JPH0286164U - - Google Patents
Info
- Publication number
- JPH0286164U JPH0286164U JP16552688U JP16552688U JPH0286164U JP H0286164 U JPH0286164 U JP H0286164U JP 16552688 U JP16552688 U JP 16552688U JP 16552688 U JP16552688 U JP 16552688U JP H0286164 U JPH0286164 U JP H0286164U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- square hole
- copper foil
- lsi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16552688U JPH0286164U (fr) | 1988-12-20 | 1988-12-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16552688U JPH0286164U (fr) | 1988-12-20 | 1988-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0286164U true JPH0286164U (fr) | 1990-07-09 |
Family
ID=31452092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16552688U Pending JPH0286164U (fr) | 1988-12-20 | 1988-12-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0286164U (fr) |
-
1988
- 1988-12-20 JP JP16552688U patent/JPH0286164U/ja active Pending