JPH0288270U - - Google Patents

Info

Publication number

JPH0288270U

JPH0288270U JP16788688U JP16788688U JPH0288270U JP H0288270 U JPH0288270 U JP H0288270U JP 16788688 U JP16788688 U JP 16788688U JP 16788688 U JP16788688 U JP 16788688U JP H0288270 U JPH0288270 U JP H0288270U

Authority

JP

Japan

Prior art keywords

lead wire

base material

hole

conductive foil

circuit board

Prior art date

1988-12-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
• 239000011888 foil Substances 0.000 claims description 6
• 239000000463 material Substances 0.000 claims description 4
• 239000004020 conductor Substances 0.000 claims description 3
• 238000007747 plating Methods 0.000 claims description 3
• 229910000679 solder Inorganic materials 0.000 claims description 2
• 230000000149 penetrating effect Effects 0.000 claims 1
• 239000011247 coating layer Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1

Cited By (2)