panels are folded orthogonally to the surface to form engaging parts 18a, 19a. Step parts 13a, 13b are formed on the upper and lower edge parts of the front and side faces of the support member 13 to be engaged with the engaging parts 18a, 19a. A card module is injected/ejected to/from an external device-side connector in a direction of an arrow 10. The resistance force applied to the card module by an ejection action acts to the engaging parts 18a, 19a, which results in the reduction of a force applied to bonded parts of the support member 13 and the panels 18, 19 or a soldered part of a connector internal terminal 14 and a circuit substrate 15, and the like. In this manner, an electrical and mechanical reliability is enhanced, and safety is improved because the acute angle parts of the end parts of the panels are never exposed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a card module equipped with a semiconductor integrated circuit; −
In particular, the present invention relates to the structure of a semiconductor integrated circuit card module in which the front and back surfaces of the connector and the connector are sandwiched between panels.

[Prior Art] FIG. 3 is a perspective view showing a conventional semiconductor integrated circuit card module of this type.

The connector 1 has conductive cylindrical fitting electrodes 2 embedded as a plurality of terminals in a square bar-shaped non-conductive support member 1a.
Each electrode 2 is connected to an internal terminal 7 provided so as to protrude from the inner surface (back surface) of the support member 1a. The support portion II 1 a has a flat metal panel 3.4 adhesively fixed to its upper surface (front surface) and lower surface (back surface), and is sandwiched between the panels 3, 4.

An IC chip (not shown) is mounted on the circuit board 5 to the printer 1, and furthermore, between the -1- side and the F side of the printer circuit board 5 and the panel 3.4, for example, A '1'-shaped frame 6 is provided to reinforce the radix 5 and the panels 3.4. A circuit pattern (not shown) is formed on the surface (upper surface) of the board 5, and the terminals of this circuit pattern and the internal terminals 7 of the connector 1 are connected to each other.
are electrically connected to and securely fixed by soldering portion 8.

In addition, as shown in FIG. 3, the panels 3 and 4 had terminal surfaces that were simply cut surfaces.

[Problems to be Solved by the Invention] However, in the semiconductor integrated circuit card module according to the above-mentioned b''C, the connector 1 is connected to the upper and lower panels 3.
Although panel 4 is fixed with adhesive, this neck attachment force is
, 4 is considerably weaker in the direction parallel to the plane. For this reason. The ifi support of the connector 1 in this direction is mainly provided by the internal terminals 7 of the connector 1 or by the soldered printed circuit board 5. Therefore, the card module can be connected to the system (external equipment). ), that is, when the thank-you electrode 2 of the connector 1 is fitted into the rod-shaped terminal of the external device and then removed, a considerable portion of the insertion and removal force of the connector 1 is applied. The solder between the internal terminal 7 of the connector 1 and the printer circuit board 5 (1 part 8) is likely to cause an open or loose contact with the solder.In this way, in the conventional card module, it is difficult to attach or detach the card module. It has the disadvantage that it can directly cause failures.

Furthermore, since the terminal end 1T11 of the panel is simply a solid structure, the panel is likely to be caught and peeled off during handling, and there is a danger in handling.

The present invention has been made in view of such problems, and includes:
No unnecessary gradient is applied to the solder (1 part) of the connector terminal, the occurrence of open or loose contacts is avoided, electrical and mechanical reliability is improved, and
The object of the present invention is to provide a semiconductor integrated circuit card module that is also safe in handling.

[Means for Solving the Problems] A semiconductor integrated circuit device card module according to the present invention includes:
A non-conductive terminal support member provided with a terminal for connection to an external device, a panel with a single force that sandwiches this support member from the front and back sides thereof, and the support member arranged in the area between the panels. In the semiconductor integrated circuit card module comprising a terminal and a printed wiring board connected at an inner end thereof, the panel has a locking member that extends from the front surface and/or back surface of the support member to at least a part of the front surface thereof. It is characterized by having a molded part.

(Function) In the present invention, the pair of sliding panels that sandwich the terminal support member constituting the connector are in contact with the support member 7e and the back surface, and at least part of the front surface of the support member is in contact with the support member. Because the locking part that goes around is molded, when you grasp the panel and pull out the card module from the external device, there is less resistance when you pull out the connector terminal of the card module from the terminal of the external device. Even if the voltage is applied to the support member, the locking portion of the panel
Since the front surface of the support member is locked and supported, no excessive force is exerted between the connector terminal provided on the support member and the printer wiring board.

