JPH0285683A - Integral-type container for cold and heat insulation by thermoelectric refrigeration element - Google Patents
Integral-type container for cold and heat insulation by thermoelectric refrigeration elementInfo
- Publication number
- JPH0285683A JPH0285683A JP23357088A JP23357088A JPH0285683A JP H0285683 A JPH0285683 A JP H0285683A JP 23357088 A JP23357088 A JP 23357088A JP 23357088 A JP23357088 A JP 23357088A JP H0285683 A JPH0285683 A JP H0285683A
- Authority
- JP
- Japan
- Prior art keywords
- container
- heat
- cold
- containers
- cooling element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 title abstract description 4
- 238000005057 refrigeration Methods 0.000 title abstract 4
- 238000001816 cooling Methods 0.000 claims description 33
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 230000005679 Peltier effect Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000011810 insulating material Substances 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はベルチェ効果を有する電子冷却素子を用いて冷
却と加熱とを同時に行う、少なくとも二個以上の部屋を
併有する一体型容器に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an integrated container having at least two or more chambers, which simultaneously performs cooling and heating using an electronic cooling element having a Bertier effect.
従来のベルチェ効果を有する電子冷却素子を用いた技術
は、特殊な冷却装置、または、恒温槽等一個の容器また
は部材の冷却や温度：ＪＲＴＳを行うために用いられて
いる。従って、電子冷却素子が冷却用に使用される場合
は高温面の熱はファンによる空冷、または冷却水によっ
て除去する方法が採用されており、また、温度１４節を
行うためには直Ｆｉｔ ８ｆｔ流の方向を替える事によ
って冷却と加熱とを切り替え温度を調節している。Conventional technology using an electronic cooling element having the Bertier effect is used in a special cooling device or for cooling or temperature JRTS of a single container or member such as a constant temperature bath. Therefore, when an electronic cooling element is used for cooling, the heat from the high-temperature surface is removed by air cooling with a fan or cooling water. By changing the direction of the , the temperature is adjusted by switching between cooling and heating.
その為、同時に発生する冷熱・温熱のうちの何れか片方
の熱源のエネルギーは利用されることなく捨てられてお
り、全体的に電力の利用効率を著しく低下させている。Therefore, the energy of either the heat source of the cold or hot heat generated at the same time is not used and is wasted, resulting in a significant reduction in the overall power usage efficiency.
本発明はこのような事情に鑑みて提案されたもので、電
子冷却素子の両面に発生する低温・高温の両エネルギー
を有効に利用し、効率良く、冷熱源と温熱源とを同時に
使用出来る冷熱・温熱併有一体型容器を提供する事を目
的とする。The present invention was proposed in view of the above circumstances, and is a cooling system that effectively uses both low and high temperature energy generated on both sides of an electronic cooling element, and efficiently uses both a cold source and a hot source at the same time.・The purpose is to provide an integrated container with both heat and heat.
その為に本発明は、電子冷却素子の両面に直接的、また
は熱的良導体を介して間接的に二個の容器に連設せしめ
、しかも、近接している低温、高温の内容器相互間の熱
伝導を最小限に抑えると共に、低温、高温両容器の熱放
散を減少させる為にこれらの部材を収納容器におさめ、
該収納容器と冷熱・温熱容器２個空間を完全に密閉し、
この密閉空間を高真空にするか、あるいは、断熱材を充
填する等の方法により断熱を行う手段を備えた事を特徴
とする。For this purpose, the present invention connects two containers to both sides of a thermoelectric cooling element directly or indirectly through a thermally conductive material, and furthermore, it is possible to connect two containers that are close to each other at low temperature and high temperature. In order to minimize heat conduction and reduce heat dissipation in both low and high temperature containers, these components are housed in storage containers.
Completely seal the space between the storage container and the two cold/thermal containers.
The device is characterized by having means for insulating the closed space by making it a high vacuum or filling it with a heat insulating material.
このような構成により、一個の直流電源によって、二個
以上の容器内を同時に低温室と高温室とに保持するする
事ができる冷熱・温熱併有一体型容器を得る事ができる
。With such a configuration, it is possible to obtain a combined cold/heat container that can simultaneously maintain two or more containers in a low temperature room and a high temperature room using a single DC power source.
