JPH028145U - - Google Patents
Info
- Publication number
- JPH028145U JPH028145U JP1988086132U JP8613288U JPH028145U JP H028145 U JPH028145 U JP H028145U JP 1988086132 U JP1988086132 U JP 1988086132U JP 8613288 U JP8613288 U JP 8613288U JP H028145 U JPH028145 U JP H028145U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- sealing
- hybrid integrated
- circuit
- constituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 238000010897 surface acoustic wave method Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086132U JPH028145U (US06582424-20030624-M00016.png) | 1988-06-29 | 1988-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086132U JPH028145U (US06582424-20030624-M00016.png) | 1988-06-29 | 1988-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028145U true JPH028145U (US06582424-20030624-M00016.png) | 1990-01-19 |
Family
ID=31310777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988086132U Pending JPH028145U (US06582424-20030624-M00016.png) | 1988-06-29 | 1988-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028145U (US06582424-20030624-M00016.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0779708A2 (en) | 1995-12-14 | 1997-06-18 | Murata Manufacturing Co., Ltd. | Surface acoustic wave apparatus |
-
1988
- 1988-06-29 JP JP1988086132U patent/JPH028145U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0779708A2 (en) | 1995-12-14 | 1997-06-18 | Murata Manufacturing Co., Ltd. | Surface acoustic wave apparatus |
