JPH0286177U - - Google Patents
Info
- Publication number
- JPH0286177U JPH0286177U JP16707088U JP16707088U JPH0286177U JP H0286177 U JPH0286177 U JP H0286177U JP 16707088 U JP16707088 U JP 16707088U JP 16707088 U JP16707088 U JP 16707088U JP H0286177 U JPH0286177 U JP H0286177U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring pattern
- flexible circuit
- metal plate
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16707088U JPH0286177U (ko) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16707088U JPH0286177U (ko) | 1988-12-23 | 1988-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286177U true JPH0286177U (ko) | 1990-07-09 |
Family
ID=31455033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16707088U Pending JPH0286177U (ko) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286177U (ko) |
-
1988
- 1988-12-23 JP JP16707088U patent/JPH0286177U/ja active Pending