実施例
本発明の一実施例を図面について説明すると、第１図は
ベルチェ効果を有するＰ型・Ｎ型熱伝半導体を用いた電
子冷却素子とその電源、冷熱容器、温熱容器および収納
容器等から成る一体型容器の配列図を示ず６第２図は矩
形凹面を有する冷・温熱容器２個を矩形断面の収納容器
に納めた場合の例を示す、第３図は半円形断面の冷・温
熱容器２個を円形断面の収納容器に納めた例、また、第
４図は円形断面の冷・温容器２個を円形断面を有する収
納容器に納めた例を示す、これら第１図、第２図、第３
図および第４図において、冷熱容器１と温熱容器２の間
には電子冷却素子３が設置されているが、該電子冷却素
子３は冷熱容器１及び温熱容器２と直接接触するか、あ
るいは、冷熱容器１および温熱容器２の形状によっては
熱の良導体・例えば、銅、アルミニウム等からなる７′
タツチメント４が取付けられている。Embodiment To explain an embodiment of the present invention with reference to the drawings, FIG. 1 shows a thermoelectric cooling element using P-type/N-type heat conductive semiconductors having a Bertier effect, its power supply, a cold/heat container, a heat container, a storage container, etc. Figure 2 shows an example in which two cold/thermal containers with rectangular concave surfaces are housed in a storage container with a rectangular cross section, and Figure 3 shows an example of a case where two cold/thermal containers with a rectangular concave surface are housed in a storage container with a semicircular cross section. Figure 4 shows an example in which two heating containers are housed in a storage container with a circular cross section, and Figure 4 shows an example in which two cold and hot containers with a circular cross section are housed in a storage container with a circular cross section. Figure 2, 3rd
In the figures and FIG. 4, an electronic cooling element 3 is installed between the cold container 1 and the heating container 2, but the electronic cooling element 3 is in direct contact with the cold container 1 and the heating container 2, or Depending on the shape of the cold/hot container 1 and the hot/hot container 2, it may be made of a good thermal conductor such as copper or aluminum.
Tatchment 4 is attached.
また、これらの部材は収納容器５の中に納められており
、かつ、完全に密閉した構造になってし）る、該密閉し
た空間内は高真空に維持するか、あるいは、断熱材を充
填する事により冷熱容器１および温熱容器２からの熱放
散を防止している。該容器において電子冷却素子３に直
流電流を通電する）１【により１片側の冷熱容器１の内
部は温度が低下して低温となり、他方の温熱容器２の内
部は温度が上昇して高温容器となるが、収納容器５と低
温容器１および高温容器２との間の密閉空間は断熱され
ているため、熱的に損失の少ない容器となっている。In addition, these components are housed in the storage container 5, which has a completely sealed structure.The sealed space must be maintained at a high vacuum or filled with a heat insulating material. By doing so, heat dissipation from the cold/hot container 1 and the hot/hot container 2 is prevented. DC current is applied to the electronic cooling element 3 in the container) 1 [1] The temperature inside the cooling container 1 on one side decreases and becomes low temperature, and the temperature inside the heating container 2 on the other side rises and becomes a high temperature container. However, since the sealed space between the storage container 5 and the low-temperature container 1 and high-temperature container 2 is insulated, the container has little thermal loss.
本発明によれば、直流電源を電源とする電子冷却素子を
用いてエネルギー変換を行い、熱的エネルギーとして取
り出す場合、同時に低温源と高温源とを有効活用して、
低温室と高温室との内容器の温度維持を行う事が可能で
、熱効率の高い電子冷却素子を用いた冷熱・温熱併有一
体型容器を得る事ができる。According to the present invention, when converting energy using a thermoelectric cooling element powered by a DC power source and extracting it as thermal energy, a low temperature source and a high temperature source are effectively utilized at the same time.
It is possible to maintain the temperature of the inner container in the low-temperature chamber and the high-temperature chamber, and it is possible to obtain a combined cooling/heating container using a highly thermally efficient electronic cooling element.
