JPH0281044U - - Google Patents
Info
- Publication number
- JPH0281044U JPH0281044U JP16158988U JP16158988U JPH0281044U JP H0281044 U JPH0281044 U JP H0281044U JP 16158988 U JP16158988 U JP 16158988U JP 16158988 U JP16158988 U JP 16158988U JP H0281044 U JPH0281044 U JP H0281044U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor element
- hybrid integrated
- circuit device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16158988U JPH0281044U (zh) | 1988-12-12 | 1988-12-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16158988U JPH0281044U (zh) | 1988-12-12 | 1988-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0281044U true JPH0281044U (zh) | 1990-06-22 |
Family
ID=31444662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16158988U Pending JPH0281044U (zh) | 1988-12-12 | 1988-12-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0281044U (zh) |
-
1988
- 1988-12-12 JP JP16158988U patent/JPH0281044U/ja active Pending