JPH0282511U - - Google Patents
Info
- Publication number
- JPH0282511U JPH0282511U JP16206088U JP16206088U JPH0282511U JP H0282511 U JPH0282511 U JP H0282511U JP 16206088 U JP16206088 U JP 16206088U JP 16206088 U JP16206088 U JP 16206088U JP H0282511 U JPH0282511 U JP H0282511U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- injection molding
- mold
- molding device
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001746 injection moulding Methods 0.000 claims description 11
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第1図はこの考案に係る射出成形装置を示す要
部断面図、第2図乃至第5図はこの考案に係る射
出成形装置を用いた射出成形方法を説明するため
の説明図、第6図はこの考案に係る射出成形装置
の第2実施例を示す要部断面図、第7図は第6図
における射出成形装置の作用を説明するための説
明図、第8図はこの考案にかかる射出成形装置の
第3実施例を示す要部断面図、第9図は従来の射
出成形装置の示す要部断面図、第10図は従来の
射出成形装置によつて形成された成形品を示す斜
視図、第11図は従来の射出成形装置によつて形
成した成形品にウエルドが発生するときの状態を
説明するための説明図である。
4……キヤビテイ、1,6……(固定)金型、
2……(可動)金型、3……ピン、6a……スラ
イド孔、5……受け部材。
FIG. 1 is a cross-sectional view of a main part showing an injection molding apparatus according to this invention, FIGS. 2 to 5 are explanatory diagrams for explaining an injection molding method using the injection molding apparatus according to this invention, and FIG. 6 7 is an explanatory diagram for explaining the operation of the injection molding device in FIG. 6, and FIG. FIG. 9 is a cross-sectional view of a main part showing a third embodiment of a molding device, FIG. 9 is a cross-sectional view of a main part of a conventional injection molding device, and FIG. 10 is a perspective view showing a molded product formed by a conventional injection molding device. 11A and 11B are explanatory diagrams for explaining a state in which a weld occurs in a molded product formed by a conventional injection molding apparatus. 4...Cavity, 1,6...(Fixed) mold,
2... (movable) mold, 3... pin, 6a... slide hole, 5... receiving member.
Claims (1)
される一対の金型と、前記キヤビテイ内に突出し
成形品に穴部を形成するピンとを備えた射出成形
装置において、 前記キヤビテイ内からピンを一時待避させるた
めそのピンを金型に対してスライド自在に取付け
たことを特徴とする射出成形装置。 2 ピンが取付けられていない方の金型のピンと
対向する部位にそのピン先端部が挿入するスライ
ド孔を設けると共に、 そのスライド孔に進退可能に、かつ前進方向に
弾性力が付勢された受け部材を嵌挿した ことを特徴とする請求項1に記載の射出成形装
置。 3 ピンの先端面縁部が熱可塑性樹脂を押し切り
易いように鋭利に形成されたことを特徴とする請
求項1又は2に記載の射出成形装置。[Claims for Utility Model Registration] 1. An injection molding device comprising a pair of molds that form a cavity inside the molds when they are pressed together, and a pin that protrudes into the cavity and forms a hole in the molded product, comprising: An injection molding device characterized in that a pin is slidably attached to a mold in order to temporarily retract the pin from inside the mold. 2. A slide hole into which the tip of the pin is inserted is provided in the part facing the pin of the mold on which the pin is not attached, and a receiver is provided that can move forward and backward into the slide hole and is biased with elastic force in the forward direction. The injection molding apparatus according to claim 1, further comprising a member inserted therein. 3. The injection molding device according to claim 1 or 2, wherein the edge of the tip end of the pin is formed sharply so as to easily cut through the thermoplastic resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16206088U JPH0282511U (en) | 1988-12-14 | 1988-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16206088U JPH0282511U (en) | 1988-12-14 | 1988-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0282511U true JPH0282511U (en) | 1990-06-26 |
Family
ID=31445548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16206088U Pending JPH0282511U (en) | 1988-12-14 | 1988-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0282511U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263914A (en) * | 1991-02-18 | 1992-09-18 | Toyoda Gosei Co Ltd | Molding method of mudguard |
WO1996026063A1 (en) * | 1995-02-10 | 1996-08-29 | Polyplastics Co., Ltd. | Method for injection molding a thin housing for a portable telephone |
JP2008006189A (en) * | 2006-06-30 | 2008-01-17 | Aiwa Raito:Kk | Molding method and molding die of game board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63111023A (en) * | 1986-10-30 | 1988-05-16 | Copal Co Ltd | Mold for plastic |
-
1988
- 1988-12-14 JP JP16206088U patent/JPH0282511U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63111023A (en) * | 1986-10-30 | 1988-05-16 | Copal Co Ltd | Mold for plastic |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263914A (en) * | 1991-02-18 | 1992-09-18 | Toyoda Gosei Co Ltd | Molding method of mudguard |
WO1996026063A1 (en) * | 1995-02-10 | 1996-08-29 | Polyplastics Co., Ltd. | Method for injection molding a thin housing for a portable telephone |
JP2008006189A (en) * | 2006-06-30 | 2008-01-17 | Aiwa Raito:Kk | Molding method and molding die of game board |
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