JPH0288479U - - Google Patents
Info
- Publication number
- JPH0288479U JPH0288479U JP16469088U JP16469088U JPH0288479U JP H0288479 U JPH0288479 U JP H0288479U JP 16469088 U JP16469088 U JP 16469088U JP 16469088 U JP16469088 U JP 16469088U JP H0288479 U JPH0288479 U JP H0288479U
- Authority
- JP
- Japan
- Prior art keywords
- control circuit
- supply control
- power supply
- resonant capacitor
- current power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第1図はこの考案の実施例の正面図、第2図は
第1図のコンデンサを使用した電気回路図、第3
図は従来例の正面図である。
1…エレメント、4…取付け板、12…パツケ
ージ、13…コンデンサ、15…接着剤、26…
スイツチング素子。
Figure 1 is a front view of an embodiment of this invention, Figure 2 is an electrical circuit diagram using the capacitor shown in Figure 1, and Figure 3 is an electrical circuit diagram using the capacitor shown in Figure 1.
The figure is a front view of a conventional example. DESCRIPTION OF SYMBOLS 1...Element, 4...Mounting plate, 12...Package, 13...Capacitor, 15...Adhesive, 26...
switching element.
Claims (1)
交流電力に変換制御する高周波電源制御回路にお
いて、一対の共振コンデンサのエレメントを共通
パツケージ内に平面的にコンパクトに並列配置し
て収納するとともに、前記パツケージを放熱板を
兼ねる取付け板に熱伝達率の大きい樹脂等からな
る接着剤で接着取付けしたことを特徴とする高周
波電源制御回路の共振コンデンサ構造。 In a high-frequency power supply control circuit that converts and controls direct current power to high-frequency alternating current power by the action of a switching element, a pair of resonant capacitor elements are arranged compactly in parallel on a plane in a common package, and the package is used to dissipate heat. A resonant capacitor structure for a high frequency power supply control circuit characterized by being adhesively attached to a mounting plate that also serves as a plate using an adhesive made of resin or the like having a high heat transfer coefficient.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16469088U JPH0288479U (en) | 1988-12-20 | 1988-12-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16469088U JPH0288479U (en) | 1988-12-20 | 1988-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0288479U true JPH0288479U (en) | 1990-07-12 |
Family
ID=31450521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16469088U Pending JPH0288479U (en) | 1988-12-20 | 1988-12-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0288479U (en) |
-
1988
- 1988-12-20 JP JP16469088U patent/JPH0288479U/ja active Pending
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