JPH0282541U - - Google Patents

Info

Publication number
JPH0282541U
JPH0282541U JP1988162538U JP16253888U JPH0282541U JP H0282541 U JPH0282541 U JP H0282541U JP 1988162538 U JP1988162538 U JP 1988162538U JP 16253888 U JP16253888 U JP 16253888U JP H0282541 U JPH0282541 U JP H0282541U
Authority
JP
Japan
Prior art keywords
bonding wire
light
led
printer head
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988162538U
Other languages
Japanese (ja)
Other versions
JPH0751320Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988162538U priority Critical patent/JPH0751320Y2/en
Publication of JPH0282541U publication Critical patent/JPH0282541U/ja
Application granted granted Critical
Publication of JPH0751320Y2 publication Critical patent/JPH0751320Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のプリンタヘツドのＬＥＤチツプ
近傍の発光状況を示す説明図、第２図は本考案に
係るプリンタヘツドのＬＥＤチツプ近傍の発光状
況を示す説明図、第３図はＬＥＤプリンタヘツド
の具体的構成を示す説明図である。 １……ＬＥＤ、１ａ……発光領域、３……ボン
デイングワイヤ、４……セラミツク基板、５……
セルフオツクレンズ、６……遮光体又は光吸収体
、１０……感光体ドラム、２０……出力光、２１
……拡散光、２１ａ……反射散乱光。 FIG. 1 is an explanatory diagram showing the light emitting situation near the LED chip of a conventional printer head, FIG. 2 is an explanatory diagram showing the light emitting situation near the LED chip of the printer head according to the present invention, and FIG. FIG. 2 is an explanatory diagram showing a specific configuration. 1...LED, 1a...light emitting region, 3...bonding wire, 4...ceramic substrate, 5...
Self-cleaning lens, 6... Light shielding body or light absorber, 10... Photosensitive drum, 20... Output light, 21
...Diffused light, 21a...Reflected scattered light.

Claims (1)

【実用新案登録請求の範囲】 (1) ＬＥＤの発光領域とボンデイングワイヤと
の間に、ボンデイングワイヤに向う光を遮り得る
遮光体を設けてなるＬＥＤプリンタヘツド。 (2) ＬＥＤの発光領域とボンデイングワイヤと
の間に、ボンデイングワイヤに向う光を吸収し得
る光吸収体を設けてなるＬＥＤプリンタヘツド。[Claims for Utility Model Registration] (1) An LED printer head comprising a light shielding body that can block light directed toward the bonding wire between the LED light emitting area and the bonding wire. (2) An LED printer head comprising a light absorber capable of absorbing light directed toward the bonding wire between the LED light emitting region and the bonding wire.
JP1988162538U 1988-12-15 1988-12-15 LED printer head Expired - Lifetime JPH0751320Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988162538U JPH0751320Y2 (en) 1988-12-15 1988-12-15 LED printer head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988162538U JPH0751320Y2 (en) 1988-12-15 1988-12-15 LED printer head

Publications (2)

Publication Number Publication Date
JPH0282541U true JPH0282541U (en) 1990-06-26
JPH0751320Y2 JPH0751320Y2 (en) 1995-11-22

Family

ID=31446455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988162538U Expired - Lifetime JPH0751320Y2 (en) 1988-12-15 1988-12-15 LED printer head

Country Status (1)

Country Link
JP (1) JPH0751320Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007113947A1 (en) * 2006-04-04 2007-10-11 Fuji Xerox Co., Ltd. Light emitting element array with micro-lens and optical writing head
EP1850389A2 (en) * 2006-04-26 2007-10-31 Oki Data Corporation Composite semiconductor light emitting device, LED head that employs the composite semiconcuctor device, and image forming apparatus that employs the LED head

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59196272A (en) * 1983-04-22 1984-11-07 Ricoh Co Ltd Light writing head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59196272A (en) * 1983-04-22 1984-11-07 Ricoh Co Ltd Light writing head

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007113947A1 (en) * 2006-04-04 2007-10-11 Fuji Xerox Co., Ltd. Light emitting element array with micro-lens and optical writing head
JP5157896B2 (en) * 2006-04-04 2013-03-06 富士ゼロックス株式会社 Light emitting element array with microlens and optical writing head
EP1850389A2 (en) * 2006-04-26 2007-10-31 Oki Data Corporation Composite semiconductor light emitting device, LED head that employs the composite semiconcuctor device, and image forming apparatus that employs the LED head
EP1850389A3 (en) * 2006-04-26 2010-11-24 Oki Data Corporation Composite semiconductor light emitting device, LED head that employs the composite semiconcuctor device, and image forming apparatus that employs the LED head
US7999275B2 (en) 2006-04-26 2011-08-16 Oki Data Corporation Composite semiconductor device, LED head that employs the composite semiconductor device, and image forming apparatus that employs the LED head

Also Published As

Publication number Publication date
JPH0751320Y2 (en) 1995-11-22

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