JPH0288258U - - Google Patents
Info
- Publication number
- JPH0288258U JPH0288258U JP1988166725U JP16672588U JPH0288258U JP H0288258 U JPH0288258 U JP H0288258U JP 1988166725 U JP1988166725 U JP 1988166725U JP 16672588 U JP16672588 U JP 16672588U JP H0288258 U JPH0288258 U JP H0288258U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- light
- semiconductor device
- optically coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166725U JPH085571Y2 (ja) | 1988-12-24 | 1988-12-24 | 光結合半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166725U JPH085571Y2 (ja) | 1988-12-24 | 1988-12-24 | 光結合半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0288258U true JPH0288258U (US07321065-20080122-C00020.png) | 1990-07-12 |
| JPH085571Y2 JPH085571Y2 (ja) | 1996-02-14 |
Family
ID=31454364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988166725U Expired - Lifetime JPH085571Y2 (ja) | 1988-12-24 | 1988-12-24 | 光結合半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085571Y2 (US07321065-20080122-C00020.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63170976U (US07321065-20080122-C00020.png) * | 1987-04-27 | 1988-11-07 | ||
| JPH0245659U (US07321065-20080122-C00020.png) * | 1988-09-22 | 1990-03-29 |
-
1988
- 1988-12-24 JP JP1988166725U patent/JPH085571Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63170976U (US07321065-20080122-C00020.png) * | 1987-04-27 | 1988-11-07 | ||
| JPH0245659U (US07321065-20080122-C00020.png) * | 1988-09-22 | 1990-03-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085571Y2 (ja) | 1996-02-14 |
