JPH028173U - - Google Patents
Info
- Publication number
- JPH028173U JPH028173U JP8586988U JP8586988U JPH028173U JP H028173 U JPH028173 U JP H028173U JP 8586988 U JP8586988 U JP 8586988U JP 8586988 U JP8586988 U JP 8586988U JP H028173 U JPH028173 U JP H028173U
- Authority
- JP
- Japan
- Prior art keywords
- jumper wire
- hole
- component mounting
- wire connection
- mounting pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8586988U JPH028173U (ru) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8586988U JPH028173U (ru) | 1988-06-30 | 1988-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH028173U true JPH028173U (ru) | 1990-01-19 |
Family
ID=31310522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8586988U Pending JPH028173U (ru) | 1988-06-30 | 1988-06-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH028173U (ru) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021174975A (ja) * | 2020-04-30 | 2021-11-01 | Necプラットフォームズ株式会社 | プリント基板及びプリント基板の製造方法 |
-
1988
- 1988-06-30 JP JP8586988U patent/JPH028173U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021174975A (ja) * | 2020-04-30 | 2021-11-01 | Necプラットフォームズ株式会社 | プリント基板及びプリント基板の製造方法 |