11 Embodiments Next, embodiments of the present invention will be described with reference to the attached drawings.

Figures 1(a) and 1(b) are diagrams showing a first embodiment of the present invention, and Figure 1(a) is a perspective view showing the entire configuration (Figure 1). , ) ) is part of it [new side [A
It is. The two-piece connector 11 is constructed by embedding cylindrical mating electrodes 12 made of copper in a line in the front surface of a square bar-shaped support member 13 made of non-conductive nylon resin. A pin (none of which is shown) protruding from the external connector of the external device is inserted into the insert 12, thereby electrically connecting the external coil/lid of the external device and the connector 11 of the card module. +iMechanically connected.

The fitting electrode 12 is connected to an internal terminal 14 provided on the 17th surface of the support member 13, and the internal terminal 14 is connected to the puddings 1 to 1.
A predetermined terminal of the wiring board 15 is connected to the raw material attachment part 16.Thereby, the coil lid 11 and the printed wiring board 15 are electrically connected and mechanically fixed. There is.

) on the front and back surfaces of the printed wiring board 15.

A frame 17 made of Rusnak is provided.

This frame 17 extends in the width direction and length direction of the board 150, and extends from a plurality of rod portions that intersect with each other. It has been made. Then, the support member 13 of the connector 11 is sandwiched between the stainless steel parts 18 and 9 from the front and back sides, and the printer wiring board 5 is sandwiched between the frame 17 and arranged. has been done. These panels 18 and 19 are the front and back surfaces of the support member 13,
It is adhesively fixed to the frame 17. Pre>・1 to I on the wiring board 15 in the area where the frame 17 does not exist.
A C chip 30, a dip capacitor 31, etc. are mounted.

The panels 18 and 19 have a flat plate shape, and the four side edges thereof are bent perpendicularly to the surface thereof, and locking portions 18a and 19a are formed in these portions, respectively. On the other hand, the upper and lower edges of the front and side surfaces of the support member 13 are chamfered over a slight width, and step portions 13a and 1 are provided at these portions, respectively.
3b is formed. Then, the locking parts 18a, 19a of the panel 1.8.19 are fixed to the stepped parts 13a, 13b, respectively.
It is engaged by fitting it into the holder. Further, a step portion is similarly formed in a portion of the frame 17 located at the edge of the card module, and a locking portion 18a of the panel 1819 is formed.
, 19a are engaged with this stepped portion.

After all, the locking portions provided at the four edges of panels 18 and 19]
, 8a, , 1.9a are engaged with stepped portions 13a, 13b, etc. provided at the outer edges of the support member 13 and frame 17 of the connector 11, and these members are connected to the panel 18.
, are locked in place so that they do not come out of the area sandwiched between them. Additionally, the outer surfaces of the panels 1, 8, and 19 are rounded at their corners, so that the entire card module has a sense of unity with no sharp protrusions.

Furthermore, on the edges of panels 18 and 19 the songs are
-, the panels 18, 19 have high strength against external mechanical forces such as torsion.

Next, the operation of the card module configured as described above will be explained.

This car 1 module is inserted into and removed from the external device side connector in the 10th direction of the arrow. That is, the side surface of the card module is rubbed against the inner wall of the connector of the external device, and the card module is pushed in or pulled out. In this case, when removing the card module from the connector on the external device side, the resistance force applied to the car 1-module against the removal movement (13) is mainly due to the mating electric current cover of the connector on the car 1-module side. This is the frictional force between the panel 18.1 and the pin electrode of the connector of the external device.
9, this low drag force eventually causes the adhesive between the support member 13 and the panel 1.8.19, the internal electrode 14 connected to the mating electrode 12 and the printed circuit board 1
A force is applied to the solder with 5 (Nf part 16) in the direction of arrow 10. In the case of a card module with a conventional structure, the parts that receive low resistance are approximately only the above two areas. A force perpendicular to the approach direction, which is generally considered to be the weakest for adhesive, is applied to the former joint, and a force perpendicular to the approach direction, which is generally considered to be the weakest for the adhesive, is applied to all the parts, and also to the rear soldering part 10 of A force is directly applied in the pulling direction to the !111 dimension.However, in the card module of this embodiment, the panel 18.1
9's locking part 18a, ], 9a or the step part 1 of the support member 13
3a and 13b, the resistance force applied to the card module due to the removal operation is caused by this panel 18.
The force acting on the locking portions 18a and 19a of 19 and the force acting on the adhesive portion and the soldering portion described above is reduced. In other words,
In this embodiment, there are three parts that receive the removal force (-): the adhesive part and the locking parts 13a and 19a in addition to the semi-circular part, so the force is distributed to these parts. In addition, in particular, (because the locking parts 18εL and 18b can receive force in the same direction as the removal force, the reliability of the card module, such as the closing part and the half-F11 attachment part, etc.).2. It is possible to reduce the force that would otherwise be applied to a part that is not desired to be applied to the sun.Furthermore, since 1 illegal part 18=t,]-!2) a exists,
Handling safety can be improved by preventing the panels 18, 19 from flipping over or causing a single bow during handling of the card module.