第１図は本発明を構成するベルチェ効果を有するＰ型・
Ｎ型熱伝半導体を用いた電子冷却素子と冷熱容器、温熱
容器、収納容器等の配列図を示す。
第２図は矩形断面を有する冷熱容器と温熱容器を矩形断
面形の収納容器に納めたものである。第３図は半円形断
面を有する冷熱容器と温熱容器２個を円形断面を有する
収納容器に納めた例を示す。
さらに、第４図は円形断面を有する冷熱容器と温熱容器
２個を円形断面を有する収納容器に納めた図を示す。
ｌ・冷熱容器、２・・・温熱容器、３・・・電子冷却素
子、４・・・アタッチメント、５・・・収納容器、６・
・・直流電源、７・・・−・・断熱空間。Figure 1 shows the P-type device with the Bertier effect that constitutes the present invention.
An arrangement diagram of an electronic cooling element using an N-type heat conductive semiconductor, a cooling container, a heating container, a storage container, etc. is shown. FIG. 2 shows a cooling and heating container having a rectangular cross section and a heating container housed in a storage container having a rectangular cross section. FIG. 3 shows an example in which two heating and cooling containers each having a semicircular cross section are housed in a storage container having a circular cross section. Furthermore, FIG. 4 shows a storage container having a circular cross section, in which two heating and cooling containers each having a circular cross section are housed. l.Cold/thermal container, 2.. Thermal container, 3..Electronic cooling element, 4..Attachment, 5..Storage container, 6..
...DC power supply, 7...--insulation space.
Claims (1)
体を電気的に直列に接続し、且つ、熱的にはこれら材料
を並列に伝熱するように配列し、同種の接点を同一面に
整列せしめた上、両接点面にセラミックス製の絶縁体を
接着する事により、物理学的ペルチェ効果を有する電子
冷却素子を製造し、この電子冷却索子を二個の容器の間
に配設し、且つ、これらを直接接触、または熱的良導体
を介して連接せしめ、このペルチェ電子冷却素子に直流
電流を通電する事によって、二個の容器を同時に片方は
冷却現象を、また、他方には加熱現象を発生させる事を
可能にし、さらに、これらのペルチェ電子冷却素子と二
個の冷却・加熱用容器とを連接した部材を別の収納容器
内に設置した上で、冷却・加熱用両容器の外部と収納容
器内部との間の空間を完全に密閉した構造とし、該密閉
した空間内は高真空、または、断熱材充填等によって断
熱を行い、一個の直流電源から電子冷却素子に通電して
、二個の容器を同時に冷熱容器、温熱容器として効率良
く作動させる事を特徴とする電子冷却素子を用いた冷熱
・温熱併有一体型容器。1. Two different metals or P-type and N-type thermoelectric semiconductors are electrically connected in series, thermally arranged in parallel so that heat is transferred, and the same type of contacts are connected in the same way. By arranging them on the same plane and bonding ceramic insulators to both contact surfaces, an electronic cooling element with a physical Peltier effect was manufactured, and this electronic cooling element was placed between two containers. By directly contacting them or connecting them through a good thermal conductor, and passing a direct current through the Peltier electronic cooling element, the two containers can be simultaneously cooled on one side and on the other. It is possible to generate a heating phenomenon, and furthermore, by installing a member that connects these Peltier electronic cooling elements and two cooling/heating containers in a separate storage container, it is possible to create a heating phenomenon. The space between the outside of the container and the inside of the storage container is completely sealed, and the sealed space is insulated by high vacuum or filled with insulation material, and electricity is supplied to the electronic cooling element from a single DC power source. An integrated cold/heat container using an electronic cooling element, which allows two containers to operate efficiently as a cold/heat container and a heat container at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23357088A JPH0285683A (en) | 1988-09-20 | 1988-09-20 | Integral-type container for cold and heat insulation by thermoelectric refrigeration element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23357088A JPH0285683A (en) | 1988-09-20 | 1988-09-20 | Integral-type container for cold and heat insulation by thermoelectric refrigeration element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0285683A true JPH0285683A (en) | 1990-03-27 |
Family
ID=16957144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23357088A Pending JPH0285683A (en) | 1988-09-20 | 1988-09-20 | Integral-type container for cold and heat insulation by thermoelectric refrigeration element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0285683A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6412287B1 (en) * | 2000-12-21 | 2002-07-02 | Delphi Technologies, Inc. | Heated/cooled console storage unit and method |
-
1988
- 1988-09-20 JP JP23357088A patent/JPH0285683A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6412287B1 (en) * | 2000-12-21 | 2002-07-02 | Delphi Technologies, Inc. | Heated/cooled console storage unit and method |
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