JPH0286122U - - Google Patents
Info
- Publication number
- JPH0286122U JPH0286122U JP16614088U JP16614088U JPH0286122U JP H0286122 U JPH0286122 U JP H0286122U JP 16614088 U JP16614088 U JP 16614088U JP 16614088 U JP16614088 U JP 16614088U JP H0286122 U JPH0286122 U JP H0286122U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- printed wiring
- package
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16614088U JPH0286122U (fr) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16614088U JPH0286122U (fr) | 1988-12-22 | 1988-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286122U true JPH0286122U (fr) | 1990-07-09 |
Family
ID=31453261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16614088U Pending JPH0286122U (fr) | 1988-12-22 | 1988-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286122U (fr) |
-
1988
- 1988-12-22 JP JP16614088U patent/JPH0286122U/ja active Pending