Second [Figures (a) and (b) are other implementations of the present invention]! ,='
ll is a perspective view and a partial internal view, respectively. The two-piece connector 21 is embedded in a support member 23 made of nylon resin with fittings and electrodes 22 made of helium copper alloy arranged in two stages, and soldered to a printed circuit board 25 inside the card module. These integrated connectors 21 and cutting board 25 are connected to the plastic frame 1.
127 is fitted into the substrate 25, and an IC chip or the like (not shown) is mounted on the substrate 25, and then it is sandwiched between two stainless steel panels 2829 from below -L. Panel 2
8.29 are bent at right angles at the upper and lower edges of the entire surface of the support member 23 of the connector 21, and the locking portions 2871, 29
εF is formed. Then, the front surface of the support member 2B in which the cylindrical fitting weights 22 are arranged is connected to the locking portions 28a, 2.
9A is completely covered except for the electrode 22 part. That is, the locking portion 28 ct, 2 of this panel 28.29
9 a is electric g! The hole is opened at a position that matches the hole 22, so that there is no problem in inserting the pin electrode σ) of the external connector.

In the card module of this embodiment configured as described above, the electric wire (9) 22 is connected to the top of the front surface of the support member 23. They are arranged in two rows, upper and lower, in the 1"-part and the F-half, and paya le 28.
29 (system portions 28a and 29a cover the upper half and F half of the front surface of the support member 23, respectively.

For this reason, also in this embodiment, the support portion 28a29a
Due to the presence of , the force applied to the adhesive part and +'-LB (=f part) is dispersed and reduced.

Furthermore, in this embodiment, the terminal 2 of the connector ′, 21
The entire front surface of the supporting members 23 arranged in two rows is covered with a panel 28.
29, locking portion 28. L, 29a or over), the area receiving the removal force is extremely large compared to the embodiment shown in FIG. It's over.

In terms of safety, in this embodiment, the boundary between the connector 2 and the bottom 2829 in the direction of insertion and removal of the lid is not exposed, so the safety of handling is also as high as that of the embodiment shown in Fig. 1. This is an improvement of 17 levels compared to the previous year.

[Effects of the Invention] As explained above, according to the present invention, the force generated in the connector insertion/removal direction is received as -Y by the stop portion of the panel, so that the connector support member and the panel The adhesive part between the connector internal terminal and the printed circuit board with built-in module L-L, ] f = 1 part, etc. JΣ). The force applied to the panel can be significantly reduced; therefore, the mechanical and electrical breakability can be improved, and the sharp edges of the structure 1 and the panel edges can be avoided without being exposed. In addition to improving the safety of handling, the external device side = 7' is inoculated with insects (to be skillful), and it can be used for the first and second life.

[Brief explanation of drawings]

1171(a) and (b) show the card module according to the embodiment of the present invention. 1 shows a card module according to an embodiment of the pond; FIG.
1J1 and 14, 3rd [3 indicates the conventional card module - 3rd grade, 11! It is translation A. 1.1. l, 21: Connector, 1), 13.23 Support member, 2.12, 22; Fitting electrode, 5, 1-5.25.
Print circuit board, 3.・1,18.19.213,
29; panel, 6, 17. 27 + frame, 13a, 1
3b; Step part, 18a, 19a 28a, 29a; Stop part 1 person [" Hondenki Co., Ltd.

Claims (1)

[Claims] (1) A non-conductive terminal support member provided with a terminal for connection to an external device, a pair of panels that sandwich this support member from the front and back sides, and a support member disposed in the area between the panels. In a semiconductor integrated circuit card module having a terminal of a member and a printed wiring board connected at an inner end thereof, the panel includes a surface of the support member and/or a printed wiring board connected at an inner end thereof.
Alternatively, a semiconductor integrated circuit card module characterized in that a locking portion is formed that extends from the back surface to at least a part of the front surface.